CN106931356A - 光照射装置 - Google Patents
光照射装置 Download PDFInfo
- Publication number
- CN106931356A CN106931356A CN201611196579.9A CN201611196579A CN106931356A CN 106931356 A CN106931356 A CN 106931356A CN 201611196579 A CN201611196579 A CN 201611196579A CN 106931356 A CN106931356 A CN 106931356A
- Authority
- CN
- China
- Prior art keywords
- light
- air
- region
- irradiation device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000005057 refrigeration Methods 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 230000001737 promoting effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 230000005855 radiation Effects 0.000 description 11
- 239000000498 cooling water Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000002939 deleterious effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010019909 Hernia Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/65—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air the gas flowing in a closed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Quality & Reliability (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
Abstract
本发明提供一种具有可有效地冷却配置于发光二极管LED光通过的光通过区域内的部件的构造的光照射装置。该光照射装置具备:基板;配置于基板表面的多个发光元件;配置于基板的背面以冷却基板以及多个发光元件的制冷机构;以包围多个发光元件的光通过的光通过区域的方式配置的内壁;收纳基板、多个发光元件、制冷机构以及内壁,并且与内壁之间产生空间的壳体;将光通过区域的空气导入基板背面的空气流入口;通过基板背面,连结空气流入口与空间的流路;和为使空间内的空气可从光通过区域流出而设置的循环口,其中,制冷机构对导入空气流入口的空气进行制冷,空气在光通过区域与空间之间对流。
Description
技术领域
本发明涉及一种作为光源具备发光二极管LED(Light Emitting Diode)等发光元件的光照射装置,尤其涉及一种在壳体内具有对发光元件散发的热进行散热的冷却机构的光照射装置。
背景技术
以往,作为单张纸胶印印刷用油墨,使用的是通过紫外光的照射来硬化的紫外线硬化型油墨。此外,作为液晶面板或有机EL(有机发光二极管)面板等、FPD(平板显示器)周边的粘合剂,使用的是紫外线硬化树脂。在这种紫外线硬化型油墨或紫外线硬化树脂的硬化过程中,一般使用照射紫外光的紫外光照射装置。
作为紫外光照射装置,以往,众所周知的是将高压水银灯或水银疝气灯等作为光源的灯型照射装置,但近几年来,从降低耗电量、长寿命化、装置尺寸的紧凑化要求出发,为代替传统放电灯,开发了一种将发光二极管LED作为光源来利用的紫外光照射装置(例如,专利文献1)。
专利文献1所述的紫外光照射装置具备多个二维配置的发光元件的基板;以包围基板的方式设置的、对发光元件发出的紫外光进行导光的反射筒部(镜部);以及对基板进行制冷的制冷部。而且,被构成为通过由反射筒部对紫外光进行混合,能够在照射区域内得到均匀的照射分布。此外,在用发光二极管LED作为光源时,投入的大部分电力变成热量,会产生发光二极管LED自身散发的热量导致发光效率与使用寿命降低的问题,所以需要采用通过散热器等制冷部来抑制发光二极管LED发热的构造。
现有技术文献
专利文献
专利文献1:日本专利公开第2013-215661号公报
发明内容
发明所要解决的问题:
根据专利文献1所述的构造,其抑制发光二极管LED的发热,并且通过反射筒部来混合来自各发光二极管LED的光,所以能够在照射区域内得到均匀的照射分布。
