CN106854447A - 一种纳米银导电胶的制备方法 - Google Patents

一种纳米银导电胶的制备方法 Download PDF

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CN106854447A
CN106854447A CN201611096525.5A CN201611096525A CN106854447A CN 106854447 A CN106854447 A CN 106854447A CN 201611096525 A CN201611096525 A CN 201611096525A CN 106854447 A CN106854447 A CN 106854447A
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silver
conductive glue
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潘中海
司荣美
刘彩风
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Tianjin Baoxingwei Technology Co Ltd
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Abstract

本发明提供一种纳米银导电胶的制备方法，包括以下步骤：①取10重量份的无水乙醇，加入到250重量份的0.01mol/L的硝酸银溶液中，加入聚乙烯吡咯烷酮，在60℃下搅拌30分钟，边搅拌边滴加5％水合肼，至沉淀不再产生，用去离子水和乙醇洗涤数次至pH值呈中性，在35℃下真空干燥至恒重，得到纳米银粉末；②以环氧树脂作基体，加入邻苯二甲酸二丁酯，再加入微米银粉和上述纳米银粉，放入搅拌脱泡装置搅拌30min，按环氧树脂/三乙醇胺重量比100/15加入三乙醇胺，再次放入搅拌脱泡装置搅拌30min，制得纳米银导电胶；③将纳米银导电胶静置6h使其预固化，然后放入干燥箱在80℃下恒温放置4h使其完全固化。

Description

一种纳米银导电胶的制备方法
技术领域
本发明涉及纳米银在微电子封装领域的应用，尤其涉及一种纳米银导电胶的制备方法。
背景技术
微电子技术自产业化以来，经历了高速的革新和发展。作为微电子技术的重要核心，微电子封装技术正朝着绿色化、精密化的方向演进。Sn-Pb钎料广泛应用于封装连接，但由于铅对于环境和人类健康的不利影响，其在世界各国已逐渐被限制或禁止使用，而代之以无铅封装材料，导电胶便是Sn-Pb钎料较为理想的替代品。线分辨率高是导电胶封装的优势，由于不存在Sn-Pb钎料在高密度封装时易产生的连焊现象，导电胶印刷的最小线条间距可显著降低，这在集成电路I/O密度不断提高的背景下具有重要意义。此外，使用导电胶还具有封装温度低、适用于柔性基板、接头减震性强等一系列优点。
金属银是常用金属中电导率和热导率最高的材料，性质稳定、氧化缓慢且其氧化物也具有导电性，加上价格适中，因此银是最广泛使用的导电胶填料之一，目前市售银导电胶的导电填料以微米银粉为主，存在的主要问题是银的用量较大、电导率低，制约了银系导电胶的高端应用。纳米银具有尺寸均匀，容易复合，可减少贵金属银使用量，节约成本等优点。纳米银导电膜触摸屏是近年来兴起的一种新产品，纳米银导电膜触摸屏的制作工艺包括黄光工艺，黄光工艺要求纳米银导电胶具有良好的导电性和连接性能，因此，制备满足要求的纳米银导电胶是利用黄光工艺制作纳米银导电膜触摸屏的重要一环。
发明内容
本发明旨在解决现有技术的不足，满足纳米银在导电胶中的应用，而提供一种纳米银导电胶的制备方法。
本发明为实现上述目的，采用以下技术方案：一种纳米银导电胶的制备方法，包括以下步骤：
①制备纳米银粉：取10重量份的无水乙醇，加入到250重量份的0.01mol/L的硝酸银溶液中，加入聚乙烯吡咯烷酮(PVP)，在60℃下搅拌30分钟，使其混合充分，然后边搅拌边滴加5％水合肼，直至沉淀不再产生，溶液变澄清，用去离子水和乙醇洗涤数次至pH值呈中性，在35℃下真空干燥至恒重，得到灰白色纳米银粉末；
②制备纳米银导电胶：以环氧树脂作基体，加入增塑剂邻苯二甲酸二丁酯，再加入微米银粉和上述纳米银粉，放入游星式搅拌脱泡装置以1440r/min的速度搅拌30min，按环氧树脂/三乙醇胺重量比100/15加入三乙醇胺作固化剂，再次放入游星式搅拌脱泡装置搅拌30min，制得纳米银导电胶；
③纳米银导电胶的固化：将制得的纳米银导电胶静置6h使其预固化，然后放入干燥箱在80℃下恒温放置4h使其完全固化。
本发明的有益效果是：利用本发明制得的纳米银导电胶，导电性能和连接性能好，相比微米银导电胶，大大减少了银的用量，节约了资源，减少了生产成本，能取得良好的社会效益。
具体实施方式
下面结合实施例对本发明作进一步说明：
本发明提供一种纳米银导电胶的制备方法，包括以下步骤：
①制备纳米银粉：取10重量份的无水乙醇，加入到250重量份的0.01mol/L的硝酸银溶液中，加入聚乙烯吡咯烷酮(PVP)，在60℃下搅拌30分钟，使其混合充分，然后边搅拌边滴加5％水合肼，直至沉淀不再产生，溶液变澄清，用去离子水和乙醇洗涤数次至pH值呈中性，在35℃下真空干燥至恒重，得到灰白色纳米银粉末；
②制备纳米银导电胶：以环氧树脂作基体，加入增塑剂邻苯二甲酸二丁酯，再加入微米银粉和上述纳米银粉，放入游星式搅拌脱泡装置以1440r/min的速度搅拌30min，按环氧树脂/三乙醇胺重量比100/15加入三乙醇胺作固化剂，再次放入游星式搅拌脱泡装置搅拌30min，制得纳米银导电胶；
③纳米银导电胶的固化：将制得的纳米银导电胶静置6h使其预固化，然后放入干燥箱在80℃下恒温放置4h使其完全固化。
上面对本发明进行了示例性描述，显然本发明具体实现并不受上述方式的限制，只要采用了本发明的方法构思和技术方案进行的各种改进，或未经改进直接应用于其它场合的，均在本发明的保护范围之内。

