JP6177299B2 - メタルマスク材料及びメタルマスク - Google Patents

メタルマスク材料及びメタルマスク Download PDF

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Publication number
JP6177299B2
JP6177299B2 JP2015216849A JP2015216849A JP6177299B2 JP 6177299 B2 JP6177299 B2 JP 6177299B2 JP 2015216849 A JP2015216849 A JP 2015216849A JP 2015216849 A JP2015216849 A JP 2015216849A JP 6177299 B2 JP6177299 B2 JP 6177299B2
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JP
Japan
Prior art keywords
metal mask
rolling
mask material
metal
cold rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015216849A
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English (en)
Japanese (ja)
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JP2017088915A (ja
Inventor
近藤 祐幸
祐幸 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2015216849A priority Critical patent/JP6177299B2/ja
Priority to TW105131996A priority patent/TWI621719B/zh
Priority to KR1020160139018A priority patent/KR101879052B1/ko
Priority to CN201610963957.5A priority patent/CN106917063B/zh
Publication of JP2017088915A publication Critical patent/JP2017088915A/ja
Application granted granted Critical
Publication of JP6177299B2 publication Critical patent/JP6177299B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/10Ferrous alloys, e.g. steel alloys containing cobalt
    • C22C38/105Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metal Rolling (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2015216849A 2015-11-04 2015-11-04 メタルマスク材料及びメタルマスク Active JP6177299B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015216849A JP6177299B2 (ja) 2015-11-04 2015-11-04 メタルマスク材料及びメタルマスク
TW105131996A TWI621719B (zh) 2015-11-04 2016-10-04 Metal mask material and metal mask
KR1020160139018A KR101879052B1 (ko) 2015-11-04 2016-10-25 메탈 마스크 재료 및 메탈 마스크
CN201610963957.5A CN106917063B (zh) 2015-11-04 2016-11-04 金属掩模材料和金属掩模

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015216849A JP6177299B2 (ja) 2015-11-04 2015-11-04 メタルマスク材料及びメタルマスク

Publications (2)

Publication Number Publication Date
JP2017088915A JP2017088915A (ja) 2017-05-25
JP6177299B2 true JP6177299B2 (ja) 2017-08-09

Family

ID=58740561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015216849A Active JP6177299B2 (ja) 2015-11-04 2015-11-04 メタルマスク材料及びメタルマスク

Country Status (4)

Country Link
JP (1) JP6177299B2 (ko)
KR (1) KR101879052B1 (ko)
CN (1) CN106917063B (ko)
TW (1) TWI621719B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7156279B2 (ja) * 2017-06-20 2022-10-19 日立金属株式会社 メタルマスク用薄板の製造方法及びメタルマスク用薄板
KR102300029B1 (ko) * 2017-07-27 2021-09-09 삼성디스플레이 주식회사 마스크 프레임 조립체와 이의 제조 방법 및 표시 장치의 제조 방법
KR102358039B1 (ko) * 2017-09-07 2022-02-04 엘지이노텍 주식회사 Oled 화소 증착을 위한 금속재의 증착용 마스크
CN117187746A (zh) * 2017-11-14 2023-12-08 大日本印刷株式会社 金属板的制造方法和蒸镀掩模的制造方法
JP6704540B1 (ja) 2018-09-27 2020-06-03 日鉄ケミカル&マテリアル株式会社 メタルマスク材料及びその製造方法とメタルマスク
KR102371177B1 (ko) * 2020-04-27 2022-03-08 주식회사 오럼머티리얼 마스크 금속막, 마스크 금속막 지지 템플릿 및 프레임 일체형 마스크
JPWO2022244701A1 (ko) 2021-05-17 2022-11-24
TWI772066B (zh) * 2021-06-16 2022-07-21 達運精密工業股份有限公司 金屬遮罩基材的製備方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050478A (ja) 1996-04-19 1998-02-20 Toray Ind Inc 有機電界発光素子およびその製造方法
JP3545684B2 (ja) * 2000-07-17 2004-07-21 日鉱金属加工株式会社 エッチング穿孔性に優れたFe−Ni系合金シャドウマスク用素材
JP3740105B2 (ja) * 2001-11-20 2006-02-01 日鉱金属加工株式会社 シャドウマスク用Fe−Ni系およびFe−Ni−Co系合金条
JP4090467B2 (ja) * 2002-05-13 2008-05-28 三井金属鉱業株式会社 チップオンフィルム用フレキシブルプリント配線板
JP4126648B2 (ja) 2002-07-01 2008-07-30 日立金属株式会社 メタルマスク用部材の製造方法
JP2004039628A (ja) 2003-06-04 2004-02-05 Hitachi Metals Ltd メタルマスク
CN1980792A (zh) * 2004-07-02 2007-06-13 A.舒尔曼因维深公司 共挤出的掩模层
JP5294072B2 (ja) * 2009-03-18 2013-09-18 日立金属株式会社 エッチング加工用素材の製造方法及びエッチング加工用素材
WO2011152178A1 (ja) * 2010-05-31 2011-12-08 東洋紡績株式会社 フレキシブル金属張積層体
WO2012082269A1 (en) * 2010-11-18 2012-06-21 3M Innovative Properties Company Methods for imparting an image to a surface and kits for use therewith
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Jx日鉱日石金属株式会社 Co−Si系銅合金板
JP5758254B2 (ja) * 2011-09-27 2015-08-05 Jx日鉱日石金属株式会社 圧延銅箔
CN104024156B (zh) * 2011-11-04 2016-03-30 Jx日矿日石金属株式会社 石墨烯制造用铜箔及其制造方法、以及石墨烯的制造方法
CN104769165B (zh) * 2012-11-09 2017-08-25 Jx日矿日石金属株式会社 表面处理铜箔及使用其的积层板、覆铜积层板、印刷配线板以及电子机器
JP5721691B2 (ja) * 2012-11-20 2015-05-20 Jx日鉱日石金属株式会社 メタルマスク材料及びメタルマスク
MY176312A (en) * 2013-08-29 2020-07-28 Jx Nippon Mining & Metals Corp Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
KR20170052472A (ko) 2017-05-12
CN106917063B (zh) 2019-04-02
JP2017088915A (ja) 2017-05-25
KR101879052B1 (ko) 2018-07-16
TW201718904A (zh) 2017-06-01
TWI621719B (zh) 2018-04-21
CN106917063A (zh) 2017-07-04

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