CN106917063B - 金属掩模材料和金属掩模 - Google Patents
金属掩模材料和金属掩模 Download PDFInfo
- Publication number
- CN106917063B CN106917063B CN201610963957.5A CN201610963957A CN106917063B CN 106917063 B CN106917063 B CN 106917063B CN 201610963957 A CN201610963957 A CN 201610963957A CN 106917063 B CN106917063 B CN 106917063B
- Authority
- CN
- China
- Prior art keywords
- metal mask
- rolling
- mask material
- degree
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
- C22C38/105—Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metal Rolling (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015216849A JP6177299B2 (ja) | 2015-11-04 | 2015-11-04 | メタルマスク材料及びメタルマスク |
JP2015-216849 | 2015-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106917063A CN106917063A (zh) | 2017-07-04 |
CN106917063B true CN106917063B (zh) | 2019-04-02 |
Family
ID=58740561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610963957.5A Active CN106917063B (zh) | 2015-11-04 | 2016-11-04 | 金属掩模材料和金属掩模 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6177299B2 (ko) |
KR (1) | KR101879052B1 (ko) |
CN (1) | CN106917063B (ko) |
TW (1) | TWI621719B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102294111B1 (ko) * | 2017-06-20 | 2021-08-26 | 히다찌긴조꾸가부시끼가이사 | 메탈 마스크용 박판의 제조 방법 및 메탈 마스크용 박판 |
KR102300029B1 (ko) * | 2017-07-27 | 2021-09-09 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체와 이의 제조 방법 및 표시 장치의 제조 방법 |
KR102358039B1 (ko) * | 2017-09-07 | 2022-02-04 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 금속재의 증착용 마스크 |
TWI765121B (zh) | 2017-11-14 | 2022-05-21 | 日商大日本印刷股份有限公司 | 用以製造蒸鍍罩之金屬板、金屬板之檢查方法、金屬板之製造方法、蒸鍍罩、蒸鍍罩裝置及蒸鍍罩之製造方法 |
WO2020067537A1 (ja) | 2018-09-27 | 2020-04-02 | 日鉄ケミカル&マテリアル株式会社 | メタルマスク材料及びその製造方法とメタルマスク |
CN113540385A (zh) * | 2020-04-22 | 2021-10-22 | 悟勞茂材料公司 | 掩模金属膜、掩模金属膜支撑模板、掩模支撑模板及其制造方法 |
KR102371177B1 (ko) * | 2020-04-27 | 2022-03-08 | 주식회사 오럼머티리얼 | 마스크 금속막, 마스크 금속막 지지 템플릿 및 프레임 일체형 마스크 |
EP4342603A1 (en) | 2021-05-17 | 2024-03-27 | NIPPON STEEL Chemical & Material Co., Ltd. | Ferrous alloy foil, manufacturing method therefor, and component using same |
TWI772066B (zh) | 2021-06-16 | 2022-07-21 | 達運精密工業股份有限公司 | 金屬遮罩基材的製備方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050478A (ja) | 1996-04-19 | 1998-02-20 | Toray Ind Inc | 有機電界発光素子およびその製造方法 |
JP3545684B2 (ja) * | 2000-07-17 | 2004-07-21 | 日鉱金属加工株式会社 | エッチング穿孔性に優れたFe−Ni系合金シャドウマスク用素材 |
JP3740105B2 (ja) * | 2001-11-20 | 2006-02-01 | 日鉱金属加工株式会社 | シャドウマスク用Fe−Ni系およびFe−Ni−Co系合金条 |
JP4090467B2 (ja) * | 2002-05-13 | 2008-05-28 | 三井金属鉱業株式会社 | チップオンフィルム用フレキシブルプリント配線板 |
JP4126648B2 (ja) | 2002-07-01 | 2008-07-30 | 日立金属株式会社 | メタルマスク用部材の製造方法 |
JP2004039628A (ja) | 2003-06-04 | 2004-02-05 | Hitachi Metals Ltd | メタルマスク |
US20060003177A1 (en) * | 2004-07-02 | 2006-01-05 | A. Schulman, Inc. | Co-extruded mask layer |
JP5294072B2 (ja) * | 2009-03-18 | 2013-09-18 | 日立金属株式会社 | エッチング加工用素材の製造方法及びエッチング加工用素材 |
JP4883432B2 (ja) * | 2010-05-31 | 2012-02-22 | 東洋紡績株式会社 | フレキシブル金属張積層体 |
MX2013005660A (es) * | 2010-11-18 | 2013-07-05 | 3M Innovative Properties Co | Metodos para inpartir una nueva imagen a una superficie y kits para su uso con los mismos. |
JP4831552B1 (ja) * | 2011-03-28 | 2011-12-07 | Jx日鉱日石金属株式会社 | Co−Si系銅合金板 |
JP5758254B2 (ja) * | 2011-09-27 | 2015-08-05 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
CN104024156B (zh) * | 2011-11-04 | 2016-03-30 | Jx日矿日石金属株式会社 | 石墨烯制造用铜箔及其制造方法、以及石墨烯的制造方法 |
CN104769165B (zh) * | 2012-11-09 | 2017-08-25 | Jx日矿日石金属株式会社 | 表面处理铜箔及使用其的积层板、覆铜积层板、印刷配线板以及电子机器 |
JP5721691B2 (ja) * | 2012-11-20 | 2015-05-20 | Jx日鉱日石金属株式会社 | メタルマスク材料及びメタルマスク |
KR101929635B1 (ko) * | 2013-08-29 | 2018-12-14 | 제이엑스금속주식회사 | 표면 처리 금속재, 캐리어 부착 금속박, 커넥터, 단자, 적층체, 실드 테이프, 실드재, 프린트 배선판, 금속 가공 부재, 전자 기기, 및 프린트 배선판의 제조 방법 |
-
2015
- 2015-11-04 JP JP2015216849A patent/JP6177299B2/ja active Active
-
2016
- 2016-10-04 TW TW105131996A patent/TWI621719B/zh active
- 2016-10-25 KR KR1020160139018A patent/KR101879052B1/ko active IP Right Grant
- 2016-11-04 CN CN201610963957.5A patent/CN106917063B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP6177299B2 (ja) | 2017-08-09 |
JP2017088915A (ja) | 2017-05-25 |
CN106917063A (zh) | 2017-07-04 |
KR101879052B1 (ko) | 2018-07-16 |
KR20170052472A (ko) | 2017-05-12 |
TW201718904A (zh) | 2017-06-01 |
TWI621719B (zh) | 2018-04-21 |
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JX Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JX Metal Co.,Ltd. |