JP6177299B2 - メタルマスク材料及びメタルマスク - Google Patents
メタルマスク材料及びメタルマスク Download PDFInfo
- Publication number
- JP6177299B2 JP6177299B2 JP2015216849A JP2015216849A JP6177299B2 JP 6177299 B2 JP6177299 B2 JP 6177299B2 JP 2015216849 A JP2015216849 A JP 2015216849A JP 2015216849 A JP2015216849 A JP 2015216849A JP 6177299 B2 JP6177299 B2 JP 6177299B2
- Authority
- JP
- Japan
- Prior art keywords
- metal mask
- rolling
- mask material
- metal
- cold rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 title claims description 87
- 229910052751 metal Inorganic materials 0.000 title claims description 87
- 239000000463 material Substances 0.000 title claims description 55
- 238000005096 rolling process Methods 0.000 claims description 42
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- 238000000137 annealing Methods 0.000 description 31
- 239000013078 crystal Substances 0.000 description 31
- 230000007547 defect Effects 0.000 description 28
- 238000005097 cold rolling Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 26
- 238000001953 recrystallisation Methods 0.000 description 22
- 238000005530 etching Methods 0.000 description 16
- 239000003921 oil Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- HYHSBSXUHZOYLX-WDSKDSINSA-N S-nitrosoglutathione Chemical compound OC(=O)[C@@H](N)CCC(=O)N[C@@H](CSN=O)C(=O)NCC(O)=O HYHSBSXUHZOYLX-WDSKDSINSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 8
- 239000011368 organic material Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 239000010731 rolling oil Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 238000000879 optical micrograph Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
- C22C38/105—Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metal Rolling (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015216849A JP6177299B2 (ja) | 2015-11-04 | 2015-11-04 | メタルマスク材料及びメタルマスク |
TW105131996A TWI621719B (zh) | 2015-11-04 | 2016-10-04 | Metal mask material and metal mask |
KR1020160139018A KR101879052B1 (ko) | 2015-11-04 | 2016-10-25 | 메탈 마스크 재료 및 메탈 마스크 |
CN201610963957.5A CN106917063B (zh) | 2015-11-04 | 2016-11-04 | 金属掩模材料和金属掩模 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015216849A JP6177299B2 (ja) | 2015-11-04 | 2015-11-04 | メタルマスク材料及びメタルマスク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017088915A JP2017088915A (ja) | 2017-05-25 |
JP6177299B2 true JP6177299B2 (ja) | 2017-08-09 |
Family
ID=58740561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015216849A Active JP6177299B2 (ja) | 2015-11-04 | 2015-11-04 | メタルマスク材料及びメタルマスク |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6177299B2 (ko) |
KR (1) | KR101879052B1 (ko) |
CN (1) | CN106917063B (ko) |
TW (1) | TWI621719B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7156279B2 (ja) * | 2017-06-20 | 2022-10-19 | 日立金属株式会社 | メタルマスク用薄板の製造方法及びメタルマスク用薄板 |
KR102300029B1 (ko) * | 2017-07-27 | 2021-09-09 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체와 이의 제조 방법 및 표시 장치의 제조 방법 |
KR102358039B1 (ko) * | 2017-09-07 | 2022-02-04 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 금속재의 증착용 마스크 |
CN117187746A (zh) * | 2017-11-14 | 2023-12-08 | 大日本印刷株式会社 | 金属板的制造方法和蒸镀掩模的制造方法 |
JP6704540B1 (ja) | 2018-09-27 | 2020-06-03 | 日鉄ケミカル&マテリアル株式会社 | メタルマスク材料及びその製造方法とメタルマスク |
KR102371177B1 (ko) * | 2020-04-27 | 2022-03-08 | 주식회사 오럼머티리얼 | 마스크 금속막, 마스크 금속막 지지 템플릿 및 프레임 일체형 마스크 |
JPWO2022244701A1 (ko) | 2021-05-17 | 2022-11-24 | ||
TWI772066B (zh) * | 2021-06-16 | 2022-07-21 | 達運精密工業股份有限公司 | 金屬遮罩基材的製備方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050478A (ja) | 1996-04-19 | 1998-02-20 | Toray Ind Inc | 有機電界発光素子およびその製造方法 |
JP3545684B2 (ja) * | 2000-07-17 | 2004-07-21 | 日鉱金属加工株式会社 | エッチング穿孔性に優れたFe−Ni系合金シャドウマスク用素材 |
JP3740105B2 (ja) * | 2001-11-20 | 2006-02-01 | 日鉱金属加工株式会社 | シャドウマスク用Fe−Ni系およびFe−Ni−Co系合金条 |
JP4090467B2 (ja) * | 2002-05-13 | 2008-05-28 | 三井金属鉱業株式会社 | チップオンフィルム用フレキシブルプリント配線板 |
JP4126648B2 (ja) | 2002-07-01 | 2008-07-30 | 日立金属株式会社 | メタルマスク用部材の製造方法 |
JP2004039628A (ja) | 2003-06-04 | 2004-02-05 | Hitachi Metals Ltd | メタルマスク |
CN1980792A (zh) * | 2004-07-02 | 2007-06-13 | A.舒尔曼因维深公司 | 共挤出的掩模层 |
JP5294072B2 (ja) * | 2009-03-18 | 2013-09-18 | 日立金属株式会社 | エッチング加工用素材の製造方法及びエッチング加工用素材 |
WO2011152178A1 (ja) * | 2010-05-31 | 2011-12-08 | 東洋紡績株式会社 | フレキシブル金属張積層体 |
WO2012082269A1 (en) * | 2010-11-18 | 2012-06-21 | 3M Innovative Properties Company | Methods for imparting an image to a surface and kits for use therewith |
JP4831552B1 (ja) * | 2011-03-28 | 2011-12-07 | Jx日鉱日石金属株式会社 | Co−Si系銅合金板 |
JP5758254B2 (ja) * | 2011-09-27 | 2015-08-05 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
CN104024156B (zh) * | 2011-11-04 | 2016-03-30 | Jx日矿日石金属株式会社 | 石墨烯制造用铜箔及其制造方法、以及石墨烯的制造方法 |
CN104769165B (zh) * | 2012-11-09 | 2017-08-25 | Jx日矿日石金属株式会社 | 表面处理铜箔及使用其的积层板、覆铜积层板、印刷配线板以及电子机器 |
JP5721691B2 (ja) * | 2012-11-20 | 2015-05-20 | Jx日鉱日石金属株式会社 | メタルマスク材料及びメタルマスク |
MY176312A (en) * | 2013-08-29 | 2020-07-28 | Jx Nippon Mining & Metals Corp | Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board |
-
2015
- 2015-11-04 JP JP2015216849A patent/JP6177299B2/ja active Active
-
2016
- 2016-10-04 TW TW105131996A patent/TWI621719B/zh active
- 2016-10-25 KR KR1020160139018A patent/KR101879052B1/ko active IP Right Grant
- 2016-11-04 CN CN201610963957.5A patent/CN106917063B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170052472A (ko) | 2017-05-12 |
CN106917063B (zh) | 2019-04-02 |
JP2017088915A (ja) | 2017-05-25 |
KR101879052B1 (ko) | 2018-07-16 |
TW201718904A (zh) | 2017-06-01 |
TWI621719B (zh) | 2018-04-21 |
CN106917063A (zh) | 2017-07-04 |
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