Claims (1)

1.一种纳米银导电胶的制备方法，其特征在于，包括以下步骤：
①制备纳米银粉：取10重量份的无水乙醇，加入到250重量份的0.01mol/L的硝酸银溶液中，加入聚乙烯吡咯烷酮(PVP)，在60℃下搅拌30分钟，使其混合充分，然后边搅拌边滴加5％水合肼，直至沉淀不再产生，溶液变澄清，用去离子水和乙醇洗涤数次至pH值呈中性，在35℃下真空干燥至恒重，得到灰白色纳米银粉末；
②制备纳米银导电胶：以环氧树脂作基体，加入增塑剂邻苯二甲酸二丁酯，再加入微米银粉和上述纳米银粉，放入游星式搅拌脱泡装置以1440r/min的速度搅拌30min，按环氧树脂/三乙醇胺重量比100/15加入三乙醇胺作固化剂，再次放入游星式搅拌脱泡装置搅拌30min，制得纳米银导电胶；
③纳米银导电胶的固化：将制得的纳米银导电胶静置6h使其预固化，然后放入干燥箱在80℃下恒温放置4h使其完全固化。
CN201611096525.5A 2016-12-02 2016-12-02 一种纳米银导电胶的制备方法 Pending CN106854447A (zh)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101215450A (zh) * 2008-01-08 2008-07-09 上海大学 添加短棒状纳米银粉的导电胶及其制备方法
CN102311714A (zh) * 2011-08-24 2012-01-11 浙江科创新材料科技有限公司 一种纳米银填充高导热导电胶及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101215450A (zh) * 2008-01-08 2008-07-09 上海大学 添加短棒状纳米银粉的导电胶及其制备方法
CN102311714A (zh) * 2011-08-24 2012-01-11 浙江科创新材料科技有限公司 一种纳米银填充高导热导电胶及其制备方法

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Application publication date: 20170616