SG10201602672UA - Cmp composition and method for polishing rigid disks - Google Patents

Cmp composition and method for polishing rigid disks

Info

Publication number
SG10201602672UA
SG10201602672UA SG10201602672UA SG10201602672UA SG10201602672UA SG 10201602672U A SG10201602672U A SG 10201602672UA SG 10201602672U A SG10201602672U A SG 10201602672UA SG 10201602672U A SG10201602672U A SG 10201602672UA SG 10201602672U A SG10201602672U A SG 10201602672UA
Authority
SG
Singapore
Prior art keywords
cmp composition
rigid disks
polishing
polishing rigid
disks
Prior art date
Application number
SG10201602672UA
Inventor
Li Tong
White Michael
Palanisamy Chinnathambi Selvaraj
Zhang Ke
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG10201602672UA publication Critical patent/SG10201602672UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
SG10201602672UA 2015-04-06 2016-04-05 Cmp composition and method for polishing rigid disks SG10201602672UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562143372P 2015-04-06 2015-04-06

Publications (1)

Publication Number Publication Date
SG10201602672UA true SG10201602672UA (en) 2016-11-29

Family

ID=57016233

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201602672UA SG10201602672UA (en) 2015-04-06 2016-04-05 Cmp composition and method for polishing rigid disks

Country Status (4)

Country Link
US (1) US10315285B2 (en)
MY (1) MY186924A (en)
SG (1) SG10201602672UA (en)
TW (1) TWI659094B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10968377B2 (en) * 2017-04-14 2021-04-06 Cmc Materials, Inc. Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US20190153262A1 (en) * 2017-11-20 2019-05-23 Cabot Microelectronics Corporation Composition and method for polishing memory hard disks exhibiting reduced surface scratching
MY193814A (en) * 2017-12-27 2022-10-27 Kao Corp Method for producing aluminum-made platter

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6258140B1 (en) 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
US6242351B1 (en) * 1999-12-27 2001-06-05 General Electric Company Diamond slurry for chemical-mechanical planarization of semiconductor wafers
US6332831B1 (en) 2000-04-06 2001-12-25 Fujimi America Inc. Polishing composition and method for producing a memory hard disk
US6755721B2 (en) 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
JP2005268664A (en) 2004-03-19 2005-09-29 Fujimi Inc Abrasive composition
JP4644434B2 (en) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド Polishing composition
US7524347B2 (en) 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
EP2139029A4 (en) * 2007-04-17 2010-03-24 Asahi Glass Co Ltd Polishing agent composition and method for manufacturing semiconductor integrated circuit device
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
SG11201503355WA (en) * 2012-11-30 2015-06-29 Nitta Haas Inc Polishing composition

Also Published As

Publication number Publication date
TW201702348A (en) 2017-01-16
US10315285B2 (en) 2019-06-11
TWI659094B (en) 2019-05-11
US20160288290A1 (en) 2016-10-06
MY186924A (en) 2021-08-26

Similar Documents

Publication Publication Date Title
TWI561621B (en) Tungsten chemical-mechanical polishing composition
EP3216562A4 (en) Polishing method and composition for polishing
IL263480B (en) Polishing pad and polishing method using same
SG11201610969UA (en) Cmp polishing liquid, and polishing method
EP3127655A4 (en) Polishing pad and process for producing same
SG11201609296XA (en) Polishing pad and method for manufacturing the same
SG10201501574SA (en) Polishing apparatus and polishing method
TWI561620B (en) Cmp slurry compositions and methods for aluminum polishing
SG11201702215RA (en) Polishing composition, method for manufacturing same, and polishing method
SG10201600213YA (en) Method For Dressing Polishing Pads
EP3437798A4 (en) Polishing pad and polishing method
SG11201608128UA (en) Polishing composition and polishing method
SG10201604365YA (en) Polishing apparatus
SG11201607461PA (en) Polishing composition and polishing method using the same
EP3169765A4 (en) Cleaning composition following cmp and methods related thereto
SG10201608734WA (en) Polishing apparatus
EP3326751A4 (en) Polishing pad and polishing method
EP3561858A4 (en) Polishing composition and polishing method
EP3108998A4 (en) Polishing apparatus and polishing method
EP3196272A4 (en) Polishing material, composition for polishing, and polishing method
TWI563073B (en) Cmp compositions and methods for polishing rigid disk surfaces
SG10201608243QA (en) Polishing apparatus and polishing method
SG11201912500PA (en) Polishing method
SG11201702213YA (en) Polishing apparatus and wafer polishing method
EP3421174A4 (en) Polishing method and polishing pad