CN106898605B - 一种专用于透明基板的ic植入式贴片led - Google Patents

一种专用于透明基板的ic植入式贴片led Download PDF

Info

Publication number
CN106898605B
CN106898605B CN201710266787.XA CN201710266787A CN106898605B CN 106898605 B CN106898605 B CN 106898605B CN 201710266787 A CN201710266787 A CN 201710266787A CN 106898605 B CN106898605 B CN 106898605B
Authority
CN
China
Prior art keywords
pad
paster led
pads
implanted
lower layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710266787.XA
Other languages
English (en)
Other versions
CN106898605A (zh
Inventor
刘联家
盖庆亮
尤晓江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Huashang Green Technology Co ltd
Original Assignee
Wuhan Wosun Lvneng Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Wosun Lvneng Polytron Technologies Inc filed Critical Wuhan Wosun Lvneng Polytron Technologies Inc
Priority to CN201710266787.XA priority Critical patent/CN106898605B/zh
Publication of CN106898605A publication Critical patent/CN106898605A/zh
Application granted granted Critical
Publication of CN106898605B publication Critical patent/CN106898605B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及一种专用于透明基板的IC植入式贴片LED,包括上层和下层,所述上层和下层均为双面板,其正反两面上绕侧边均设有6个焊盘,上层和下层的焊盘分布结构相同,6对焊盘在正反两面上的位置一一相对并通过过孔导通;上层贴于下层上,通过焊盘连接并且通过封装树脂封装为一体;贴片LED内部植入IC芯片,其驱动和控制均在内部进行,贴片LED之间通过引线连接,传递信号,整体仅需引出两条电源线即可,从而使得透明电路基板上布线数量大大减少,保证透明电路基板的透光性;该贴片LED既可以正向贴装,也可以背向贴装,玻璃基板将贴片LED与人类活动区隔离,可避免因人类活动误碰落贴片LED,并且玻璃基板内侧面清理方便。