然而,若反射筒部被紫外光照射,则存在反射筒部因自身的温度升高而发生变形的问题。而且,若反射筒部发生变形,则紫外光无法按照设计被混合,因此存在照射区域内的照射分布变得不均匀的问题。
本发明是鉴于以上情况而成的,其目的在于,提供一种具有可有效地冷却配置于反射筒部等、发光二极管LED的光通过的光通过区域内的部件的构造的光照射装置。
用于解决问题的方法:
为达成上述目的,本发明提供一种光照射装置,具备:基板;配置于基板表面的多个发光元件;配置于基板的背面以冷却基板以及多个发光元件的制冷机构;以使包围多个发光元件的光通过的光通过区域的方式配置的内壁;收纳基板、多个发光元件、制冷机构以及内壁,并在与内壁之间产生空间的壳体;将光通过区域的空气导入基板背面的空气流入口;通过基板背面,连结空气流入口与空间的流路;以及为使空间内的空气可从光通过区域流出而设置的循环口,其中,制冷机构对导入空气流入口的空气进行制冷,空气在光通过区域与空间之间对流。
根据这种构造,对光照射装置的内部空间的空气进行循环,因此能够抑制光照射装置的内部温度的上升,于是,可以有效地对内壁进行制冷。
此外,内壁可构成为对来自多个发光元件的光进行导光的反射镜的构造。由此,通过将内壁作为反射镜,可有效地冷却反射镜。
此外,壳体可具有透过光的同时,气密性地关闭光照射区域的光射出窗。此时,优选在光射出窗与内壁之间形成有循环口。
此外,优选内壁具有开口,该开口构成循环口。
此外,可在光通过区域以外的区域具有促使空气对流的风扇。
此外,可在空间内具有驱动多个发光元件的驱动电路。
发明效果:
如上所述,根据本发明,能够实现一种具有可有效地冷却配置于发光二极管LED光通过的光通过区域内的部件的构造的光照射装置。
附图说明
图1为说明本发明的第1实施例所涉及的光照射装置的简要构造的主视图。
图2为说明本发明的第1实施例所涉及的光照射装置的内部构造的Y-Z平面的剖面图。
图3为说明本发明的第1实施例所涉及的光照射装置中具有的发光二极管LED模块的构造的图。
图4为说明本发明的第1实施例所涉及的光照射装置中具有的散热部件的正面立体图。
图5为说明本发明的第1实施例所涉及的光照射装置中具有的散热部件的背面立体图。
图6为说明本发明的第1实施例所涉及的光照射装置中具有的反射镜的构造与冷却反射镜的过程的图。
图7为示出本发明的效果确认实验中已进行温度测定的位置的图。
图8为说明本发明的第2实施例所涉及的光照射装置的构造的图。
图中:
1、2 光照射装置
100 外壳
105 窗部
110 隔板
200 发光二极管LED模块
205 基板
207 阳极图案
209 阴极图案
210 发光二极管LED元件
300、300M 反射镜
300a 前端部
301、301M 循环口
400 散热部件
402 水冷散热器
402a 水路
404 散热架
404a 散热片
404b 空气流入口
404c 空气流出口
具体实施方式
以下,参照附图对本发明的实施例进行详细说明。再者,图中同一或者相同部分加以同样的符号并不再重复说明。
(第1实施例)
图1为说明本发明的第1实施例所涉及的光照射装置1的简要构造的主视图。此外,图2为说明光照射装置1的内部构造的Y-Z平面的剖面图。本实施例的光照射装置1为一种搭载于印刷装置等、并能够使紫外线硬化型油墨或紫外线硬化树脂硬化的光源装置,例如,以正面(配置有窗部105的面)与照射对象物相对的方式配置于照射对象物的上方,相对于照射对象物向下射出线形紫外光。再者,在本说明书中,如图1以及图2的坐标所示,将后述的发光二极管LED(Light Emitting Diode)元件210射出紫外光的方向设为Z轴方向,将光照射装置1的长边方向设为X轴方向,以及将与Z轴方向以及X轴方向正交的方向(光照射装置1的短边方向)设为Y轴方向并加以说明。
如图1以及图2所示,本实施例的光照射装置1在内部具有发光二极管LED模块200、反射镜300、和收纳散热部件400的箱型外壳100(壳体)。外壳100具有向正面射出紫外光的玻璃制窗部105。此外,在外壳100的背面(与正面相对的面)设有用于向光照射装置1供给电源的连接器(未图示)或向散热部件400供给冷却水的冷却水耦合器(未图示)等。连接器(未图示)通过未图示的电缆与未图示的电源装置连接,以便向光照射装置1供给电源。此外,未图示的冷却水供给装置连接于冷却水耦合器(未图示),以便向散热部件400供给冷却水。
图3为说明本实施例的发光二极管LED模块200的构造的图。此外,图4和图5为说明本实施例的散热部件400的构造的图,图4为从正面侧(窗部105侧)观察散热部件400时的正面立体图,图5为从背面侧观察散热部件400时的背面立体图。
如图3、图4以及图5所示,发光二极管LED模块200具有平行于X轴方向以及Y轴方向的长方形基板205与基板205上的多个发光二极管LED元件210,在外壳100内沿着X轴方向延伸的水冷散热器402的一个端面(朝向外壳100正面侧的面)上固定配置有2列×16个发光二极管LED模块200。
