CN106876556A - 一种专用于透明基板的背贴式贴片led - Google Patents

一种专用于透明基板的背贴式贴片led Download PDF

Info

Publication number
CN106876556A
CN106876556A CN201710266713.6A CN201710266713A CN106876556A CN 106876556 A CN106876556 A CN 106876556A CN 201710266713 A CN201710266713 A CN 201710266713A CN 106876556 A CN106876556 A CN 106876556A
Authority
CN
China
Prior art keywords
upper strata
lower floor
paster led
pad
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710266713.6A
Other languages
English (en)
Other versions
CN106876556B (zh
Inventor
刘联家
盖庆亮
尤晓江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Huashang Green Technology Co ltd
Original Assignee
Wuhan Wosun Lvneng Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Wosun Lvneng Polytron Technologies Inc filed Critical Wuhan Wosun Lvneng Polytron Technologies Inc
Priority to CN201710266713.6A priority Critical patent/CN106876556B/zh
Publication of CN106876556A publication Critical patent/CN106876556A/zh
Application granted granted Critical
Publication of CN106876556B publication Critical patent/CN106876556B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

本发明涉及一种专用于透明基板的背贴式贴片LED，包括上层和下层，下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通；上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体；该贴片LED可以背向贴装，玻璃基板将贴片LED与人类活动区隔离，可避免人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。

Description

一种专用于透明基板的背贴式贴片LED
技术领域
本发明涉及一种贴片LED，具体涉及一种植入IC的贴片LED，属于贴片LED技术领域。
背景技术
现有贴片LED仅能正向安装，即贴片LED安装于电路板的正面，贴片LED的发光面即正面朝外，背面焊接于电路板上，此安装结构在普通PCB电路板上应用不会产生什么问题，由于普通PCB电路板封装于机器中，难以进入灰尘杂物，不存在清洗的问题，但是对于透明电路基板，尤其是玻璃基电路板，是用于室外、对采光性有要求的场所，与空气中的颗粒物直接接触，玻璃上久而会堆积灰尘或因人类活动弄脏玻璃表面，影响玻璃基板透光性，因此需要定期清洗电路板的贴附有贴片元件的侧面，由于贴片LED本身尺寸较小，多为2mm*2mm或3mm*3mm，焊接强度不足，在清洗过程中很容易被清洗工具擦落，使用持久性问题突出。
发明内容
本发明的目的是克服现有贴片LED的不足，而提供一种可以反向贴装的贴片LED，该贴片LED可以安装于玻璃基板的背面，玻璃基板将贴片LED与人类活动区隔离，可避免因人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。
实现本发明目的所采用的技术方案为，一种专用于透明基板的背贴式贴片LED，为双层结构，包括上层和下层，所述下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通；所述上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；所述上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体。
所述各焊盘均呈矩形，并且其长度方向均平行。
所述上层尺寸不大于下层的尺寸，上层与下层通过环氧树脂封装为一体。
下层背面涂覆有阻焊层。
上层的中心贯通孔的孔壁上涂覆有反光涂料。
与现有技术相比，本发明提供的专用于透明基板的背贴式贴片LED具有如下优点：
(1)本发明是为专用于透明电路基板的贴片LED而设计，贴片LED设计为双层结构，上层为双面板，焊盘通过过孔导通，上层的中心为镂空结构，恰好将下层中心区域RGB三色晶片露出，而下层正面的大部分焊盘结构则被上层覆盖，得到保护，由于该上层的正反两面以及下层的正面均设有焊盘，并且焊盘均与内部的电气元件连接，因此该贴片LED可以背向贴装，即上层焊接于玻璃基板上，贴片LED焊接于玻璃基板外侧面，与人类活动区接触的内侧面上无任何凸出物，玻璃基板将贴片LED与人类活动区隔离，可避免因人类活动误碰落贴片LED，并且玻璃基板内侧面清理方便。
(2)本发明的贴片LED焊盘方向相同，均为纵向或均为横向，使得采用该焊盘结构的贴片LED更易于制作，并且贴片时易于布线。
(3)本发明的贴片LED的上层与下层通过环氧树脂封装为一体，保证结构的完整，由于该贴片LED为背向贴装，为避免贴片LED在日光照射下变色、老化，避免贴片LED遇雨水冲刷而短路，在下层背面涂覆有阻焊层，保护内部线路；上层的中心贯通孔的孔壁上涂覆有反光涂料，增强该贴片LED的发光效果。
附图说明
图1为本发明提供的专用于透明基板的背贴式贴片LED的整体结构图。
图2为下层的正面结构图。
其中，100-上层，200-下层，1-焊盘VDD，2-焊盘GND，3-焊盘CKI，4-焊盘CKO，5-焊盘SDI，6-焊盘SDO，7-过孔，8-中心贯通孔，9-RGB三色晶片，10-IC芯片，11-跳线。
具体实施方式
下面以内置IC芯片的贴片LED为例，结合附图和实施例对本发明进行详细具体说明，本发明的内容不局限于以下实施例。
参见图1，本发明提供的专用于透明基板的背贴式贴片LED，为双层结构，包括上层100和下层200；所述上层100为外方内圆的环形结构，边长为2mm，上层100贴于下层200上，其中心贯通孔8与下层200的中心区域位置相对，中心贯通孔8中灌注环氧树脂，上层100的中心贯通孔8的孔壁上涂覆有反光涂料，上层100与下层200通过焊盘连接并且通过环氧树脂封装为一体；
所述上层100为双面板，其正反两面上绕侧边均设有6个焊盘，6对焊盘在正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔7导通，所述6个焊盘包括2个电源焊盘和4个信号焊盘，6个焊盘均呈竖向分布，2个电源焊盘分别用于接电源的焊盘VDD1和用于接地的焊盘GND2，4个信号焊盘分别为用于脉冲信号输入的焊盘CKI3、用于脉冲信号输出的焊盘CKO4、用于地址码信号输入的焊盘SDI5和用于地址码信号输出的焊盘SDO6，焊盘VDD1和焊盘GND2位于贴片LED的中间位置、其中一条对称轴上，二者间距为0.4mm，4个信号焊盘分布于四角，并且分布于焊盘VDD1与焊盘GND2连线的两侧，两个用于信号输入的焊盘CKI3和SDI5同位于该条对称轴的一侧，二者间距为0.8mm，焊盘CKI3和SDI5与对应的电源焊盘的间距均为0.4mm，两个用于信号输出的焊盘CKO4和SDO6同位于该条对称轴的另一侧，二者间距为0.8mm，焊盘CKO4和SDO6与对应的电源焊盘的间距为0.4mm；
参见图2，所述下层200同为边长2mm的正方形板，下层200的正面上同样设有上述6个焊盘，下层200与上层100的焊盘分布结构相同，所述下层200的中心区域设有IC芯片10和RGB三色晶片9，RGB三色晶片9附着于下层200的焊盘VDD1上，IC芯片10附着于下层200的焊盘GND2上，该焊盘GND2上引出4条跳线11，分别接至下层200的4个信号焊盘CKI3、CKO4、SDI5和SDO6上，实现脉冲信号和地址码信号的输入和输出，该脉冲信号和地址码信号由IC芯片处理后，驱动RGB三色晶片9发光并且控制其发光时刻和发光时长，下层200背面涂覆有阻焊层12，保护下层200的背面，防止下层200的背面受日晒而氧化变色。

