CN106876556B - 一种专用于透明基板的背贴式贴片led - Google Patents

一种专用于透明基板的背贴式贴片led Download PDF

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CN106876556B
CN106876556B CN201710266713.6A CN201710266713A CN106876556B CN 106876556 B CN106876556 B CN 106876556B CN 201710266713 A CN201710266713 A CN 201710266713A CN 106876556 B CN106876556 B CN 106876556B
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刘联家
盖庆亮
尤晓江
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Wuhan Huashang Green Technology Co ltd
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Wuhan Wosun Lvneng Polytron Technologies Inc
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract

本发明涉及一种专用于透明基板的背贴式贴片LED，包括上层和下层，下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通；上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体；该贴片LED可以背向贴装，玻璃基板将贴片LED与人类活动区隔离，可避免人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。

Description

一种专用于透明基板的背贴式贴片LED
技术领域
本发明涉及一种贴片LED，具体涉及一种植入IC的贴片LED，属于贴片LED技术领域。
背景技术
现有贴片LED仅能正向安装，即贴片LED安装于电路板的正面，贴片LED的发光面即正面朝外，背面焊接于电路板上，此安装结构在普通PCB电路板上应用不会产生什么问题，由于普通PCB电路板封装于机器中，难以进入灰尘杂物，不存在清洗的问题，但是对于透明电路基板，尤其是玻璃基电路板，是用于室外、对采光性有要求的场所，与空气中的颗粒物直接接触，玻璃上久而会堆积灰尘或因人类活动弄脏玻璃表面，影响玻璃基板透光性，因此需要定期清洗电路板的贴附有贴片元件的侧面，由于贴片LED本身尺寸较小，多为2mm*2mm或3mm*3mm，焊接强度不足，在清洗过程中很容易被清洗工具擦落，使用持久性问题突出。
发明内容
本发明的目的是克服现有贴片LED的不足，而提供一种可以反向贴装的贴片LED，该贴片LED可以安装于玻璃基板的背面，玻璃基板将贴片LED与人类活动区隔离，可避免因人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。
实现本发明目的所采用的技术方案为，一种专用于透明基板的背贴式贴片LED，为双层结构，包括上层和下层，所述下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通；所述上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；所述上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体。
所述各焊盘均呈矩形，并且其长度方向均平行。
所述上层尺寸不大于下层的尺寸，上层与下层通过环氧树脂封装为一体。
下层背面涂覆有阻焊层。
上层的中心贯通孔的孔壁上涂覆有反光涂料。
与现有技术相比，本发明提供的专用于透明基板的背贴式贴片LED具有如下优点：
(1)本发明是为专用于透明电路基板的贴片LED而设计，贴片LED设计为双层结构，上层为双面板，焊盘通过过孔导通，上层的中心为镂空结构，恰好将下层中心区域RGB三色晶片露出，而下层正面的大部分焊盘结构则被上层覆盖，得到保护，由于该上层的正反两面以及下层的正面均设有焊盘，并且焊盘均与内部的电气元件连接，因此该贴片LED可以背向贴装，即上层焊接于玻璃基板上，贴片LED焊接于玻璃基板外侧面，与人类活动区接触的内侧面上无任何凸出物，玻璃基板将贴片LED与人类活动区隔离，可避免因人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。
(2)本发明的贴片LED焊盘方向相同，均为纵向或均为横向，使得采用该焊盘结构的贴片LED更易于制作，并且贴片时易于布线。
(3)本发明的贴片LED的上层与下层通过环氧树脂封装为一体，保证结构的完整，由于该贴片LED为背向贴装，为避免贴片LED在日光照射下变色、老化，避免贴片LED遇雨水冲刷而短路，在下层背面涂覆有阻焊层，保护内部线路；上层的中心贯通孔的孔壁上涂覆有反光涂料，增强该贴片LED的发光效果。
附图说明
图1为本发明提供的专用于透明基板的背贴式贴片LED的整体结构图。
图2为下层的正面结构图。
其中，100-上层，200-下层，1-焊盘VDD，2-焊盘GND，3-焊盘CKI，4-焊盘CKO，5-焊盘SDI，6-焊盘SDO，7-过孔，8-中心贯通孔，9-RGB三色晶片，10-IC芯片，11-跳线。
具体实施方式
下面以内置IC芯片的贴片LED为例，结合附图和实施例对本发明进行详细具体说明，本发明的内容不局限于以下实施例。
参见图1，本发明提供的专用于透明基板的背贴式贴片LED，为双层结构，包括上层100和下层200；所述上层100为外方内圆的环形结构，边长为2mm，上层100贴于下层200上，其中心贯通孔8与下层200的中心区域位置相对，中心贯通孔8中灌注环氧树脂，上层100的中心贯通孔8的孔壁上涂覆有反光涂料，上层100与下层200通过焊盘连接并且通过环氧树脂封装为一体；
所述上层100为双面板，其正反两面上绕侧边均设有6个焊盘，6对焊盘在正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔7导通，所述6个焊盘包括2个电源焊盘和4个信号焊盘，6个焊盘均呈竖向分布，2个电源焊盘分别用于接电源的焊盘VDD1和用于接地的焊盘GND2，4个信号焊盘分别为用于脉冲信号输入的焊盘CKI3、用于脉冲信号输出的焊盘CKO4、用于地址码信号输入的焊盘SDI5和用于地址码信号输出的焊盘SDO6，焊盘VDD1和焊盘GND2位于贴片LED的中间位置、其中一条对称轴上，二者间距为0.4mm，4个信号焊盘分布于四角，并且分布于焊盘VDD1与焊盘GND2连线的两侧，两个用于信号输入的焊盘CKI3和SDI5同位于该条对称轴的一侧，二者间距为0.8mm，焊盘CKI3和SDI5与对应的电源焊盘的间距均为0.4mm，两个用于信号输出的焊盘CKO4和SDO6同位于该条对称轴的另一侧，二者间距为0.8mm，焊盘CKO4和SDO6与对应的电源焊盘的间距为0.4mm；
参见图2，所述下层200同为边长2mm的正方形板，下层200的正面上同样设有上述6个焊盘，下层200与上层100的焊盘分布结构相同，所述下层200的中心区域设有IC芯片10和RGB三色晶片9，RGB三色晶片9附着于下层200的焊盘VDD1上，IC芯片10附着于下层200的焊盘GND2上，该焊盘GND2上引出4条跳线11，分别接至下层200的4个信号焊盘CKI3、CKO4、SDI5和SDO6上，实现脉冲信号和地址码信号的输入和输出，该脉冲信号和地址码信号由IC芯片处理后，驱动RGB三色晶片9发光并且控制其发光时刻和发光时长，下层200背面涂覆有阻焊层12，保护下层200的背面，防止下层200的背面受日晒而氧化变色。

Claims (4)

1.一种专用于透明基板的背贴式贴片LED，其特征在于：为双层结构，包括上层和下层，所述下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通，下层背面涂覆有阻焊层；
所述上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；
所述上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体，
背贴式贴片LED背向贴装在玻璃基板上，所述背向贴装为背贴式贴片LED的上层焊接于玻璃基板上。
2.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：所述各焊盘均呈矩形，并且其长度方向均平行。
3.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：所述上层尺寸不大于下层的尺寸，上层与下层通过环氧树脂封装为一体。
4.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：上层的中心贯通孔的孔壁上涂覆有反光涂料。
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