如图3所示,本实施例的发光二极管LED模块200具有以20列(Y轴方向)×10个(X轴方向)的形式配置于基板205上的200个发光二极管LED元件210。在光轴向Z轴方向上对齐的状态下,200个发光二极管LED元件210配置于基板205的表面。在基板205上形成有用于向发光二极管LED元件210供给电力的阳极图案207以及阴极图案209,各发光二极管LED元件210均焊接在阳极图案207以及阴极图案209上,并电性连接。此外,基板205通过未图示的接线电缆与未图示的驱动电路电性连接,以便在各发光二极管LED元件210中借由阳极图案207以及阴极图案209从驱动电路供给驱动电流。若对各发光二极管LED元件210供给驱动电流,则从各发光二极管LED元件210射出对应于驱动电流的光量的紫外光(例如,波长为385nm)。如图4和图5所示,在本实施例中,2列×16个发光二极管LED模块200排列在水冷散热器402的一个端面上,从本实施例的光照射装置1中射出在X轴方向上延伸的线形紫外光。再者,本实施例的各发光二极管LED元件210以射出大致相同光量的紫外光的方式调整向各发光二极管LED元件210供给的驱动电流,从光照射装置1射出的线形紫外光在X轴方向以及Y轴方向上具有大致均匀的光强度分布。
再者,如图1以及图2所示,在本实施例的光照射装置1中,设有以包围2列×16个发光二极管LED模块200的方式(即,包围发光二极管LED元件210的光通过的光通过区域)配置的4个反射镜300。通过4个反射镜300混合各发光二极管LED元件210射出的紫外光,在照射对象物上形成更均匀的光强度分布。
散热部件400为一种用于固定各发光二极管LED模块200,并且对各发光二极管LED模块200所产生的热量进行放热的部件,由热传导率高的铜等金属形成的2个水冷散热器402、以及固定于2个水冷散热器402的另一端面侧并热性结合,且支撑2个水冷散热器402的散热架404构成。此外,如图4和图5所示,在散热架404的Y轴方向中央部(即,2个水冷散热器402之间)上,形成有供在光通过区域(由反射镜300包围的区域)被加热的空气流入的空气流入口404b。
水冷散热器402为一种在一端面侧安装有发光二极管LED模块200的板状部件。在水冷散热器402的内部形成有供冷却水通过的多个水路402a(图2)。
散热架404为一种用于冷却从空气流入口404b流入的空气的金属长方形板状部件。在散热架404的另一端面侧(与固定有水冷散热器402的一侧相反的面)上形成有在与Z轴方向相反的方向上立起,并在Y轴方向上延伸的多个散热片404a。多个散热片404a以空气流入口404b为中心在Y轴方向上被分成2个并配置,从空气流入口404b流入的空气在被分成两个的各散热片404a之间流动,由此来进行冷却。即,各散热片404a之间形成有从空气流入口404b流入的空气流动的流路。而且,各散热片404a的外侧端部(与空气流入口404b相反侧的端部)在与相邻的散热片404a的外侧端部之间形成有从空气流入口404b流入的空气流出的空气流入口404c。由此,本实施例的散热部件400被构成为通过水冷散热器402对各发光二极管LED模块200产生的热量进行放热,并且利用水冷散热器402的背面侧也能对从空气流入口404b流入的空气进行冷却。而且,被构成为从空气流出口404c流出的冷却后的空气流入外壳100与反射镜300之间的空间,冷却反射镜300,通过在反射镜300的前端部300a与窗部105之间形成的循环口301(图2),流出光通过区域(后续详细说明)。
图6为说明本实施例的反射镜300的构造与冷却反射镜300的过程的光照射装置1的Y-Z平面的剖面图。
如上所述,本实施例的4个反射镜300为用于混合从各发光二极管LED元件210射出的紫外光的部件,以从散热架404的各边向窗部105缓缓扩散的方式倾斜设置。若来自各发光二极管LED元件210的紫外光通过反射镜300混合,则能够在照射对象物上得到均匀的光强度分布。
然而,来自各发光二极管LED元件210的紫外光照射在反射镜300上时,存在被反射镜300吸收的一部分光变成热量,反射镜300自身因为温度升高而变形的问题。此外,在本实施例中还会存在用窗部105覆盖反射镜300,所以反射镜300温度升高,光通过区域(由反射镜300包围的区域)的空气被加热,光照射装置1内部的温度上升,给发光二极管LED元件210、或其他电气零件带来不好的影响的问题。所以,为解决相关问题,在本实施例中,在散热架404上设置空气流入口404b,不仅仅是各发光二极管LED模块200,也可以冷却从空气流入口404b流入的空气,因此也对光通过区域(由反射镜300包围的区域)的空气以及反射镜300进行冷却。
图6的箭头表示空气的流动方向。如图6所示,各发光二极管LED元件210发光,来自各发光二极管LED元件210的紫外光照射至反射镜300时,反射镜300的温度升高,所以光通过区域(由反射镜300包围的区域)的空气被加热。而且,被加热的空气比重变轻并上升,从空气流入口404b流入散热架404的另一端面侧(箭头A)。而且,由于流入散热架404的另一端面侧的空气通过在外壳100与散热架404之间的空间与散热片404接触而被冷却,因此,比重变重,通过散热片404a之间(箭头B),从空气流出口404c流出。且从空气流出口404c流出的空气也流入外壳100与反射镜300之间的空间(箭头C)。从而,通过被冷却的空气与反射镜300的背面接触,来冷却反射镜300。