Claims (5)

1.一种专用于透明基板的背贴式贴片LED，其特征在于：为双层结构，包括上层和下层，所述下层的正面上设有2个以上焊盘，下层的中心区域设有RGB三色晶片，RGB三色晶片与焊盘导通；所述上层为双面板，其正反两面上均设有2个以上焊盘，上层的焊盘在上层正反两面上的位置一一相对，正反两面上位置相对的两个焊盘通过过孔导通，上层与下层的焊盘数量以及分布结构均相同；所述上层为环形结构，上层贴于下层上，其中心贯通孔与下层的RGB三色晶片位置相对，中心贯通孔中灌注封装树脂，上层与下层通过焊盘连接并且通过封装树脂封装为一体。
2.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：所述各焊盘均呈矩形，并且其长度方向均平行。
3.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：所述上层尺寸不大于下层的尺寸，上层与下层通过环氧树脂封装为一体。
4.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：下层背面涂覆有阻焊层。
5.根据权利要求1所述的专用于透明基板的背贴式贴片LED，其特征在于：上层的中心贯通孔的孔壁上涂覆有反光涂料。
CN201710266713.6A 2017-04-21 2017-04-21 一种专用于透明基板的背贴式贴片led Active CN106876556B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710266713.6A CN106876556B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的背贴式贴片led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710266713.6A CN106876556B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的背贴式贴片led

Publications (2)

Publication Number Publication Date
CN106876556A true CN106876556A (zh) 2017-06-20
CN106876556B CN106876556B (zh) 2019-10-15

Family

ID=59163647

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710266713.6A Active CN106876556B (zh) 2017-04-21 2017-04-21 一种专用于透明基板的背贴式贴片led

Country Status (1)

