SG11202107185WA - Dual additive composition for polishing memory hard disks exhibiting edge roll off - Google Patents
Dual additive composition for polishing memory hard disks exhibiting edge roll offInfo
- Publication number
- SG11202107185WA SG11202107185WA SG11202107185WA SG11202107185WA SG11202107185WA SG 11202107185W A SG11202107185W A SG 11202107185WA SG 11202107185W A SG11202107185W A SG 11202107185WA SG 11202107185W A SG11202107185W A SG 11202107185WA SG 11202107185W A SG11202107185W A SG 11202107185WA
- Authority
- SG
- Singapore
- Prior art keywords
- hard disks
- additive composition
- edge roll
- memory hard
- dual additive
- Prior art date
Links
- 239000000654 additive Substances 0.000 title 1
- 230000000996 additive effect Effects 0.000 title 1
- 230000009977 dual effect Effects 0.000 title 1
- 230000001747 exhibiting effect Effects 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962791184P | 2019-01-11 | 2019-01-11 | |
PCT/US2019/068917 WO2020146161A1 (en) | 2019-01-11 | 2019-12-30 | Dual additive composition for polishing memory hard disks exhibiting edge roll off |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202107185WA true SG11202107185WA (en) | 2021-07-29 |
Family
ID=71517949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202107185WA SG11202107185WA (en) | 2019-01-11 | 2019-12-30 | Dual additive composition for polishing memory hard disks exhibiting edge roll off |
Country Status (4)
Country | Link |
---|---|
US (1) | US11384253B2 (en) |
SG (1) | SG11202107185WA (en) |
TW (1) | TWI747122B (en) |
WO (1) | WO2020146161A1 (en) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6527622B1 (en) * | 2002-01-22 | 2003-03-04 | Cabot Microelectronics Corporation | CMP method for noble metals |
US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
JP4228902B2 (en) | 2003-12-10 | 2009-02-25 | 富士電機デバイステクノロジー株式会社 | Magnetic recording medium and method for manufacturing the same |
US20060118760A1 (en) * | 2004-12-03 | 2006-06-08 | Yang Andy C | Slurry composition and methods for chemical mechanical polishing |
CN102863943B (en) | 2005-08-30 | 2015-03-25 | 花王株式会社 | Polishing composition for hard disk substrate, polishing method and manufacture method of substrate |
JP5202258B2 (en) * | 2008-03-25 | 2013-06-05 | 富士フイルム株式会社 | Metal polishing composition and chemical mechanical polishing method |
US9330703B2 (en) | 2009-06-04 | 2016-05-03 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous memory disks |
JP5657247B2 (en) * | 2009-12-25 | 2015-01-21 | 花王株式会社 | Polishing liquid composition |
JP6110715B2 (en) * | 2013-04-11 | 2017-04-05 | 山口精研工業株式会社 | Abrasive composition for rough polishing of Ni-P plated aluminum magnetic disk substrate, method for polishing Ni-P plated aluminum magnetic disk substrate, method for manufacturing Ni-P plated aluminum magnetic disk substrate, and Ni-P Plated aluminum magnetic disk substrate |
CN103937414B (en) | 2014-04-29 | 2018-03-02 | 杰明纳微电子股份有限公司 | A kind of precise polishing solution of hard disc of computer disk substrate |
US9401104B2 (en) | 2014-05-05 | 2016-07-26 | Cabot Microelectronics Corporation | Polishing composition for edge roll-off improvement |
TWI563073B (en) | 2014-06-03 | 2016-12-21 | Cabot Microelectronics Corp | Cmp compositions and methods for polishing rigid disk surfaces |
SG11201702051VA (en) * | 2014-10-14 | 2017-04-27 | Cabot Microelectronics Corp | Nickel phosphorous cmp compositions and methods |
US10479911B1 (en) * | 2018-06-05 | 2019-11-19 | Cabot Microelectronics Corporation | Composition and method for polishing memory hard disks exhibiting reduced edge roll off |
-
2019
- 2019-12-30 US US16/729,905 patent/US11384253B2/en active Active
- 2019-12-30 WO PCT/US2019/068917 patent/WO2020146161A1/en active Application Filing
- 2019-12-30 SG SG11202107185WA patent/SG11202107185WA/en unknown
- 2019-12-30 TW TW108148458A patent/TWI747122B/en active
Also Published As
Publication number | Publication date |
---|---|
US20200224057A1 (en) | 2020-07-16 |
WO2020146161A1 (en) | 2020-07-16 |
TW202031823A (en) | 2020-09-01 |
US11384253B2 (en) | 2022-07-12 |
TWI747122B (en) | 2021-11-21 |
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