CN106898605B - 一种专用于透明基板的ic植入式贴片led - Google Patents
一种专用于透明基板的ic植入式贴片led Download PDFInfo
- Publication number
- CN106898605B CN106898605B CN201710266787.XA CN201710266787A CN106898605B CN 106898605 B CN106898605 B CN 106898605B CN 201710266787 A CN201710266787 A CN 201710266787A CN 106898605 B CN106898605 B CN 106898605B
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- pad
- paster led
- pads
- implanted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710266787.XA CN106898605B (zh) | 2017-04-21 | 2017-04-21 | 一种专用于透明基板的ic植入式贴片led |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710266787.XA CN106898605B (zh) | 2017-04-21 | 2017-04-21 | 一种专用于透明基板的ic植入式贴片led |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106898605A CN106898605A (zh) | 2017-06-27 |
CN106898605B true CN106898605B (zh) | 2019-06-18 |
Family
ID=59197054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710266787.XA Active CN106898605B (zh) | 2017-04-21 | 2017-04-21 | 一种专用于透明基板的ic植入式贴片led |
Country Status (1)
Country | Link |
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CN (1) | CN106898605B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109873073A (zh) * | 2019-04-09 | 2019-06-11 | 深圳市华科莱特电子有限公司 | 倒装透明可卷软膜led显示屏及其生产工艺 |
CN116013911A (zh) * | 2021-10-22 | 2023-04-25 | 深圳市晶泓科技有限公司 | 一种透明led显示屏 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2722440Y (zh) * | 2004-09-17 | 2005-08-31 | 陈德忠 | 用于高功率发光二极管的散热与导电的转接基板 |
CN101409320B (zh) * | 2007-10-09 | 2010-06-23 | 富士迈半导体精密工业(上海)有限公司 | 基板制作方法 |
CN101252163A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种smd高功率led陶瓷封装基座 |
US8791471B2 (en) * | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US20120037935A1 (en) * | 2010-08-13 | 2012-02-16 | Wen-Kun Yang | Substrate Structure of LED (light emitting diode) Packaging and Method of the same |
CN203176800U (zh) * | 2013-02-05 | 2013-09-04 | 于来强 | 一种灯驱一体全彩发光二极管 |
CN203377252U (zh) * | 2013-06-25 | 2014-01-01 | 东莞勤上光电股份有限公司 | 一种自带led驱动ic的贴片led |
CN205645807U (zh) * | 2016-04-26 | 2016-10-12 | 永林电子有限公司 | 一种贴片式触发闪灯ic片 |
CN106876556B (zh) * | 2017-04-21 | 2019-10-15 | 武汉华尚绿能科技股份有限公司 | 一种专用于透明基板的背贴式贴片led |
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2017
- 2017-04-21 CN CN201710266787.XA patent/CN106898605B/zh active Active
Also Published As
Publication number | Publication date |
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CN106898605A (zh) | 2017-06-27 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220920 Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee after: Huashang Optoelectronics Technology Co.,Ltd. Address before: Room 4901, Minsheng Bank Building, No. 396, Qushui Building, Xinhua Road, Jianghan District, Wuhan City, Hubei Province 430000 Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230811 Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee before: Huashang Optoelectronics Technology Co.,Ltd. |
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TR01 | Transfer of patent right |