此外,如上所述,在本实施例中,在反射镜300的前端部300a与窗部105之间形成有一点点间隙,并形成有循环口301。而且,外壳100与反射镜300之间的被冷却的空气通过循环口301流入光通过区域(箭头D)。因此,根据本实施例的构造,光通过区域的空气也被冷却。
这样,在本实施例中,在散热架404上设置空气流入口404b,利用水冷散热器402的背面侧,在光通过区域以及外壳100与反射镜300之间的空间之间使空气自然对流,由此来冷却反射镜300以及光通过区域的空气。
因此,即使来自各发光二极管LED元件210的紫外光照射至反射镜300,反射镜300自身的温度也不会上升,进而不发生变形。此外,由于可以抑制了光照射装置1内部温度的上升,因此也不会给发光二极管LED元件210或其他电气零件带来不好的影响。
(效果确认实验)
表1为说明本发明的效果确认实验的结果的表,若在没有空气流入口404b的状态(即,通过开关板K关闭空气流入口404b的状态)、和空气流入口404b打开的状态(即,本实施方式的构造)下,通过热电偶对图7所示的各测定位置的温度进行测量,用下表表示其结果。再者,图7所示的开关板K为在本效果确认实验中,为了关闭空气流入口404b而方便使用的部件,并非构成本实施例的光照射装置1的部件。
【表1】
再者,如图7所示,测定位置a为2个水冷散热器402的温度,测定位置b为反射镜300的背面侧的温度,测定位置c为外壳100与反射镜300之间的空间内的空气温度。再者,表1的测定值为在满功率下各发光二极管LED元件210点亮60分钟时,其间的最高温度(℃)。此外,在表1的测定中,将供给至水冷散热器402的冷却水的温度设为23℃,流量为15L/min。再者,表1的“温度差”为空气流入口404b关闭状态的温度与空气流入口404b打开状态的温度的差。
(研究)
如表1所示,根据测定位置a的数据可知,不管有没有空气流入口404b,在水冷散热器402内都通过有冷却水,所以几乎不产生温度差。此外,根据测定位置b的数据可知,通过设置空气流入口404b,可使反射镜300的温度降低14.3℃左右。此外,根据测定位置c的数据可知,外壳100与反射镜300之间的的空间内的空气温度也可降低4.8℃左右。
以上虽为本实施方式的说明,但本发明并不局限于上述构造,在本发明的技术思想范围内可进行各种变形。
例如,本实施例的光照射装置1作为配置在照射对象物的上方,对照射对象物照射向下的紫外光的构造进行了说明,但光通过区域的空气也可流入空气流入口404b,例如,光照射装置1也可以为横向配置,对照射对象物照射横向的紫外光。
此外,本实施例作为使光通过区域的空气自然对流的构造,但也并非限定于这种构造,例如,也可以为在空气的对流路径内(即,光通过区域以外的区域)设有风扇,并强制地使光通过区域的空气对流的构造。
此外,本发明的实施例为一种在散热架404的Y轴方向中央部(即,在2列排列的16个LED模块200之间)设有空气流入口404b的构造,但并不限定于这种构造,若光通过区域的空气流入空气流入口404b,则空气流入口404b可设置在任何位置。
此外,本实施例为一种设置包围发光二极管LED模块200的反射镜300,并通过使光通过区域的空气自然对流来冷却反射镜300的构造,但没有必要必须设置反射镜300,例如,代替反射镜300,也可设置包围发光二极管LED模块200的内壁。这种情况下,通过使光通过区域的空气自然对流来降低内壁的温度。
此外,本实施例能够使外壳100与反射镜300之间的空间内的空气温度降低,因此,例如,还能够在外壳100与反射镜300之间配置向各发光二极管LED元件210供给驱动电流的驱动电路。
此外,本实施例中,在反射镜300的前端部300a上配置有窗部105,但是窗部105并不是必须的。若拆除窗部105,则外部的空气流入光通过区域,光通过区域的空气产生对流,所以光通过区域能够维持在较低的温度。
此外,本实施例的发光二极管LED模块200为在基板205上具有以20列(Y轴方向)×10个(X轴方向)的形式矩阵配置的200个发光二极管LED元件210的构造,但并不限定于此种构造,发光二极管LED元件210可配置成一列,或可配置成所谓的锯齿形状。此外,所有的发光二极管LED元件210的光轴都在Z轴方向上对齐,但是,例如,一部分发光二极管LED元件210的光轴也可以朝向Z轴方向以外的方向。
此外,本实施例的散热部件400具有水冷散热器402,例如,也可以为水以外的液冷,此外,还可应用热管、珀耳帖制冷器(珀耳帖元件),制冷风扇,来代替水冷散热器402。
(第2实施例)
图8为说明本发明的第2实施例所涉及的光照射装置2的内部构造的Y-Z平面的剖面图。第1实施例的光照射装置1具有在反射镜300的前端部300a与窗部105之间形成的循环口301,而本实施例的光照射装置2在配置在Y轴方向上的2片反射镜300M上形成有循环口301M,以代替该循环口301,这一点与第1实施例所涉及的光照射装置1有所不同。
