CN106661427B - 用于铝抛光的化学机械抛光浆料组合物和方法 - Google Patents

用于铝抛光的化学机械抛光浆料组合物和方法 Download PDF

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Publication number
CN106661427B
CN106661427B CN201580033196.7A CN201580033196A CN106661427B CN 106661427 B CN106661427 B CN 106661427B CN 201580033196 A CN201580033196 A CN 201580033196A CN 106661427 B CN106661427 B CN 106661427B
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polishing
aluminum
acid
composition
alumina
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Chinese (zh)
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CN106661427A (zh
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吕龙岱
刘文政
陈瑞清
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals
    • C23F3/03—Light metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201580033196.7A 2014-06-20 2015-06-18 用于铝抛光的化学机械抛光浆料组合物和方法 Active CN106661427B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462015084P 2014-06-20 2014-06-20
US62/015,084 2014-06-20
PCT/US2015/036477 WO2015195946A1 (en) 2014-06-20 2015-06-18 Cmp slurry compositions and methods for aluminum polishing

Publications (2)

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CN106661427A CN106661427A (zh) 2017-05-10
CN106661427B true CN106661427B (zh) 2019-06-28

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Country Link
US (1) US20150368515A1 (enExample)
JP (1) JP6800418B2 (enExample)
KR (2) KR102783735B1 (enExample)
CN (1) CN106661427B (enExample)
TW (1) TWI561620B (enExample)
WO (1) WO2015195946A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9359686B1 (en) 2015-01-09 2016-06-07 Apple Inc. Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys
US20160289858A1 (en) * 2015-04-03 2016-10-06 Apple Inc. Process to mitigate grain texture differential growth rates in mirror-finish anodized aluminum
US11352708B2 (en) 2016-08-10 2022-06-07 Apple Inc. Colored multilayer oxide coatings
US11242614B2 (en) 2017-02-17 2022-02-08 Apple Inc. Oxide coatings for providing corrosion resistance on parts with edges and convex features
US11043151B2 (en) * 2017-10-03 2021-06-22 Cmc Materials, Inc. Surface treated abrasive particles for tungsten buff applications
JP7034667B2 (ja) * 2017-10-24 2022-03-14 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
KR102533083B1 (ko) * 2017-12-18 2023-05-17 주식회사 케이씨텍 다결정실리콘을 함유하는 웨이퍼의 연마 슬러리 조성물
US11549191B2 (en) 2018-09-10 2023-01-10 Apple Inc. Corrosion resistance for anodized parts having convex surface features
CN113710761B (zh) * 2019-04-17 2024-04-09 Cmc材料有限责任公司 用于钨擦光应用的经表面涂覆的研磨剂颗粒
CN111020590A (zh) * 2019-11-25 2020-04-17 昆山兰博旺新材料技术服务有限公司 环保型铝合金化学抛光液
JP7697781B2 (ja) * 2020-03-25 2025-06-24 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法、研磨方法および半導体基板の製造方法
TWI883133B (zh) * 2020-03-25 2025-05-11 日商福吉米股份有限公司 研磨用組合物、其製造方法、研磨方法及半導體基板的製造方法
CN115198275B (zh) * 2022-06-07 2024-02-09 湖北奥美伦科技有限公司 一种砂面铝合金掩蔽剂及其制备方法和应用
CN117327450A (zh) * 2023-09-21 2024-01-02 浙江芯秦微电子科技有限公司 一种抛光液的制备方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
CN1296049A (zh) * 1999-11-12 2001-05-23 第一毛织株式会社 用于化学机械抛光的组合物
CN101978019A (zh) * 2008-03-21 2011-02-16 卡伯特微电子公司 用于抛光镶嵌结构中的铝/铜和钛的组合物

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Publication number Priority date Publication date Assignee Title
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US20060096179A1 (en) * 2004-11-05 2006-05-11 Cabot Microelectronics Corporation CMP composition containing surface-modified abrasive particles
US9343330B2 (en) * 2006-12-06 2016-05-17 Cabot Microelectronics Corporation Compositions for polishing aluminum/copper and titanium in damascene structures
CN101802125B (zh) * 2007-09-21 2013-11-06 卡伯特微电子公司 使用经氨基硅烷处理的研磨剂颗粒的抛光组合物和方法
GB2478250B (en) * 2008-12-22 2014-09-03 Kao Corp Polishing liquid composition for magnetic-disk substrate
JP5613422B2 (ja) * 2010-02-12 2014-10-22 花王株式会社 磁気ディスク基板用研磨液組成物
US20130005149A1 (en) * 2010-02-22 2013-01-03 Basf Se Chemical-mechanical planarization of substrates containing copper, ruthenium, and tantalum layers
US8623766B2 (en) * 2011-09-20 2014-01-07 Cabot Microelectronics Corporation Composition and method for polishing aluminum semiconductor substrates
JP6050934B2 (ja) * 2011-11-08 2016-12-21 株式会社フジミインコーポレーテッド 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1296049A (zh) * 1999-11-12 2001-05-23 第一毛织株式会社 用于化学机械抛光的组合物
CN101978019A (zh) * 2008-03-21 2011-02-16 卡伯特微电子公司 用于抛光镶嵌结构中的铝/铜和钛的组合物

Also Published As

Publication number Publication date
JP6800418B2 (ja) 2020-12-16
TWI561620B (en) 2016-12-11
JP2017527446A (ja) 2017-09-21
WO2015195946A1 (en) 2015-12-23
KR20170023080A (ko) 2017-03-02
KR102783735B1 (ko) 2025-03-21
TW201600591A (zh) 2016-01-01
CN106661427A (zh) 2017-05-10
KR20230007519A (ko) 2023-01-12
US20150368515A1 (en) 2015-12-24

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