TWI563073B - Cmp compositions and methods for polishing rigid disk surfaces - Google Patents

Cmp compositions and methods for polishing rigid disk surfaces

Info

Publication number
TWI563073B
TWI563073B TW104116834A TW104116834A TWI563073B TW I563073 B TWI563073 B TW I563073B TW 104116834 A TW104116834 A TW 104116834A TW 104116834 A TW104116834 A TW 104116834A TW I563073 B TWI563073 B TW I563073B
Authority
TW
Taiwan
Prior art keywords
methods
rigid disk
disk surfaces
cmp compositions
polishing
Prior art date
Application number
TW104116834A
Other languages
Chinese (zh)
Other versions
TW201546255A (en
Inventor
Chinnathambi Selvaraj Palanisamy
Lu Tian
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW201546255A publication Critical patent/TW201546255A/en
Application granted granted Critical
Publication of TWI563073B publication Critical patent/TWI563073B/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
TW104116834A 2014-06-03 2015-05-26 Cmp compositions and methods for polishing rigid disk surfaces TWI563073B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201462007021P 2014-06-03 2014-06-03

Publications (2)

Publication Number Publication Date
TW201546255A TW201546255A (en) 2015-12-16
TWI563073B true TWI563073B (en) 2016-12-21

Family

ID=54767312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104116834A TWI563073B (en) 2014-06-03 2015-05-26 Cmp compositions and methods for polishing rigid disk surfaces

Country Status (4)

Country Link
MY (1) MY186027A (en)
SG (1) SG11201610441SA (en)
TW (1) TWI563073B (en)
WO (1) WO2015187820A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10792785B2 (en) * 2016-06-07 2020-10-06 Cabot Microelectronics Corporation Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
JP7208019B2 (en) * 2017-02-17 2023-01-18 株式会社フジミインコーポレーテッド Polishing composition, method for producing same, and polishing method using polishing composition
KR102649676B1 (en) 2017-03-14 2024-03-21 가부시키가이샤 후지미인코퍼레이티드 Polishing composition, method for producing the same, polishing method using the same, and method for producing a substrate
SG11202107185WA (en) 2019-01-11 2021-07-29 Cmc Materials Inc Dual additive composition for polishing memory hard disks exhibiting edge roll off
WO2020196370A1 (en) * 2019-03-26 2020-10-01 株式会社フジミインコーポレーテッド Polishing composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200300787A (en) * 2001-12-05 2003-06-16 Cabot Microelectronics Cororation Method for copper cmp using polymeric complexing agents
TW201012907A (en) * 2008-07-10 2010-04-01 Cabot Microelectronics Corp Method of polishing nickel-phosphorous

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
JP5878020B2 (en) * 2009-11-11 2016-03-08 株式会社クラレ Chemical mechanical polishing slurry and substrate polishing method using the same
US10407594B2 (en) * 2011-03-22 2019-09-10 Basf Se Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200300787A (en) * 2001-12-05 2003-06-16 Cabot Microelectronics Cororation Method for copper cmp using polymeric complexing agents
TW201012907A (en) * 2008-07-10 2010-04-01 Cabot Microelectronics Corp Method of polishing nickel-phosphorous

Also Published As

Publication number Publication date
MY186027A (en) 2021-06-15
WO2015187820A1 (en) 2015-12-10
SG11201610441SA (en) 2017-01-27
TW201546255A (en) 2015-12-16

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