TWI561620B - Cmp slurry compositions and methods for aluminum polishing - Google Patents

Cmp slurry compositions and methods for aluminum polishing

Info

Publication number
TWI561620B
TWI561620B TW104115074A TW104115074A TWI561620B TW I561620 B TWI561620 B TW I561620B TW 104115074 A TW104115074 A TW 104115074A TW 104115074 A TW104115074 A TW 104115074A TW I561620 B TWI561620 B TW I561620B
Authority
TW
Taiwan
Prior art keywords
methods
cmp slurry
slurry compositions
aluminum polishing
polishing
Prior art date
Application number
TW104115074A
Other languages
English (en)
Other versions
TW201600591A (zh
Inventor
Lung Tai Lu
Wen Cheng Liu
Jiu Ching Chen
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW201600591A publication Critical patent/TW201600591A/zh
Application granted granted Critical
Publication of TWI561620B publication Critical patent/TWI561620B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals
    • C23F3/03—Light metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104115074A 2014-06-20 2015-05-12 Cmp slurry compositions and methods for aluminum polishing TWI561620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201462015084P 2014-06-20 2014-06-20

Publications (2)

Publication Number Publication Date
TW201600591A TW201600591A (zh) 2016-01-01
TWI561620B true TWI561620B (en) 2016-12-11

Family

ID=54869067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104115074A TWI561620B (en) 2014-06-20 2015-05-12 Cmp slurry compositions and methods for aluminum polishing

Country Status (6)

Country Link
US (1) US20150368515A1 (zh)
JP (1) JP6800418B2 (zh)
KR (2) KR20230007519A (zh)
CN (1) CN106661427B (zh)
TW (1) TWI561620B (zh)
WO (1) WO2015195946A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9359686B1 (en) 2015-01-09 2016-06-07 Apple Inc. Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys
US20160289858A1 (en) * 2015-04-03 2016-10-06 Apple Inc. Process to mitigate grain texture differential growth rates in mirror-finish anodized aluminum
US11352708B2 (en) 2016-08-10 2022-06-07 Apple Inc. Colored multilayer oxide coatings
US11242614B2 (en) 2017-02-17 2022-02-08 Apple Inc. Oxide coatings for providing corrosion resistance on parts with edges and convex features
US11043151B2 (en) * 2017-10-03 2021-06-22 Cmc Materials, Inc. Surface treated abrasive particles for tungsten buff applications
JP7034667B2 (ja) * 2017-10-24 2022-03-14 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
KR102533083B1 (ko) * 2017-12-18 2023-05-17 주식회사 케이씨텍 다결정실리콘을 함유하는 웨이퍼의 연마 슬러리 조성물
US11549191B2 (en) 2018-09-10 2023-01-10 Apple Inc. Corrosion resistance for anodized parts having convex surface features
CN113710761B (zh) * 2019-04-17 2024-04-09 Cmc材料有限责任公司 用于钨擦光应用的经表面涂覆的研磨剂颗粒
CN111020590A (zh) * 2019-11-25 2020-04-17 昆山兰博旺新材料技术服务有限公司 环保型铝合金化学抛光液
CN115198275B (zh) * 2022-06-07 2024-02-09 湖北奥美伦科技有限公司 一种砂面铝合金掩蔽剂及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130224955A1 (en) * 2008-03-21 2013-08-29 Cabot Microelectronics Corporation Method for polishing aluminum/copper and titanium in damascene structures

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010046395A (ko) * 1999-11-12 2001-06-15 안복현 연마용 조성물
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US20060096179A1 (en) * 2004-11-05 2006-05-11 Cabot Microelectronics Corporation CMP composition containing surface-modified abrasive particles
US9343330B2 (en) * 2006-12-06 2016-05-17 Cabot Microelectronics Corporation Compositions for polishing aluminum/copper and titanium in damascene structures
US7994057B2 (en) * 2007-09-21 2011-08-09 Cabot Microelectronics Corporation Polishing composition and method utilizing abrasive particles treated with an aminosilane
MY154861A (en) * 2008-12-22 2015-08-14 Kao Corp Polishing liquid composition for magnetic-disk substrate
JP5613422B2 (ja) * 2010-02-12 2014-10-22 花王株式会社 磁気ディスク基板用研磨液組成物
US20130005149A1 (en) * 2010-02-22 2013-01-03 Basf Se Chemical-mechanical planarization of substrates containing copper, ruthenium, and tantalum layers
US8623766B2 (en) * 2011-09-20 2014-01-07 Cabot Microelectronics Corporation Composition and method for polishing aluminum semiconductor substrates
JP6050934B2 (ja) * 2011-11-08 2016-12-21 株式会社フジミインコーポレーテッド 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130224955A1 (en) * 2008-03-21 2013-08-29 Cabot Microelectronics Corporation Method for polishing aluminum/copper and titanium in damascene structures

Also Published As

Publication number Publication date
JP2017527446A (ja) 2017-09-21
CN106661427A (zh) 2017-05-10
KR20170023080A (ko) 2017-03-02
KR20230007519A (ko) 2023-01-12
CN106661427B (zh) 2019-06-28
JP6800418B2 (ja) 2020-12-16
US20150368515A1 (en) 2015-12-24
TW201600591A (zh) 2016-01-01
WO2015195946A1 (en) 2015-12-23

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