CN106717135B - 印刷电路板和印刷电路板布置 - Google Patents

印刷电路板和印刷电路板布置 Download PDF

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Publication number
CN106717135B
CN106717135B CN201580051815.5A CN201580051815A CN106717135B CN 106717135 B CN106717135 B CN 106717135B CN 201580051815 A CN201580051815 A CN 201580051815A CN 106717135 B CN106717135 B CN 106717135B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
conductive
carrier
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580051815.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN106717135A (zh
Inventor
R.G.康拉德斯
H.胡伊斯曼
C.德佩
X.古
G.赫尤斯勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongkuai Optoelectronic Device Co ltd
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN106717135A publication Critical patent/CN106717135A/zh
Application granted granted Critical
Publication of CN106717135B publication Critical patent/CN106717135B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
CN201580051815.5A 2014-09-24 2015-09-24 印刷电路板和印刷电路板布置 Active CN106717135B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14186224 2014-09-24
EP14186224.3 2014-09-24
PCT/EP2015/072033 WO2016046339A1 (en) 2014-09-24 2015-09-24 Printed circuit board and printed circuit board arrangement

Publications (2)

Publication Number Publication Date
CN106717135A CN106717135A (zh) 2017-05-24
CN106717135B true CN106717135B (zh) 2019-09-27

Family

ID=51585046

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580051815.5A Active CN106717135B (zh) 2014-09-24 2015-09-24 印刷电路板和印刷电路板布置

Country Status (5)

Country Link
US (1) US10129986B2 (https=)
EP (1) EP3199003B1 (https=)
JP (1) JP6600353B2 (https=)
CN (1) CN106717135B (https=)
WO (1) WO2016046339A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889355B (zh) * 2017-11-10 2020-12-01 Oppo广东移动通信有限公司 一种电路板组件以及电子设备
EP3512313A1 (de) * 2018-01-16 2019-07-17 ZKW Group GmbH Leiterplattenanordnung
CN108235597B (zh) * 2018-02-08 2024-02-23 惠州奔达电子有限公司 一种pcb的制作方法及pcb
US11122692B1 (en) * 2020-06-11 2021-09-14 Raytheon Company Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
US20250149416A1 (en) * 2023-11-02 2025-05-08 Micron Technology, Inc. Semiconductor assemblies with wire-bonded traces, and methods for making the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281627A (en) * 1964-04-08 1966-10-25 Gen Electric Circuit board connecting and mounting arrangement
WO2006067028A3 (de) * 2004-12-22 2006-08-31 Endress & Hauser Gmbh & Co Kg Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten
US7771206B2 (en) * 2008-09-11 2010-08-10 Qimonda Ag Horizontal dual in-line memory modules

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DE4136355A1 (de) * 1991-11-05 1993-05-06 Smt & Hybrid Gmbh, O-8010 Dresden, De Verfahren und anordnung zur dreidimensionalen montage von elektronischen bauteilen und sensoren
US5313096A (en) 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
JPH081977B2 (ja) * 1993-08-16 1996-01-10 日本電気株式会社 基板の接続構造
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5675180A (en) * 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6594152B2 (en) 1999-09-30 2003-07-15 Intel Corporation Board-to-board electrical coupling with conductive band
JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法
NO20001360D0 (no) * 2000-03-15 2000-03-15 Thin Film Electronics Asa Vertikale elektriske forbindelser i stabel
JP2004063569A (ja) * 2002-07-25 2004-02-26 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2004221372A (ja) * 2003-01-16 2004-08-05 Seiko Epson Corp 半導体装置、半導体モジュール、電子機器、半導体装置の製造方法および半導体モジュールの製造方法
JP2007513490A (ja) * 2003-10-16 2007-05-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コイル構成体
JP2007027287A (ja) * 2005-07-14 2007-02-01 Renesas Technology Corp 半導体装置およびその製造方法
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
US7906853B2 (en) * 2007-09-06 2011-03-15 Micron Technology, Inc. Package structure for multiple die stack
JP2009094432A (ja) * 2007-10-12 2009-04-30 Toshiba Corp 積層型半導体パッケージの製造方法
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
JP5126002B2 (ja) * 2008-11-11 2013-01-23 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
KR101053140B1 (ko) * 2009-04-10 2011-08-02 주식회사 하이닉스반도체 적층 반도체 패키지
US20100294546A1 (en) 2009-05-22 2010-11-25 Sean Nickel Circuit board and method for a low profile wire connection
US20120075822A1 (en) 2010-09-29 2012-03-29 Pacesetter, Inc. Organic printed circuit board having reinforced edge for use with wire bonding technology
JP2014022486A (ja) * 2012-07-17 2014-02-03 Tokai Rika Co Ltd ワイヤボンディング構造、及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281627A (en) * 1964-04-08 1966-10-25 Gen Electric Circuit board connecting and mounting arrangement
WO2006067028A3 (de) * 2004-12-22 2006-08-31 Endress & Hauser Gmbh & Co Kg Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten
US7771206B2 (en) * 2008-09-11 2010-08-10 Qimonda Ag Horizontal dual in-line memory modules

Also Published As

Publication number Publication date
EP3199003B1 (en) 2021-01-06
JP6600353B2 (ja) 2019-10-30
US20180220536A1 (en) 2018-08-02
CN106717135A (zh) 2017-05-24
WO2016046339A1 (en) 2016-03-31
US10129986B2 (en) 2018-11-13
EP3199003A1 (en) 2017-08-02
JP2017530556A (ja) 2017-10-12

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200701

Address after: Ulm

Patentee after: Tongkuai optoelectronic device Co.,Ltd.

Address before: Eindhoven, Netherlands

Patentee before: Royal Philips Co.,Ltd.