如图8所示,本实施例的反射镜300M具有在X轴方向上延伸的狭缝状开口,该开口构成循环口301M。此外,在外壳100的内部,沿着循环口301M的下方边缘部(Z轴方向的边缘部)形成有隔开外壳100与反射镜300M之间的空间的隔板110。从而,从空气流出口404c流出的空气流入外壳100与反射镜300M之间的空间(箭头C),冷却反射镜300M,并沿着隔板110通过循环口301M,流入光通过区域(箭头D)。因此,本实施例的构造与第1实施例一样,不仅仅是反射镜300M,还能够冷却光通过区域的空气。
再者,循环口301M并不限定于狭缝状开口,也可以是沿着X轴方向形成的多个开口。此外,与第1实施例一样,本实施方式可以拆除窗部105,通过拆除窗部105,外部空气流入光通过区域,光通过区域的空气产生对流,所以光通过区域能够维持在较低的温度。
再者,本发明所公开的实施方式是在所有方面举例说明而已,并非限定本发明。本发明的范围并非由上述说明,而是由权利要求范围而决定,旨在包含与权利要求范围等同含义以及范围内的全部变更。
Claims (7)
1.一种光照射装置,其特征在于,具备:
基板;
配置于所述基板表面的多个发光元件;
配置于所述基板的背面以冷却所述基板以及多个所述发光元件的制冷机构;
以包围多个所述发光元件的光通过的光通过区域的方式配置的内壁;
收纳所述基板、多个所述发光元件、所述制冷机构以及所述内壁,并在与所述内壁之间产生空间的壳体;
将所述光通过区域的空气导入所述基板背面的空气流入口;
通过所述基板的背面,连结所述空气流入口与所述空间的流路;以及
为使所述空间内的空气可从所述光通过区域流出而设置的循环口,
其中,所述制冷机构对导入所述空气流入口的空气进行制冷,
空气在所述光通过区域与所述空间之间对流。
2.根据权利要求1所述的光照射装置,其特征在于,
所述内壁具备对来自多个所述发光元件的光进行传导的反射镜。
3.根据权利要求1或2所述的光照射装置,其特征在于,
所述壳体具备透过所述光,并气密性地关闭所述光通过区域的光射出窗。
4.根据权利要求3所述的光照射装置,其特征在于,
在所述光射出窗与所述内壁之间形成有所述循环口。
5.根据权利要求1~3中任一项所述的光照射装置,其特征在于,
所述内壁具有开口,该开口构成所述循环口。
6.根据权利要求1~5中任一项所述的光照射装置,其特征在于,
在所述光通过区域以外的区域具有促使所述空气的对流的风扇。
7.根据权利要求1~6中的任一项所述的光照射装置,其特征在于,
在所述空间内具有驱动多个所述发光元件的驱动电路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2015-257725 | 2015-12-30 | ||
JP2015257725A JP6483605B2 (ja) | 2015-12-30 | 2015-12-30 | 光照射装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106931356A true CN106931356A (zh) | 2017-07-07 |
Family
ID=57881948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611196579.9A Pending CN106931356A (zh) | 2015-12-30 | 2016-12-22 | 光照射装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10139096B2 (zh) |
EP (1) | EP3187780B1 (zh) |
JP (1) | JP6483605B2 (zh) |
KR (1) | KR20170080484A (zh) |
CN (1) | CN106931356A (zh) |
TW (1) | TWI696788B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111993780A (zh) * | 2019-08-10 | 2020-11-27 | Hoya株式会社 | 光照射装置 |
CN114848864A (zh) * | 2021-02-03 | 2022-08-05 | 丰田纺织株式会社 | 光发射装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6658709B2 (ja) * | 2017-10-10 | 2020-03-04 | ウシオ電機株式会社 | 光照射装置、及び、画像形成装置 |
JP6659651B2 (ja) * | 2017-10-27 | 2020-03-04 | Hoya Candeo Optronics株式会社 | 光照射装置 |