Country Link
CN (1) CN106876556B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106898605A (zh) * 2017-04-21 2017-06-27 武汉华尚绿能科技股份有限公司 一种专用于透明基板的ic植入式贴片led
CN109860163A (zh) * 2019-01-30 2019-06-07 武汉华尚绿能科技股份有限公司 一种双面发光灯芯一体led
CN109935676A (zh) * 2017-12-18 2019-06-25 罗姆股份有限公司 半导体发光器件
CN111180431A (zh) * 2020-01-06 2020-05-19 弘凯光电(深圳)有限公司 双面显示封装结构
WO2022267134A1 (zh) * 2021-06-24 2022-12-29 中国地质大学（武汉） 滑坡深部大变形监测柔性传感条带封装结构与监测方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077318A (ja) * 2001-09-03 2003-03-14 Toyoda Gosei Co Ltd Ｌｅｄランプ
CN101252163A (zh) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 一种smd高功率led陶瓷封装基座
CN102376852A (zh) * 2010-08-13 2012-03-14 金龙国际公司 发光二极管封装的基板结构及其制造方法
CN203300690U (zh) * 2013-04-10 2013-11-20 中国科学院半导体研究所 一种表面贴装led用的陶瓷外壳
CN205680373U (zh) * 2016-05-30 2016-11-09 深圳市奥蕾达科技有限公司 一种新型的全彩led发光面板及其显示屏

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077318A (ja) * 2001-09-03 2003-03-14 Toyoda Gosei Co Ltd Ｌｅｄランプ
CN101252163A (zh) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 一种smd高功率led陶瓷封装基座
CN102376852A (zh) * 2010-08-13 2012-03-14 金龙国际公司 发光二极管封装的基板结构及其制造方法
CN203300690U (zh) * 2013-04-10 2013-11-20 中国科学院半导体研究所 一种表面贴装led用的陶瓷外壳
CN205680373U (zh) * 2016-05-30 2016-11-09 深圳市奥蕾达科技有限公司 一种新型的全彩led发光面板及其显示屏

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106898605A (zh) * 2017-04-21 2017-06-27 武汉华尚绿能科技股份有限公司 一种专用于透明基板的ic植入式贴片led
CN109935676A (zh) * 2017-12-18 2019-06-25 罗姆股份有限公司 半导体发光器件
CN109935676B (zh) * 2017-12-18 2021-06-25 罗姆股份有限公司 半导体发光器件
CN109860163A (zh) * 2019-01-30 2019-06-07 武汉华尚绿能科技股份有限公司 一种双面发光灯芯一体led
CN111180431A (zh) * 2020-01-06 2020-05-19 弘凯光电(深圳)有限公司 双面显示封装结构
CN111180431B (zh) * 2020-01-06 2022-03-15 弘凯光电(深圳)有限公司 双面显示封装结构
WO2022267134A1 (zh) * 2021-06-24 2022-12-29 中国地质大学（武汉） 滑坡深部大变形监测柔性传感条带封装结构与监测方法

Also Published As

Publication number Publication date
CN106876556B (zh) 2019-10-15

Similar Documents

Publication Publication Date Title
CN106876556A (zh) 一种专用于透明基板的背贴式贴片led
CN105609621A (zh) 360度光源封装装置
MY159521A (en) Resin-sealed light emitting device and its manufacturing method
CN208045002U (zh) 高对比度集成封装显示模组结构
CN203659368U (zh) Led显示屏
JP2004172160A (ja) 発光素子
US7589338B2 (en) Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice
CN210403725U (zh) 发光二极管封装组件
CN104075194A (zh) 一种背光光源组件、背光模组、液晶模组及制作方法
CN111029456A (zh) 集成封装显示模组
CN106898605A (zh) 一种专用于透明基板的ic植入式贴片led
CN215117079U (zh) 一种led光源模组及发光面板
CN110289347A (zh) 模制led显示模块及其制造方法
CN207637840U (zh) 一种高对比度集成封装显示模组结构
CN208923183U (zh) 一种led光源器件及显示屏
CN216354207U (zh) 一种发光半导体透明显示面板
CN210167355U (zh) 透明显示屏及其led光源
CN206601718U (zh) 一种指纹模组及触控终端
CN207398144U (zh) 一种led器件、显示模组及显示屏
CN207009478U (zh) 专用于大尺寸透明基板的贴片led及其焊盘结构
CN212230429U (zh) 一种高密度led智能玻璃显示屏
CN213936230U (zh) 一种应用在透明显示屏的led芯片倒装结构
CN208908222U (zh) 一种led封装结构
CN209232787U (zh) 一种chip型led封装器件
CN1331237C (zh) 有源式有机发光二极管显示器及其制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220923

Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100

Patentee after: Huashang Optoelectronics Technology Co.,Ltd.

Address before: Room 4901, Minsheng Bank Building, No. 396, Qushui Building, Xinhua Road, Jianghan District, Wuhan City, Hubei Province 430000

Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230809

Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000

Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd.

Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100

Patentee before: Huashang Optoelectronics Technology Co.,Ltd.