CN106907585A - A kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device - Google Patents
A kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device Download PDFInfo
- Publication number
- CN106907585A CN106907585A CN201710284377.8A CN201710284377A CN106907585A CN 106907585 A CN106907585 A CN 106907585A CN 201710284377 A CN201710284377 A CN 201710284377A CN 106907585 A CN106907585 A CN 106907585A
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- Prior art keywords
- heat
- plug
- conductive pad
- led
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device, including fixed screw, plug-in unit LED lamp bead, glass printed circuit board (PCB), plug-in unit LED board component, heat conductive pad, insulation spacer, metal heat sink.Its advantage be the heat conductive pad for having used solid-state as heat-conducting medium, the system heat transfer efficiency of LED modules is substantially improved；Heat conductive pad is soft, stitch and bump is lunged and is oppressed heat conductive pad by external force and forms embedded calking, maximized to increased heat transfer area；Separate the powered stitch in glass printed circuit board (PCB) bottom surface and metal heat sink thermal conductive surface using insulation spacer, them is not contacted, so as to ensure that insulation effect；Simple production process, uniformity is high, it is easy to carry out quality control.
Description
Technical field
The invention belongs to technical field of LED illumination, and in particular to the insulation of the lighting module being made up of plug-in unit LED lamp bead dissipates
Thermal means and device.
Background technology
Basic luminescence component-LED the modules of current Modular LED lamp, are generally mounted on using adopting surface mounted LED lamp bead
Copper aluminium base is covered, being used as heat-conduction medium by heat-conducting silicone grease is contacted with metal heat sink, the heat produced during by LED lamp bead burning-point
Amount is conducted to radiator, by the outside function of environment heat emission of radiator.And it is universal in the manufacture of LED modules using plug-in type LED lamp bead
Less, its problem is that plug-in type LED lamp bead cannot carry out covering copper aluminium base note dress, can only be carried out using glass printed circuit board (PCB)
Inserting, circuit board bottom surface carries stitch and bag-like bump after inserting, and stitch and bump are with low tension and into loop, it is impossible to
Directly with metal class radiator directly contact.Because stitch and the convex end of bump are needle point state, glass printing electricity
Road plate bottom surface is not burnishing surface, using brushing heat-conducting silicone grease for the method for heat-conducting medium cannot be formed effectively with stitch and bump
Thermal conductive contact area, heat-conducting effect is poor.
It is existing to increase using stacking heat-conducting silicone grease and between stitch and bump and metal heat sink one for problem above
The method of the thin micarex of piece is come using plug-in type LED lamp bead manufacture LED modules, the document delivered mainly includes《One kind is based on small
The LED street lamp of power ellipse lamp bead》Utility model patent notification number CN205424589U, patent of invention publication No.
CN105156955A；《A kind of LED street lamp》Use new patent notification number CN203349111U.This kind of method is needed in glass print
Printed circuit board bottom surface first stacks certain thickness heat-conducting silicone grease, and stitch and scolding tin point boss are all covered, and its thickness is general 2
To 2.5 millimeters；Then at one layer of thin heat-conducting silicone grease of metal heat sink heat-transfer area brushing；Thin micarex is affixed on metal heat sink heat transfer
Face；Then at one layer of thin heat-conducting silicone grease of mica plate face brushing；The glass printed circuit board (PCB) for stacking heat-conducting silicone grease is finally affixed on mica
Plate face is fixed.
The deficiency of this kind of method is to be provided with thin micarex for exhausted between stitch and bump and metal heat sink
Edge, micarex is mainly included in so insulation but low thermal conductivity, only 0.4W/mK, the document of reference《Insulating materials》On deliver
's《The research of Thermal Conductivity of Mica Tape Adhesive》；Its physical state is hard sheet, and gap filling ability is poor, is focusing on radiating
This micarex is set in LED modules, the heat conduction continuity of heat-conducting system is hindered, the thermal resistance of LED modules is increased.Heat-conducting silicone grease
In emulsus and with mobility, preferable calking effect is not reached yet when glass printed circuit board (PCB) bottom surface stacks, it is impossible to formed
Effective thermal conductive contact area, separates out with after volatilization after silicone oil, and the practical function of heat-conducting silicone grease can decay seriously.In glass printing
When circuit board is affixed on the fixation of mica plate face, LED stitch easily pierces through thin micarex and causes LED lamp bead stitch directly and metal heat sink
Contact formed electric leakage, cause LED modules cannot burning-point use.Its complex manufacturing of LED modules and difficulty are manufactured using the method
With the quality control being standardized.