Description

一种专用于透明基板的IC植入式贴片LED
技术领域
本发明涉及一种贴片LED,具体涉及一种植入IC的贴片LED,属于贴片LED技术领域。
背景技术
现有贴片LED仅能正向安装,即贴片LED安装于电路板的正面,贴片LED的发光面即正面朝外,背面焊接于电路板上,此安装结构在普通PCB电路板上应用不会产生什么问题,由于普通PCB电路板封装于机器中,难以进入灰尘杂物,不存在清洗的问题,但是对于透明电路基板,尤其是玻璃基电路板,是用于室外、对采光性有要求的场所,与空气中的颗粒物直接接触,玻璃上久而会堆积灰尘或因人类活动弄脏玻璃表面,影响玻璃基板透光性,因此需要定期清洗电路板,即玻璃基板的贴片面,由于贴片LED本身尺寸较小,多为2mm*2mm或3mm*3mm,焊接强度不足,在清洗过程中很容易被清洗工具擦落,使用持久性问题突出。
LED灯需要驱动芯片进行驱动发光,为节省成本,一般采用外置IC芯片,则每个LED灯均需要引出2-4条引线,对于大规模点阵LED,布线结构错综复杂,极易出现短路情况,并且将此LED灯用于透明电路基板时,布线过于密集,则必然使得透明电路基板的透光性大打折扣。
发明内容
本发明的目的是克服现有贴片LED的不足,而提供一种内部植入IC芯片,并且可以反向贴装的贴片LED。
实现本发明目的所采用的技术方案为,一种专用于透明基板的IC植入式贴片LED,为双层结构,包括上层和下层,所述上层和下层均为双面板,其正反两面上绕侧边均设有6个焊盘,上层和下层的焊盘分布结构相同,6对焊盘在正反两面上的位置一一相对,正反两面上位置相对的两个焊盘通过过孔导通,所述6个焊盘包括2个电源焊盘和4个信号焊盘,2个电源焊盘分别为用于接电源的焊盘VDD和用于接地的焊盘GND,4个信号焊盘分别为用于脉冲信号输入的焊盘CKI、用于脉冲信号输出的焊盘CKO、用于地址码信号输入的焊盘SDI和用于地址码信号输出的焊盘SDO;所述下层的中心区域设有IC芯片和RGB三色晶片,RGB三色晶片附着于下层正面的焊盘VDD上,IC芯片附着于下层正面的焊盘GND上,该焊盘GND上引出4条跳线,分别接至下层正面的4个信号焊盘CKI、CKO、SDI和SDO上;所述上层为环形结构,上层贴于下层上,其中心贯通孔与下层的中心区域位置相对,中心贯通孔中灌注封装树脂,上层与下层通过焊盘连接并且通过封装树脂封装为一体。
所述焊盘VDD和焊盘GND位于贴片LED的中间位置,4个信号焊盘分布于焊盘VDD与焊盘GND连线的两侧,并且两个用于信号输入的焊盘CKI和SDI同位于该连线的一侧,两个用于信号输出的焊盘CKO和SDO同位于该连线的另一侧。
相邻两个焊盘的间距为所述两个焊盘所在侧边边长的1/8~1/2倍。
信号焊盘与与之相邻的焊盘VDD或焊盘GND之间的间距为所在侧边边长的1/6~1/4倍。
所述6个焊盘均呈矩形,并且其长度方向均平行。
所述贴片LED为正方形,焊盘VDD和焊盘GND分布于贴片LED的其中一条对称轴上,4个信号焊盘分布于所在表面的四角。
所述上层尺寸不大于下层的尺寸,上层与下层通过环氧树脂封装为一体。
下层背面涂覆有阻焊层。
上层的中心贯通孔的孔壁上涂覆有反光涂料。
与现有技术相比,本发明提供的专用于透明基板的IC植入式贴片LED具有如下优点:
(1)本发明是为专用于透明电路基板的贴片LED而设计,贴片LED内部植入IC芯片,其驱动和控制均在内部进行,贴片LED之间通过引线连接,传递信号,整体仅需引出两条电源线即可,从而使得透明电路基板上布线数量大大减少,保证透明电路基板的透光性。
(2)本发明是为专用于透明电路基板的贴片LED而设计,贴片LED设计为双层结构,上层和下层均为双面板,焊盘通过过孔导通,上层的中心为镂空结构,恰好将下层中心区域的IC芯片和RGB三色晶片露出,而下层正面的大部分焊盘结构则被上层覆盖,得到保护,由于该上层和下层的外侧面均设有焊盘,并且焊盘均与内部的电气元件连接,因此该贴片LED既可以正向贴装,即下层焊接于玻璃基板上,也可以背向贴装,即上层焊接于玻璃基板上,当采用背贴形式时,贴片LED焊接于玻璃基板外侧面,与人类活动区接触的内侧面上无任何凸出物,玻璃基板将贴片LED与人类活动区隔离,可避免因人类活动误碰落贴片LED,并且玻璃基板内侧面清理方便。
(3)本发明可用于大尺寸电路基板,考虑到贴片机在大尺寸基板上贴片时的累计误差较大,本发明采用6焊盘结构,4个信号焊盘分布于焊盘VDD与焊盘GND连线的两侧,信号焊盘与与之相邻的焊盘VDD或焊盘GND之间的间距为所在侧边边长的1/6~1/4倍,间距较大,满足大尺寸基板的贴片要求,可保证90%以上的良品率,最高可达96%。
(4)本发明是为专用于透明玻璃基电路板的贴片LED而设计,为充分保证玻璃基电路板的通透性,该电路板应尽可能避免导线交叉,否则需要使用电阻跨线,不仅增加的贴片工作量,还影响玻璃基电路板的透光性能,本发明中两个用于信号输入的焊盘CKI和SDI同位于焊盘VDD和焊盘GND的一侧,两个用于信号输出的焊盘CKO和SDO同位于焊盘VDD和焊盘GND的另一侧,此分布结构可避免相邻两个贴片LED之间的信号焊盘连接导线出现环形结构而造成电源导线需要借助电阻跨线,使得电源导线与信号导线分别沿横向和纵向布线,保证电源导线与信号导线布线不冲突。
(5)本发明的贴片LED焊盘方向相同,均为纵向或均为横向,使得采用该焊盘结构的贴片LED更易于制作,并且贴片时易于布线。
(6)本发明的贴片LED的上层与下层通过环氧树脂封装为一体,保证结构的完整,由于该贴片LED可背向贴装,为避免贴片LED在日光照射下变色、老化,避免贴片LED遇雨水冲刷而短路,在下层背面涂覆有阻焊层,保护内部线路;上层的中心贯通孔的孔壁上涂覆有反光涂料,增强该贴片LED的发光效果。
附图说明
图1为本发明提供的专用于透明基板的IC植入式贴片LED的整体结构图。
图2为上层的表面结构图。
图3为下层的正面结构图。
图4为下层的背面结构图。
图5为下层的背面线路图。
其中,100-上层,200-下层,1-焊盘VDD,2-焊盘GND,3-焊盘CKI,4-焊盘CKO,5-焊盘SDI,6-焊盘SDO,7-过孔,8-中心贯通孔,9-RGB三色晶片,10-IC芯片,11-跳线,12-阻焊层。
具体实施方式
下面结合附图和实施例对本发明进行详细具体说明,本发明的内容不局限于以下实施例。
参见图1,本发明提供的专用于透明基板的IC植入式贴片LED,为双层结构,包括上层100和下层200,所述上层100和下层200均为边长2mm的正方形双面板,其正反两面上绕侧边均设有6个焊盘,上层100和下层200的焊盘分布结构相同,6对焊盘在正反两面上的位置一一相对,正反两面上位置相对的两个焊盘通过过孔导通,所述6个焊盘包括2个电源焊盘和4个信号焊盘,6个焊盘均呈竖向分布,2个电源焊盘分别用于接电源的焊盘VDD1和用于接地的焊盘GND2,4个信号焊盘分别为用于脉冲信号输入的焊盘CKI3、用于脉冲信号输出的焊盘CKO4、用于地址码信号输入的焊盘SDI5和用于地址码信号输出的焊盘SDO6,焊盘VDD1和焊盘GND2位于贴片LED的中间位置、其中一条对称轴上,二者间距为0.4mm,4个信号焊盘分布于四角,并且分布于焊盘VDD1与焊盘GND2连线的两侧,两个用于信号输入的焊盘CKI3和SDI5同位于该条对称轴的一侧,二者间距为0.8mm,焊盘CKI3和SDI5与对应的电源焊盘的间距均为0.4mm,两个用于信号输出的焊盘CKO4和SDO6同位于该条对称轴的另一侧,二者间距为0.8mm,焊盘CKO4和SDO6与对应的电源焊盘的间距为0.4mm;
参见图3,所述下层200的中心区域设有IC芯片10和RGB三色晶片9,RGB三色晶片9附着于下层200正面的焊盘VDD1上,IC芯片10附着于下层200正面的焊盘GND2上,该焊盘GND2上引出4条跳线11,分别接至下层200正面的4个信号焊盘CKI3、CKO4、SDI5和SDO6上,实现脉冲信号和地址码信号的输入和输出,该脉冲信号和地址码信号由IC芯片处理后,驱动RGB三色晶片9发光并且控制其发光时刻和发光时长,参见图4和图5,下层200背面涂覆有阻焊层12,覆盖下层200的背面线路;
参见图2,所述上层100为环形结构,上层100贴于下层200上,其中心贯通孔8与下层200的中心区域位置相对,中心贯通孔8中灌注环氧树脂,上层100的中心贯通孔8的孔壁上涂覆有反光涂料,上层100与下层200通过焊盘连接并且通过环氧树脂封装为一体。