JP7435127B2 (ja) * | 2020-03-25 | 2024-02-21 | 富士フイルムビジネスイノベーション株式会社 | 発光装置及び描画装置 |
CN112614644B (zh) * | 2020-10-30 | 2022-09-09 | 肇庆高峰机械科技有限公司 | 自动充磁装置 |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1380020A (en) * | 1972-05-19 | 1975-01-08 | Commissariat Energie Atomique | Lighting installation for high powered illumination |
US4630182A (en) * | 1984-03-06 | 1986-12-16 | Nippon Kogaku K. K. | Illuminating system |
CN2411415Y (zh) * | 2000-02-02 | 2000-12-20 | 时密克 | 无影胶固化专用光源 |
US20050111234A1 (en) * | 2003-11-26 | 2005-05-26 | Lumileds Lighting U.S., Llc | LED lamp heat sink |
CN1948826A (zh) * | 2005-10-13 | 2007-04-18 | 优志旺电机株式会社 | 紫外线照射装置 |
CN101387388A (zh) * | 2007-09-11 | 2009-03-18 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管照明装置 |
CN201416784Y (zh) * | 2009-03-18 | 2010-03-03 | 吴立勇 | 一种利用空气对流实现散热的组合式led灯具 |
WO2010066297A1 (de) * | 2008-12-11 | 2010-06-17 | Osram Gesellschaft mit beschränkter Haftung | Uv-leuchte mit reflektor |
DE102009048662A1 (de) * | 2009-09-28 | 2011-03-31 | Siemens Aktiengesellschaft | Gekühltes Beleuchtungssystem mit oberflächenmontierter Lichtquelle |
US20110215698A1 (en) * | 2010-03-03 | 2011-09-08 | Cree, Inc. | Led lamp with active cooling element |
JP5056991B1 (ja) * | 2012-02-02 | 2012-10-24 | ウシオ電機株式会社 | 偏光光照射装置 |
CN203068200U (zh) * | 2012-03-23 | 2013-07-17 | 大连工业大学 | 一种设有散热机构的发光二极管照明设备 |
JP2014044883A (ja) * | 2012-08-27 | 2014-03-13 | Gs Yuasa Corp | 紫外線照射装置 |
CN203605102U (zh) * | 2013-12-16 | 2014-05-21 | 苏州威驰电子有限公司 | 一种uv灯结构 |
CN104456436A (zh) * | 2013-09-23 | 2015-03-25 | 肖一 | 对流散热仓式led灯具 |
CN204227378U (zh) * | 2014-09-29 | 2015-03-25 | 深圳市苏冉科技有限公司 | 一种阵列式uv-led灯珠的导热系统 |
JP2015058392A (ja) * | 2013-09-18 | 2015-03-30 | 東芝ライテック株式会社 | 発光モジュールおよび紫外線照射装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6182837A (ja) * | 1984-09-30 | 1986-04-26 | Toshiba Electric Equip Corp | 光照射装置 |
JPH0724435U (ja) * | 1993-10-18 | 1995-05-09 | 日本電池株式会社 | 紫外線照射装置 |
CN101970935B (zh) | 2007-12-07 | 2014-07-23 | 奥斯兰姆有限公司 | 散热装置以及包括散热装置的发光装置 |
KR101112661B1 (ko) * | 2009-11-05 | 2012-02-15 | 주식회사 아모럭스 | 발광 다이오드를 사용한 조명장치 |
KR101095868B1 (ko) * | 2011-09-08 | 2011-12-21 | 이슬기 | 발광다이오드형 조명 모듈 |
