CN203377252U - 一种自带led驱动ic的贴片led - Google Patents

一种自带led驱动ic的贴片led Download PDF

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CN203377252U
CN203377252U CN201320367052.3U CN201320367052U CN203377252U CN 203377252 U CN203377252 U CN 203377252U CN 201320367052 U CN201320367052 U CN 201320367052U CN 203377252 U CN203377252 U CN 203377252U
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led
chip
drive
pole piece
led drive
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阮乃明
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KINGSUN OPTOELECTRONIC CO., LTD.
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Dongguan Kingsun Optoelectronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型涉一种自带LED驱动IC的贴片LED，包括LED支架、LED芯片、正接线极片以及负接线极片，LED支架的顶面设置有容纳凹槽，在容纳凹槽内设置有基板，正接线极片、负接线极片分别安装于LED支架的两侧且穿入容纳凹槽内，还包括有LED驱动IC，所述LED驱动IC和LED芯片均设于基板上，且LED芯片通过金线与LED驱动IC电连接，LED驱动IC的极脚分别与正接线极片、负接线极片电连接；LED驱动IC和LED芯片封装于容纳凹槽内。在使用时，贴片LED直接连通外部电源，LED驱动IC控制LED芯片的电流以及LED芯片的发光强度，实现贴片LED的多彩变幻或者闪烁变化。

Description

一种自带LED驱动IC的贴片LED
技术领域
本实用新型涉及LED技术领域，尤其是指一种自带LED驱动IC的贴片LED。
背景技术
贴片LED是贴于线路板表面的，适合SMT加工，可回流焊；相对于其他封装器件，它有着抗振能力强、焊点缺陷率低、高频特性好等优点，因此广泛应用于照明系统、装饰、电子设备指示器、背光、显示器和器械上。但是现有的贴片LED无法在通电的情况即可实现多彩变幻或者闪烁变化，需要与外部的驱动电路连接才能实现多彩变幻或者闪烁变化。
发明内容
本实用新型针对现有技术的问题提供一种自带LED驱动IC的贴片LED，在使用时，直接连通电源即可实现贴片LED的多彩变幻或者闪烁变化，减小贴片LED应用结构的体积。
为了解决上述技术问题，本实用新型采用如下技术方案：
一种自带LED驱动IC的贴片LED，包括LED支架、LED芯片、正接线极片以及负接线极片，所述LED支架的顶面设置有容纳凹槽，所述容纳凹槽内设置有基板，所述正接线极片、负接线极片分别安装于LED支架的两侧且穿入容纳凹槽内，还包括有LED驱动IC，所述LED驱动IC 和LED芯片均设于基板上，且所述LED芯片通过金线与LED驱动IC电连接，所述LED驱动IC的极脚分别与正接线极片、负接线极片电连接；所述LED驱动IC 和LED芯片通过LED封装胶封装于容纳凹槽内。
其中，所述容纳凹槽至少设置有一颗LED芯片。
进一步的，所述容纳凹槽设置有三个LED芯片，所述三个LED芯片分别通过金线与LED驱动IC电连接。
再进一步的，所述三个LED芯片分别为红光LED芯片、绿光LED芯片和蓝光LED芯片。
其中，所述LED封装胶为环氧树脂、硅胶或硅树脂。
其中，所述基板为PCB板。
本实用新型的有益效果：
    本实用新型所提供的一种自带LED驱动IC的贴片LED，在LED支架的容纳凹槽内同时安装LED驱动IC 和LED芯片，LED驱动IC通过金线与LED芯片连接。在使用时，贴片LED直接连通外部电源，LED驱动IC控制通过LED芯片的电流以及LED芯片的发光强度，即可实现贴片LED的多彩变幻或者闪烁变化；由于省去了外部的传统LED驱动IC，减小了贴片 LED应用结构的体积。
附图说明
图1为实施例一中实现闪烁变化的贴片LED的俯视图。
图2为实施例一中实现闪烁变化的贴片LED的波形示意图。
图3为实施例二中实现多彩变幻的贴片LED的俯视图。
图4为实施例二中实现多彩变幻的贴片LED的波形示意图。
在图1至图4中的附图标记包括：
1—LED支架       2—LED芯片    3—正接线极片
4—负接线极片    5—容纳凹槽   6—LED驱动IC
7—金线。
具体实施方式
为了便于本领域技术人员的理解，下面结合实施例与附图对本实用新型作进一步的说明，实施方式提及的内容并非对本实用新型的限定。参见图1至图4，以下结合附图对本实用新型进行详细的描述。
实施例一。
如图1所示，本实用新型所述的一种自带LED驱动IC的贴片LED，包括LED支架1、LED芯片2、正接线极片3以及负接线极片4，所述LED支架1的顶面设置有容纳凹槽5，所述容纳凹槽5内设置有基板（在附图中未标出），所述正接线极片3、负接线极片4分别安装于LED支架1的两侧且穿入容纳凹槽5内，还包括有LED驱动IC 6，所述LED驱动IC 6和LED芯片2均设于基板上，且所述LED芯片2通过金线7与LED驱动IC 6电连接，所述LED驱动IC 6的极脚分别与正接线极片3、负接线极片4电连接；所述LED驱动IC 6和LED芯片2通过LED封装胶（在附图中未标出）封装于容纳凹槽5内。其中，所述容纳凹槽5至少设置有一颗LED芯片2。在本实施例一中，在容纳凹槽5仅设有一颗LED芯片2。
由图1可见，在LED支架1的容纳凹槽5内同时安装LED驱动IC 6和LED芯片2，LED驱动IC 6通过金线7与LED芯片2连接，而且LED驱动IC 6的极脚分别与正接线极片3、负接线极片4电连接。在使用时，贴片LED直接连通外部电源，LED驱动IC 6控制通过LED芯片2的电流以及LED芯片2的发光强度；LED芯片2的电流变化如图2的波形所示，这实现了贴片LED忽明忽暗的闪烁变化；由于LED驱动IC 6已经安装在贴片 LED的内部，省去了外部的传统LED驱动IC，这样就减小了贴片 LED应用结构的体积。
其中，所述LED封装胶为环氧树脂、硅胶或硅树脂。LED驱动IC 6和LED芯片2通过LED封装胶封装在容纳凹槽5中，可以提高整体结构的紧密性和牢靠度，保证该贴片LED 在高温时稳定的工作性能，LED封装胶为环氧树脂、硅胶或硅树脂，因此可以起到很好的防水效果，能有效地防止贴片LED 的内部电路因进水或断路而损坏。
在本实施例一中，所述基板为PCB板。使用PCB板，可很方便固装LED驱动IC 6和LED芯片2。
实施例二。
如图3所示，本实用新型的实施例三与实施例二的基本结构一致，其区别在于：所述容纳凹槽5设置有三个LED芯片2，构成RGB交叉混光的贴片LED，所述三个LED芯片2分别通过金线7与LED驱动IC 6电连接。再进一步的，所述三个LED芯片2分别为红光LED芯片、绿光LED芯片和蓝光LED芯片。
LED驱动IC 6控制三个LED芯片2的工作电流大小，三种基色光强随电流大小变化，使发出的混合光颜色随之变换。三个LED芯片2的电流变化如图4的波形所示，这实现了贴片LED的多彩变幻。
以上内容仅为本实用新型的较佳实施例，对于本领域的普通技术人员，依据本实用新型的思想，在具体实施方式及应用范围上均会有改变之处，本说明书内容不应理解为对本实用新型的限制。