Claims (9)

1.一种专用于透明基板的IC植入式贴片LED,其特征在于:为双层结构,包括上层和下层,所述上层和下层均为双面板,其正反两面上绕侧边均设有6个焊盘,上层和下层的焊盘分布结构相同,6对焊盘在正反两面上的位置一一相对,正反两面上位置相对的两个焊盘通过过孔导通,所述6个焊盘包括2个电源焊盘和4个信号焊盘,2个电源焊盘分别为用于接电源的焊盘VDD和用于接地的焊盘GND,4个信号焊盘分别为用于脉冲信号输入的焊盘CKI、用于脉冲信号输出的焊盘CKO、用于地址码信号输入的焊盘SDI和用于地址码信号输出的焊盘SDO;所述下层的中心区域设有IC芯片和RGB三色晶片,RGB三色晶片附着于下层正面的焊盘VDD上,IC芯片附着于下层正面的焊盘GND上,该焊盘GND上引出4条跳线,分别接至下层正面的4个信号焊盘CKI、CKO、SDI和SDO上;所述上层为环形结构,上层贴于下层上,其中心贯通孔与下层的中心区域位置相对,中心贯通孔中灌注封装树脂,上层与下层通过焊盘连接并且通过封装树脂封装为一体。
2.根据权利要求1所述的专用于透明基板的IC植入式贴片LED,其特征在于:所述焊盘VDD和焊盘GND位于贴片LED的中间位置,4个信号焊盘分布于焊盘VDD与焊盘GND连线的两侧,并且两个用于信号输入的焊盘CKI和SDI同位于该连线的一侧,两个用于信号输出的焊盘CKO和SDO同位于该连线的另一侧。
3.根据权利要求2所述的专用于透明基板的IC植入式贴片LED,其特征在于:相邻两个焊盘的间距为所述两个焊盘所在侧边边长的1/8~1/2倍。
4.根据权利要求3所述的专用于透明基板的IC植入式贴片LED,其特征在于:信号焊盘与与之相邻的焊盘VDD或焊盘GND之间的间距为所在侧边边长的1/6~1/4倍。
5.根据权利要求2所述的专用于透明基板的IC植入式贴片LED,其特征在于:所述6个焊盘均呈矩形,并且其长度方向均平行。
6.根据权利要求2所述的专用于透明基板的IC植入式贴片LED,其特征在于:所述贴片LED为正方形,焊盘VDD和焊盘GND分布于贴片LED的其中一条对称轴上,4个信号焊盘分布于所在表面的四角。
7.根据权利要求1所述的专用于透明基板的IC植入式贴片LED,其特征在于:所述上层尺寸不大于下层的尺寸,上层与下层通过环氧树脂封装为一体。
8.根据权利要求1所述的专用于透明基板的IC植入式贴片LED,其特征在于:下层背面涂覆有阻焊层。
9.根据权利要求1所述的专用于透明基板的IC植入式贴片LED,其特征在于:上层的中心贯通孔的孔壁上涂覆有反光涂料。
CN201710266787.XA 2017-04-21 2017-04-21 一种专用于透明基板的ic植入式贴片led Active CN106898605B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710266787.XA CN106898605B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的ic植入式贴片led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710266787.XA CN106898605B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的ic植入式贴片led