LED modules prepared by method described above are applied to LED lamp and there is following common fault：Circuit board bottom surface pins pierced cloud
Motherboard contacts with metal heat sink and is also easy to produce leaky and causes light fixture yield rate low, using dangerous；LED module system thermal resistances
Greatly, heat-conducting effect is poor, easily causes the excessive light decay of LED lamp bead or even causes LED lamp bead to fail because heat conduction is bad；In heat-conducting silicone grease
Silicone oil can separate out or be affected by gravity outflow, cause heat-conducting silicone grease to harden, infilling lose, lose heat-conducting effect.
The present invention for problem above with it is not enough, and propose a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method with
Device.
The content of the invention
The invention aims to solve, produced in the manufacture and use of LED modules using plug-in type LED lamp bead
Heat-conducting system thermal resistance is big, heat-conducting effect decay is big, the problem of the bad easy electric leakage of insulation measures, and a kind of plug-in unit LED for proposing is inserted
Stitch inserted insulation heat dissipating method and device.
The purpose of the present invention is achieved through the following technical solutions：
Such as Fig. 2, plug-in unit LED lamp bead（2）With printed circuit board (PCB)（3）By forming LED board component after assembling and scolding tin（11）.Shape
Plug-in unit LED lamp bead after into component（2）Stitch state such as partial enlarged view（9）, including bump（7）With LED lamp bead
Stitch（8）.
Such as Fig. 2,3, LED board component（11）The heat produced when running that is powered concentrates on bump（7）With LED lamp bead
Stitch（8）And by heat conductive pad（5）By heat conductive pad（5）Conduct heat to radiator（6）, by radiator（6）Radiated.
Such as Fig. 3,4, LED board component（11）Be powered LED lamp bead stitch when running（8）It is powered, LED lamp bead stitch（8）With
Radiator（6）Do not contact, play insulating effect.
Such as Fig. 2,3, LED lamp bead stitch（8）Puncture heat conductive pad（5）And be embedded, bump（7）Compressing heat conductive pad（5）
Make its deformation and wrap bump（7）, heat conductive pad after deformation（5）The full LED board component of filling（11）Each bump（7）It
Between space, make bump（7）With heat conductive pad（5）Sufficient heat conductive contact area is formed, plays a part of heat transfer.
Such as Fig. 3, insulation spacer（4）Interval make LED lamp bead stitch（8）With radiator（6）Between form distance, play absolutely
Edge is acted on.
Such as Fig. 1,2, insulation spacer（4）It is embedded in heat conductive pad（5）In, across LED board component（11）, by screw（1）With
Radiator（6）It is fixed.
Such as Fig. 5, LED lamp bead stitch is formed after assembling（8）Puncture heat conductive pad（5）And be embedded, bump（7）Compressing is led
Heat pad（5）Make its deformation and wrap bump（7）, heat conductive pad after deformation（5）The full LED board component of filling（11）Each scolding tin
Point（7）Between space, make bump（7）With heat conductive pad（5）Sufficient heat conductive contact area is formed, the work of heat transfer is played
With.
Such as Fig. 3, insulation spacer（4）Interval make LED lamp bead stitch（8）With radiator（6）Between form distance, play absolutely
Edge is acted on.
Beneficial effect
Present invention contrast prior art has following innovative point：
Use the heat conductive pad of solid-state as heat-conducting medium, the system heat transfer efficiency of LED modules is substantially improved；Heat conductive pad is soft
Formula, makes stitch and bump lunge and oppress heat conductive pad and forms embedded calking by external force, maximized to increased heat transfer
Area；Separate the powered stitch in glass printed circuit board (PCB) bottom surface and metal heat sink thermal conductive surface using insulation spacer, them is not connect
Touch, so as to ensure that insulation effect；Simple production process, uniformity is high, it is easy to carry out quality control.