JP2013094737A (ja) * | 2011-11-01 | 2013-05-20 | Harison Toshiba Lighting Corp | 紫外線照射装置 |
JP2013215661A (ja) * | 2012-04-06 | 2013-10-24 | Ushikata Shokai:Kk | 紫外光照射装置 |
JP6182837B2 (ja) | 2012-08-27 | 2017-08-23 | 株式会社三洋物産 | 遊技機 |
-
2015
- 2015-12-30 JP JP2015257725A patent/JP6483605B2/ja active Active
-
2016
- 2016-11-30 TW TW105139568A patent/TWI696788B/zh not_active IP Right Cessation
- 2016-12-22 CN CN201611196579.9A patent/CN106931356A/zh active Pending
- 2016-12-22 KR KR1020160176978A patent/KR20170080484A/ko not_active Application Discontinuation
- 2016-12-29 US US15/393,439 patent/US10139096B2/en not_active Expired - Fee Related
-
2017
- 2017-01-05 EP EP17150412.9A patent/EP3187780B1/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1380020A (en) * | 1972-05-19 | 1975-01-08 | Commissariat Energie Atomique | Lighting installation for high powered illumination |
US4630182A (en) * | 1984-03-06 | 1986-12-16 | Nippon Kogaku K. K. | Illuminating system |
CN2411415Y (zh) * | 2000-02-02 | 2000-12-20 | 时密克 | 无影胶固化专用光源 |
US20050111234A1 (en) * | 2003-11-26 | 2005-05-26 | Lumileds Lighting U.S., Llc | LED lamp heat sink |
CN1948826A (zh) * | 2005-10-13 | 2007-04-18 | 优志旺电机株式会社 | 紫外线照射装置 |
CN101387388A (zh) * | 2007-09-11 | 2009-03-18 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管照明装置 |
WO2010066297A1 (de) * | 2008-12-11 | 2010-06-17 | Osram Gesellschaft mit beschränkter Haftung | Uv-leuchte mit reflektor |
CN201416784Y (zh) * | 2009-03-18 | 2010-03-03 | 吴立勇 | 一种利用空气对流实现散热的组合式led灯具 |
DE102009048662A1 (de) * | 2009-09-28 | 2011-03-31 | Siemens Aktiengesellschaft | Gekühltes Beleuchtungssystem mit oberflächenmontierter Lichtquelle |
US20110215698A1 (en) * | 2010-03-03 | 2011-09-08 | Cree, Inc. | Led lamp with active cooling element |
JP5056991B1 (ja) * | 2012-02-02 | 2012-10-24 | ウシオ電機株式会社 | 偏光光照射装置 |
CN203068200U (zh) * | 2012-03-23 | 2013-07-17 | 大连工业大学 | 一种设有散热机构的发光二极管照明设备 |
JP2014044883A (ja) * | 2012-08-27 | 2014-03-13 | Gs Yuasa Corp | 紫外線照射装置 |
JP2015058392A (ja) * | 2013-09-18 | 2015-03-30 | 東芝ライテック株式会社 | 発光モジュールおよび紫外線照射装置 |
CN104456436A (zh) * | 2013-09-23 | 2015-03-25 | 肖一 | 对流散热仓式led灯具 |
