JP6483605B2 - 光照射装置 - Google Patents
光照射装置 Download PDFInfo
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- JP6483605B2 JP6483605B2 JP2015257725A JP2015257725A JP6483605B2 JP 6483605 B2 JP6483605 B2 JP 6483605B2 JP 2015257725 A JP2015257725 A JP 2015257725A JP 2015257725 A JP2015257725 A JP 2015257725A JP 6483605 B2 JP6483605 B2 JP 6483605B2
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- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/65—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air the gas flowing in a closed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Quality & Reliability (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
Description
図1は、本発明の第1の実施形態に係る光照射装置1の概略構成を説明する正面図である。また、図2は、光照射装置1の内部構成を説明するY−Z平面の断面図である。本実施形態の光照射装置1は、印刷装置等に搭載されて、紫外線硬化型インキや紫外線硬化樹脂を硬化させる光源装置であり、例えば、正面(窓部105が配置されている面)が照射対象物と対向するように、照射対象物の上方に配置され、照射対象物に対して下向きにライン状の紫外光を出射する。なお、本明細書においては、図1及び図2の座標に示すように、後述するLED(Light Emitting Diode)素子210が紫外光を出射する方向をZ軸方向、光照射装置1の長手方向をX軸方向、ならびにZ軸方向及びX軸方向に直交する方向(光照射装置1の短手方向)をY軸方向と定義して説明する。
表1は、本発明の効果確認実験の結果を説明する表であり、空気流入口404bがない状態(つまり、開閉板によって空気流入口404bを閉じた状態)と、空気流入口404bが開いている状態(つまり、本実施形態の構成)において、図6で示す各測定位置の温度を熱電対によって測定し、その結果を示したものである。なお、図6に示す開閉板は、本効果確認実験において、空気流入口404bを閉じるために便宜上使用した部材であり、本実施形態の光照射装置1を構成するものではない。
表1に示すように、測定位置aのデータによれば、空気流入口404bの有無に拘わらず水冷ヒートシンク402内を冷却水が通るため、温度差が殆ど生じないことが分かる。また、測定位置bのデータによれば、空気流入口404bを設けることによって、反射ミラー300の温度を約14.3℃低下させることができることが分かる。また、測定位置cのデータによれば、ケース100と反射ミラー300の間の空間の空気温度も約4.8℃低下させることができることが分かる。
図7は、本発明の第2の実施形態に係る光照射装置2の内部構成を説明するY−Z平面の断面図である。第1の実施形態の光照射装置1は、反射ミラー300の先端部300aと窓部105との間に形成された循環口301を備えているが、この循環口301に代えて、本実施形態の光照射装置2においては、Y軸方向に配置された2枚の反射ミラー300Mに循環口301Mが形成されている点で、第1の実施形態に係る光照射装置1とは異なっている。
100 ケース
103 冷却水カプラ
104 コネクタ
105 窓部
110 仕切板
200 LEDモジュール
205 基板
207 アノードパターン
209 カソードパターン
210 LED素子
300、300M 反射ミラー
300a 先端部
301、301M 循環口
400 放熱部材
402 水冷ヒートシンク
402a 水路
404 放熱フレーム
404a 放熱フィン
404b 空気流入口
404c 空気流出口
Claims (7)
- 照射対象物の上方に配置され、該照射対象物に対して下向きに光を照射する光照射装置であって、
基板と、
前記基板の下面に配置された複数の発光素子と、
一端面が前記基板の上面と当接するように前記基板の上方に配置され、前記基板及び前記複数の発光素子を冷却する冷却機構と、
前記複数の発光素子の光が通過する光通過領域を包囲するように、前記基板の下方に配置された内壁と、
前記基板、前記複数の発光素子、前記冷却機構及び前記内壁を収容すると共に、前記内壁との間に空間を生成する筐体と、
前記光通過領域の空気を前記冷却機構の他端面側に導入する空気流入口と、
前記空気流入口に導入された空気が前記冷却機構の他端面に沿って流れるように、前記冷却機構の他端面と前記筐体との間に形成され、前記空気流入口と前記空間とを結ぶ流路と、
前記空間の空気が前記光通過領域に流出可能に設けられた循環口と、
を備え、
前記冷却機構は、該冷却機構の他端面において前記空気流入口に導入された空気を冷却し、
前記光通過領域と前記空間との間で空気が自然対流する
ことを特徴とする光照射装置。 - 前記内壁は、前記光通過領域に面する第1面と、前記空間に面する第2面と、を有し、
前記自然対流する空気が、前記第1面と前記第2面に沿って流れる
ことを特徴とする請求項1に記載の光照射装置。 - 前記内壁の前記第1面が、前記複数の発光素子からの光を導光する反射ミラーを備えることを特徴とする請求項2に記載の光照射装置。
- 前記筐体は、前記光を透過すると共に、前記光通過領域を気密に閉じる光出射窓を備えることを特徴とする請求項1から請求項3のいずれか一項に記載の光照射装置。
- 前記光出射窓と前記内壁との間に前記循環口が形成されていることを特徴とする請求項4に記載の光照射装置。
- 前記内壁が開口を備え、該開口が前記循環口を構成することを特徴とする請求項1から請求項4のいずれか一項に記載の光照射装置。
- 前記空間内に、前記複数の発光素子を駆動するドライバ回路を備えることを特徴とする請求項1から請求項6のいずれか一項に記載の光照射装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015257725A JP6483605B2 (ja) | 2015-12-30 | 2015-12-30 | 光照射装置 |
TW105139568A TWI696788B (zh) | 2015-12-30 | 2016-11-30 | 光照射裝置 |
KR1020160176978A KR20170080484A (ko) | 2015-12-30 | 2016-12-22 | 광 조사장치 |
CN201611196579.9A CN106931356A (zh) | 2015-12-30 | 2016-12-22 | 光照射装置 |
US15/393,439 US10139096B2 (en) | 2015-12-30 | 2016-12-29 | Light irradiating device |
EP17150412.9A EP3187780B1 (en) | 2015-12-30 | 2017-01-05 | Light irradiating device |