Brief description of the drawings
Fig. 1 is the schematic diagram of the inventive method and device；
Fig. 2 is the schematic diagram of the inventive method and device；
Fig. 3 is the schematic diagram of the inventive method；
Fig. 4 is the schematic diagram of the inventive method；
Fig. 5 is the schematic diagram of apparatus of the present invention；
Wherein：1-screw, 2-plug-in unit LED lamp bead, 3-glass printed circuit board (PCB), 4-insulation spacer, 5-heat conductive pad, 6-dissipate
Hot device, 7-bump, 8-LED lamp bead stitch, 11-LED board component.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.
Concretism of the invention is the heat conductive pad for using solid-state, by inserted insulation heat dissipating method, realizes ensureing
The heat transfer efficiency of LED module heat-conducting systems is improved on the basis of insulation effect.
Embodiment
Realize that LED contact pin pin inserted insulation radiates using the device shown in accompanying drawing 5.
For the device of LED contact pin pin inserted insulation cooling applications, as shown in Figure 2, including M3x8 pan head screws
（1）, the plug-in type LED lamp beads of Φ 5（2）, prefabricated screw fixed hole cover copper glass circuit board（3）, internal diameter 3mm external diameter 6mm thickness
2mm nylon spacers（4）, the prefabricated pads of thickness 2mm are by the thermal conductive silicon rubber cushion thermal conductivity factor 3.0W/mK in hole（5）, spiral shell in prefabricated M3
The aluminium alloy heat radiator of line fixing hole（6）.Wherein plug-in type LED lamp beads of Φ 5（2）, cover copper glass circuit board（3）, first pass through slotting
Part machine carries out plug-in unit and welding, including plug-in unit, cutting, clubfoot, welding procedure with crest welder, and stitch is controlled in cutting technique
End is no more than 1.5mm apart from the height of circuit board bottom surface, is made LED board component（11）；The prefabricated pads of thickness 2mm are opened to lead to
The thermal conductive silicon rubber cushion thermal conductivity factor 3.0W/mK of via（5）The diaphragm of side is by internal diameter 3mm external diameter 6mm thickness 2mm nylon spacers
（4）It is embedded；By thermal conductive silicon rubber cushion（5）With nylon spacer（4）Component lies in the aluminium alloy of prefabricated M3 internal threads fixing hole
Radiator（6）On；By LED board component（11）Lie in thermal conductive silicon rubber cushion（5）On；Use M3x8 pan head screws（1）Lock aluminium
Alloy heat-sink device（6）In corresponding internal thread fixing hole in, assembling schematic diagram such as accompanying drawing 1；The stitch of plug-in unit LED lamp bead is closed with aluminium
Distance between the radiating surface of golden radiator leans on nylon spacer（4）With thermal conductive silicon rubber cushion（5）Thickness control.
This embodiment realizes LED contact pin pin inserted insulation and radiates by a series of measure, realizes plug-in unit LED and inserts
Stitch inserted insulation heat dissipating method and device, compared with other method, imitate with LED module heat-conducting systems heat transfer higher
Rate, more preferable insulation effect, production higher and quality control efficiency.
Specific embodiment of the invention is described above in association with accompanying drawing, but these explanations can not be understood to limitation
The scope of the present invention, protection scope of the present invention is limited by appended claims, any in the claims in the present invention base
Change on plinth is all protection scope of the present invention.
Claims (8)
1. a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device, including：Such as figure two, plug-in unit LED lamp bead（2）With
Printed circuit board (PCB)（3）By forming LED board component after assembling and scolding tin（11）;Form plug-in unit LED lamp bead after component（2）Pin
Feet state such as partial enlarged view（9）, including bump（7）With LED lamp bead stitch（8）.
2. a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method, it is characterised in that：Such as figure two, three, LED board component
（11）The heat produced when running that is powered concentrates on bump（7）With LED lamp bead stitch（8）And by heat conductive pad（5）By leading
Heat pad（5）Conduct heat to radiator（6）, by radiator（6）Radiated.
3. a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method, it is characterised in that：Such as figure three, four, LED board component
（11）Be powered LED lamp bead stitch when running（8）It is powered, LED lamp bead stitch（8）With radiator（6）Do not contact, play insulation and make
With.