Claims (6)

1.一种自带LED驱动IC的贴片LED，包括LED支架、LED芯片、正接线极片以及负接线极片，所述LED支架的顶面设置有容纳凹槽，所述容纳凹槽内设置有基板，所述正接线极片、负接线极片分别安装于LED支架的两侧且穿入容纳凹槽内，其特征在于：还包括有LED驱动IC，所述LED驱动IC 和LED芯片均设于基板上，且所述LED芯片通过金线与LED驱动IC电连接，所述LED驱动IC的极脚分别与正接线极片、负接线极片电连接；所述LED驱动IC 和LED芯片通过LED封装胶封装于容纳凹槽内。
2.根据权利要求1所述的一种自带LED驱动IC的贴片LED，其特征在于：所述容纳凹槽至少设置有一颗LED芯片。
3.根据权利要求2所述的一种自带LED驱动IC的贴片LED，其特征在于：所述容纳凹槽设置有三个LED芯片，所述三个LED芯片分别通过金线与LED驱动IC电连接。
4.根据权利要求3所述的一种自带LED驱动IC的贴片LED，其特征在于：所述三个LED芯片分别为红光LED芯片、绿光LED芯片和蓝光LED芯片。
5.根据权利要求1所述的一种自带LED驱动IC的贴片LED，其特征在于：所述LED封装胶为环氧树脂、硅胶或硅树脂。
6.根据权利要求1所述的一种自带LED驱动IC的贴片LED，其特征在于：所述基板为PCB板。
CN201320367052.3U 2013-06-25 2013-06-25 一种自带led驱动ic的贴片led Expired - Fee Related CN203377252U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105609620A (zh) * 2015-11-26 2016-05-25 东莞市盈伸电子科技有限公司 一种led光引擎封装结构
CN106898605A (zh) * 2017-04-21 2017-06-27 武汉华尚绿能科技股份有限公司 一种专用于透明基板的ic植入式贴片led
CN107293497A (zh) * 2016-04-01 2017-10-24 华润矽威科技（上海）有限公司 一种ic芯片封装方法及结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105609620A (zh) * 2015-11-26 2016-05-25 东莞市盈伸电子科技有限公司 一种led光引擎封装结构
CN107293497A (zh) * 2016-04-01 2017-10-24 华润矽威科技（上海）有限公司 一种ic芯片封装方法及结构
CN106898605A (zh) * 2017-04-21 2017-06-27 武汉华尚绿能科技股份有限公司 一种专用于透明基板的ic植入式贴片led

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