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JP2015257725A JP6483605B2 (ja) | 2015-12-30 | 2015-12-30 | 光照射装置 |
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JP6658709B2 (ja) * | 2017-10-10 | 2020-03-04 | ウシオ電機株式会社 | 光照射装置、及び、画像形成装置 |
JP6659651B2 (ja) * | 2017-10-27 | 2020-03-04 | Hoya Candeo Optronics株式会社 | 光照射装置 |
JP7281363B2 (ja) * | 2019-08-10 | 2023-05-25 | Hoya株式会社 | 光照射装置 |
JP7435127B2 (ja) * | 2020-03-25 | 2024-02-21 | 富士フイルムビジネスイノベーション株式会社 | 発光装置及び描画装置 |
CN112614644B (zh) * | 2020-10-30 | 2022-09-09 | 肇庆高峰机械科技有限公司 | 自动充磁装置 |
JP2022119199A (ja) * | 2021-02-03 | 2022-08-16 | トヨタ紡織株式会社 | 光線照射装置 |
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FR2184534B1 (ja) * | 1972-05-19 | 1974-09-27 | Commissariat Energie Atomique | |
JPH071374B2 (ja) * | 1984-03-06 | 1995-01-11 | 株式会社ニコン | 光源装置 |
JPS6182837A (ja) * | 1984-09-30 | 1986-04-26 | Toshiba Electric Equip Corp | 光照射装置 |
JPH0724435U (ja) * | 1993-10-18 | 1995-05-09 | 日本電池株式会社 | 紫外線照射装置 |
CN2411415Y (zh) * | 2000-02-02 | 2000-12-20 | 时密克 | 无影胶固化专用光源 |
US7144135B2 (en) * | 2003-11-26 | 2006-12-05 | Philips Lumileds Lighting Company, Llc | LED lamp heat sink |
JP4424296B2 (ja) * | 2005-10-13 | 2010-03-03 | ウシオ電機株式会社 | 紫外線照射装置 |
CN101387388B (zh) * | 2007-09-11 | 2011-11-30 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管照明装置 |
CN101970935B (zh) | 2007-12-07 | 2014-07-23 | 奥斯兰姆有限公司 | 散热装置以及包括散热装置的发光装置 |
WO2010066297A1 (de) * | 2008-12-11 | 2010-06-17 | Osram Gesellschaft mit beschränkter Haftung | Uv-leuchte mit reflektor |
CN201416784Y (zh) * | 2009-03-18 | 2010-03-03 | 吴立勇 | 一种利用空气对流实现散热的组合式led灯具 |
DE102009048662B4 (de) * | 2009-09-28 | 2012-11-08 | Siemens Aktiengesellschaft | Gekühltes Beleuchtungssystem mit oberflächenmontierter Lichtquelle |
KR101112661B1 (ko) * | 2009-11-05 | 2012-02-15 | 주식회사 아모럭스 | 발광 다이오드를 사용한 조명장치 |
US8931933B2 (en) * | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
KR101095868B1 (ko) * | 2011-09-08 | 2011-12-21 | 이슬기 | 발광다이오드형 조명 모듈 |
JP2013094737A (ja) * | 2011-11-01 | 2013-05-20 | Harison Toshiba Lighting Corp | 紫外線照射装置 |
JP5056991B1 (ja) * | 2012-02-02 | 2012-10-24 | ウシオ電機株式会社 | 偏光光照射装置 |
CN203068200U (zh) * | 2012-03-23 | 2013-07-17 | 大连工业大学 | 一种设有散热机构的发光二极管照明设备 |
JP2013215661A (ja) * | 2012-04-06 | 2013-10-24 | Ushikata Shokai:Kk | 紫外光照射装置 |
JP6182837B2 (ja) | 2012-08-27 | 2017-08-23 | 株式会社三洋物産 | 遊技機 |
JP5743160B2 (ja) * | 2012-08-27 | 2015-07-01 | 株式会社Gsユアサ | 紫外線照射装置 |
JP2015058392A (ja) * | 2013-09-18 | 2015-03-30 | 東芝ライテック株式会社 | 発光モジュールおよび紫外線照射装置 |
CN104456436A (zh) * | 2013-09-23 | 2015-03-25 | 肖一 | 对流散热仓式led灯具 |
CN203605102U (zh) * | 2013-12-16 | 2014-05-21 | 苏州威驰电子有限公司 | 一种uv灯结构 |
CN204227378U (zh) * | 2014-09-29 | 2015-03-25 | 深圳市苏冉科技有限公司 | 一种阵列式uv-led灯珠的导热系统 |
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2016
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- 2016-12-22 KR KR1020160176978A patent/KR20170080484A/ko not_active Application Discontinuation
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US10139096B2 (en) | 2018-11-27 |
EP3187780B1 (en) | 2019-07-17 |
TW201723387A (zh) | 2017-07-01 |
TWI696788B (zh) | 2020-06-21 |
US20170191650A1 (en) | 2017-07-06 |
KR20170080484A (ko) | 2017-07-10 |
CN106931356A (zh) | 2017-07-07 |
JP2017120751A (ja) | 2017-07-06 |
EP3187780A1 (en) | 2017-07-05 |
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