Publications (2)

Publication Number Publication Date
CN106898605A CN106898605A (zh) 2017-06-27
CN106898605B true CN106898605B (zh) 2019-06-18

Family

ID=59197054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710266787.XA Active CN106898605B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的ic植入式贴片led

Country Status (1)

Country Link
CN (1) CN106898605B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109873073A (zh) * 2019-04-09 2019-06-11 深圳市华科莱特电子有限公司 倒装透明可卷软膜led显示屏及其生产工艺
CN116013911A (zh) * 2021-10-22 2023-04-25 深圳市晶泓科技有限公司 一种透明led显示屏

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2722440Y (zh) * 2004-09-17 2005-08-31 陈德忠 用于高功率发光二极管的散热与导电的转接基板
CN101409320B (zh) * 2007-10-09 2010-06-23 富士迈半导体精密工业(上海)有限公司 基板制作方法
CN101252163A (zh) * 2008-03-27 2008-08-27 潮州三环(集团)股份有限公司 一种smd高功率led陶瓷封装基座
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20120037935A1 (en) * 2010-08-13 2012-02-16 Wen-Kun Yang Substrate Structure of LED (light emitting diode) Packaging and Method of the same
CN203176800U (zh) * 2013-02-05 2013-09-04 于来强 一种灯驱一体全彩发光二极管
CN203377252U (zh) * 2013-06-25 2014-01-01 东莞勤上光电股份有限公司 一种自带led驱动ic的贴片led
CN205645807U (zh) * 2016-04-26 2016-10-12 永林电子有限公司 一种贴片式触发闪灯ic片
CN106876556B (zh) * 2017-04-21 2019-10-15 武汉华尚绿能科技股份有限公司 一种专用于透明基板的背贴式贴片led

Also Published As

Publication number Publication date
CN106898605A (zh) 2017-06-27

Similar Documents

Publication Publication Date Title
CN106876556B (zh) 一种专用于透明基板的背贴式贴片led
CN101640012B (zh) 一种led显示模块
CN106898605B (zh) 一种专用于透明基板的ic植入式贴片led
KR20190050622A (ko) 반도체 발광 소자를 이용한 차량용 램프
CN203659368U (zh) Led显示屏
CN204905298U (zh) 一种led集成模顶光源
CN208923183U (zh) 一种led光源器件及显示屏
CN111863799A (zh) 一种高密度led智能玻璃显示屏
CN102130277A (zh) 一种发光二极管封装
CN203165419U (zh) 一种全彩透明led显示屏
CN202523333U (zh) Led显示装置
CN212230429U (zh) 一种高密度led智能玻璃显示屏
CN207009478U (zh) 专用于大尺寸透明基板的贴片led及其焊盘结构
JP2004304643A (ja) リモコンセンサユニット及びその製造方法
CN1331237C (zh) 有源式有机发光二极管显示器及其制造方法
CN205546198U (zh) 显示屏及显示装置
CN203465907U (zh) 一种超小点间距smd复合led灯
CN213936230U (zh) 一种应用在透明显示屏的led芯片倒装结构
CN111599911A (zh) 一种led发光单元及显示面板
CN208027049U (zh) 用于lcd的背光源模组
CN220963345U (zh) 一种led显示屏
CN219800842U (zh) 一种带封装结构的显示面板
CN103474000A (zh) 一种超小点间距smd复合led灯
CN204011469U (zh) 发光二极管封装及照明装置
CN202025491U (zh) 一种通透的led显示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220920

Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100

Patentee after: Huashang Optoelectronics Technology Co.,Ltd.

Address before: Room 4901, Minsheng Bank Building, No. 396, Qushui Building, Xinhua Road, Jianghan District, Wuhan City, Hubei Province 430000

Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230811

Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000

Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd.

Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100

Patentee before: Huashang Optoelectronics Technology Co.,Ltd.

TR01 Transfer of patent right