4. a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method according to right 2, it is characterised in that：Such as figure two,
Three, LED lamp bead stitch（8）Puncture heat conductive pad（5）And be embedded, bump（7）Compressing heat conductive pad（5）Make its deformation and wrap up
Firmly bump（7）, heat conductive pad after deformation（5）The full LED board component of filling（11）Each bump（7）Between space, make weldering
Tin point（7）With heat conductive pad（5）Sufficient heat conductive contact area is formed, plays a part of heat transfer.
5. a kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method according to right 3, it is characterised in that：Such as figure three, absolutely
Edge pad（4）Interval make LED lamp bead stitch（8）With radiator（6）Between form distance, play insulating effect.
6. a kind of plug-in unit LED contact pins pin inserted insulation heat abstractor, it is characterised in that：Such as figure one, two, insulation spacer（4）It is embedding
In heat conductive pad（5）In, across LED board component（11）, by screw（1）With radiator（6）It is fixed.
7. a kind of plug-in unit LED contact pins pin inserted insulation heat abstractor according to right 6, it is characterised in that：Such as figure five, fills
LED lamp bead stitch is formed after matching somebody with somebody（8）Puncture heat conductive pad（5）And be embedded, bump（7）Compressing heat conductive pad（5）Make its deformation
And wrap bump（7）, heat conductive pad after deformation（5）The full LED board component of filling（11）Each bump（7）Between sky
Gap, makes bump（7）With heat conductive pad（5）Sufficient heat conductive contact area is formed, plays a part of heat transfer.
8. a kind of plug-in unit LED contact pins pin inserted insulation heat abstractor according to right 6, it is characterised in that：Such as figure three, absolutely
Edge pad（4）Interval make LED lamp bead stitch（8）With radiator（6）Between form distance, play insulating effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710284377.8A CN106907585A (en) | 2017-04-27 | 2017-04-27 | A kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710284377.8A CN106907585A (en) | 2017-04-27 | 2017-04-27 | A kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106907585A true CN106907585A (en) | 2017-06-30 |
Family
ID=59211397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710284377.8A Pending CN106907585A (en) | 2017-04-27 | 2017-04-27 | A kind of plug-in unit LED contact pins pin inserted insulation heat dissipating method and device |
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| Country | Link |
|---|---|
| CN (1) | CN106907585A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113757820A (en) * | 2020-06-03 | 2021-12-07 | 青岛海信日立空调系统有限公司 | Outdoor machine of air conditioner |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2358558Y (en) * | 1998-12-07 | 2000-01-12 | 姜守仁 | Flexible heat-conducting pad |
| US20090073701A1 (en) * | 2007-09-13 | 2009-03-19 | Lotes Co., Ltd. | Electrical connecting apparatus |
| CN102095187A (en) * | 2010-12-08 | 2011-06-15 | 浙江德胜新能源科技股份有限公司 | LED (light emitting diode) lamp with light weight and rapid heat dissipation and manufacturing method thereof |
| CN102352971A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Light emitting diode (LED) light source module and machining method thereof |
| CN204372626U (en) * | 2015-01-19 | 2015-06-03 | 关奉前 | Led lamp |
-
2017
- 2017-04-27 CN CN201710284377.8A patent/CN106907585A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2358558Y (en) * | 1998-12-07 | 2000-01-12 | 姜守仁 | Flexible heat-conducting pad |
| US20090073701A1 (en) * | 2007-09-13 | 2009-03-19 | Lotes Co., Ltd. | Electrical connecting apparatus |
| CN102095187A (en) * | 2010-12-08 | 2011-06-15 | 浙江德胜新能源科技股份有限公司 | LED (light emitting diode) lamp with light weight and rapid heat dissipation and manufacturing method thereof |
| CN102352971A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Light emitting diode (LED) light source module and machining method thereof |
| CN204372626U (en) * | 2015-01-19 | 2015-06-03 | 关奉前 | Led lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113757820A (en) * | 2020-06-03 | 2021-12-07 | 青岛海信日立空调系统有限公司 | Outdoor machine of air conditioner |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170630 |
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