CN106917063B - 金属掩模材料和金属掩模 - Google Patents

金属掩模材料和金属掩模 Download PDF

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Publication number
CN106917063B
CN106917063B CN201610963957.5A CN201610963957A CN106917063B CN 106917063 B CN106917063 B CN 106917063B CN 201610963957 A CN201610963957 A CN 201610963957A CN 106917063 B CN106917063 B CN 106917063B
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CN
China
Prior art keywords
metal mask
rolling
mask material
degree
metal
Prior art date
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Active
Application number
CN201610963957.5A
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English (en)
Chinese (zh)
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CN106917063A (zh
Inventor
近藤祐幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Publication of CN106917063A publication Critical patent/CN106917063A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
    • C22C38/105—Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metal Rolling (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201610963957.5A 2015-11-04 2016-11-04 金属掩模材料和金属掩模 Active CN106917063B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015216849A JP6177299B2 (ja) 2015-11-04 2015-11-04 メタルマスク材料及びメタルマスク
JP2015-216849 2015-11-04

Publications (2)

Publication Number Publication Date
CN106917063A CN106917063A (zh) 2017-07-04
CN106917063B true CN106917063B (zh) 2019-04-02

Family

ID=58740561

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610963957.5A Active CN106917063B (zh) 2015-11-04 2016-11-04 金属掩模材料和金属掩模

Country Status (4)

Country Link
JP (1) JP6177299B2 (ko)
KR (1) KR101879052B1 (ko)
CN (1) CN106917063B (ko)
TW (1) TWI621719B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102294111B1 (ko) * 2017-06-20 2021-08-26 히다찌긴조꾸가부시끼가이사 메탈 마스크용 박판의 제조 방법 및 메탈 마스크용 박판
KR102300029B1 (ko) * 2017-07-27 2021-09-09 삼성디스플레이 주식회사 마스크 프레임 조립체와 이의 제조 방법 및 표시 장치의 제조 방법
KR102358039B1 (ko) * 2017-09-07 2022-02-04 엘지이노텍 주식회사 Oled 화소 증착을 위한 금속재의 증착용 마스크
TWI765121B (zh) 2017-11-14 2022-05-21 日商大日本印刷股份有限公司 用以製造蒸鍍罩之金屬板、金屬板之檢查方法、金屬板之製造方法、蒸鍍罩、蒸鍍罩裝置及蒸鍍罩之製造方法
WO2020067537A1 (ja) 2018-09-27 2020-04-02 日鉄ケミカル＆マテリアル株式会社 メタルマスク材料及びその製造方法とメタルマスク
CN113540385A (zh) * 2020-04-22 2021-10-22 悟勞茂材料公司 掩模金属膜、掩模金属膜支撑模板、掩模支撑模板及其制造方法
KR102371177B1 (ko) * 2020-04-27 2022-03-08 주식회사 오럼머티리얼 마스크 금속막, 마스크 금속막 지지 템플릿 및 프레임 일체형 마스크
EP4342603A1 (en) 2021-05-17 2024-03-27 NIPPON STEEL Chemical & Material Co., Ltd. Ferrous alloy foil, manufacturing method therefor, and component using same
TWI772066B (zh) 2021-06-16 2022-07-21 達運精密工業股份有限公司 金屬遮罩基材的製備方法

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* Cited by examiner, † Cited by third party
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JPH1050478A (ja) 1996-04-19 1998-02-20 Toray Ind Inc 有機電界発光素子およびその製造方法
JP3545684B2 (ja) * 2000-07-17 2004-07-21 日鉱金属加工株式会社 エッチング穿孔性に優れたＦｅ−Ｎｉ系合金シャドウマスク用素材
JP3740105B2 (ja) * 2001-11-20 2006-02-01 日鉱金属加工株式会社 シャドウマスク用Ｆｅ−Ｎｉ系およびＦｅ−Ｎｉ−Ｃｏ系合金条
JP4090467B2 (ja) * 2002-05-13 2008-05-28 三井金属鉱業株式会社 チップオンフィルム用フレキシブルプリント配線板
JP4126648B2 (ja) 2002-07-01 2008-07-30 日立金属株式会社 メタルマスク用部材の製造方法
JP2004039628A (ja) 2003-06-04 2004-02-05 Hitachi Metals Ltd メタルマスク
US20060003177A1 (en) * 2004-07-02 2006-01-05 A. Schulman, Inc. Co-extruded mask layer
JP5294072B2 (ja) * 2009-03-18 2013-09-18 日立金属株式会社 エッチング加工用素材の製造方法及びエッチング加工用素材
JP4883432B2 (ja) * 2010-05-31 2012-02-22 東洋紡績株式会社 フレキシブル金属張積層体
MX2013005660A (es) * 2010-11-18 2013-07-05 3M Innovative Properties Co Metodos para inpartir una nueva imagen a una superficie y kits para su uso con los mismos.
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5758254B2 (ja) * 2011-09-27 2015-08-05 Jx日鉱日石金属株式会社 圧延銅箔
CN104024156B (zh) * 2011-11-04 2016-03-30 Jx日矿日石金属株式会社 石墨烯制造用铜箔及其制造方法、以及石墨烯的制造方法
CN104769165B (zh) * 2012-11-09 2017-08-25 Jx日矿日石金属株式会社 表面处理铜箔及使用其的积层板、覆铜积层板、印刷配线板以及电子机器
JP5721691B2 (ja) * 2012-11-20 2015-05-20 Jx日鉱日石金属株式会社 メタルマスク材料及びメタルマスク
KR101929635B1 (ko) * 2013-08-29 2018-12-14 제이엑스금속주식회사 표면 처리 금속재, 캐리어 부착 금속박, 커넥터, 단자, 적층체, 실드 테이프, 실드재, 프린트 배선판, 금속 가공 부재, 전자 기기, 및 프린트 배선판의 제조 방법

Also Published As

Publication number Publication date
JP6177299B2 (ja) 2017-08-09
JP2017088915A (ja) 2017-05-25
CN106917063A (zh) 2017-07-04
KR101879052B1 (ko) 2018-07-16
KR20170052472A (ko) 2017-05-12
TW201718904A (zh) 2017-06-01
TWI621719B (zh) 2018-04-21

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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan

Patentee after: JX Metal Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: JX Metal Co.,Ltd.