CN203605102U (zh) * | 2013-12-16 | 2014-05-21 | 苏州威驰电子有限公司 | 一种uv灯结构 |
CN204227378U (zh) * | 2014-09-29 | 2015-03-25 | 深圳市苏冉科技有限公司 | 一种阵列式uv-led灯珠的导热系统 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111993780A (zh) * | 2019-08-10 | 2020-11-27 | Hoya株式会社 | 光照射装置 |
CN111993780B (zh) * | 2019-08-10 | 2023-10-27 | Hoya株式会社 | 光照射装置 |
CN114848864A (zh) * | 2021-02-03 | 2022-08-05 | 丰田纺织株式会社 | 光发射装置 |
CN114848864B (zh) * | 2021-02-03 | 2024-04-09 | 丰田纺织株式会社 | 光发射装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6483605B2 (ja) | 2019-03-13 |
US10139096B2 (en) | 2018-11-27 |
EP3187780B1 (en) | 2019-07-17 |
TW201723387A (zh) | 2017-07-01 |
TWI696788B (zh) | 2020-06-21 |
US20170191650A1 (en) | 2017-07-06 |
KR20170080484A (ko) | 2017-07-10 |
JP2017120751A (ja) | 2017-07-06 |
EP3187780A1 (en) | 2017-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106931356A (zh) | 光照射装置 | |
US9662906B2 (en) | Illumination apparatus with heat radiation member | |
CN102159058B (zh) | 液冷式散热结构 | |
KR101791914B1 (ko) | 디스플레이 장치 | |
JP2006032890A (ja) | 閉ループ循環式放熱装置およびそれを使用するスクリーンモジュール | |
CN101566301B (zh) | 车辆用灯具 | |
CN105276552A (zh) | 光照射装置 | |
CN110389474A (zh) | 液晶显示装置 | |
CN107003561A (zh) | 照明装置及显示装置 | |
KR20180076546A (ko) | 실외 디스플레이장치 | |
CN113056176A (zh) | 散热架构和显示装置 | |
CN109723982A (zh) | 光照射装置 | |
CN105799340A (zh) | 光照射装置 | |
KR100708124B1 (ko) | 수냉식 냉각구조를 채용한 조명유니트 | |
JP2016025165A (ja) | 光照射装置 | |
EP3267773A1 (en) | System for the thermal control of an electronic panel for the reproduction of images | |
CN207661451U (zh) | 模组化led光源装置 | |
KR102021554B1 (ko) | 디스플레이 냉각장치 | |
CN203517377U (zh) | 复合式散热型大功率led装置 | |
CN110114714A (zh) | 照明装置和显示装置 | |
KR101808419B1 (ko) | 냉각부 및 광학격벽을 포함하는 led 광원을 이용한 스캔 방식의 노광장치 | |
KR100616668B1 (ko) | 엘이디 백라이트 유닛용 방열장치 | |
KR102186603B1 (ko) | 디스플레이 냉각장치 | |
KR102021657B1 (ko) | 디스플레이 냉각장치 | |
WO2013145812A1 (ja) | Led照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200814 Address after: No. 10-1, liudingmu, Shinjuku, Tokyo, Japan Applicant after: HOYA Corp. Address before: Saitama Prefecture, Japan Applicant before: HOYA CANDEO OPTRONICS Corp. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |