CN106660190A - 研磨垫 - Google Patents

研磨垫 Download PDF

Info

Publication number
CN106660190A
CN106660190A CN201580045399.8A CN201580045399A CN106660190A CN 106660190 A CN106660190 A CN 106660190A CN 201580045399 A CN201580045399 A CN 201580045399A CN 106660190 A CN106660190 A CN 106660190A
Authority
CN
China
Prior art keywords
grinding
resin layer
groove
hard resin
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580045399.8A
Other languages
English (en)
Chinese (zh)
Inventor
片山浩二
大桥圭吾
山田英
山田英一
森永均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of CN106660190A publication Critical patent/CN106660190A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201580045399.8A 2014-08-27 2015-07-30 研磨垫 Pending CN106660190A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014172978A JP2016047566A (ja) 2014-08-27 2014-08-27 研磨パッド
JP2014-172978 2014-08-27
PCT/JP2015/003854 WO2016031143A1 (ja) 2014-08-27 2015-07-30 研磨パッド

Publications (1)

Publication Number Publication Date
CN106660190A true CN106660190A (zh) 2017-05-10

Family

ID=55399064

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580045399.8A Pending CN106660190A (zh) 2014-08-27 2015-07-30 研磨垫

Country Status (6)

Country Link
US (1) US20170252892A1 (ja)
EP (1) EP3195979A4 (ja)
JP (1) JP2016047566A (ja)
CN (1) CN106660190A (ja)
TW (1) TW201628786A (ja)
WO (1) WO2016031143A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017146006A1 (ja) 2016-02-26 2017-08-31 株式会社フジミインコーポレーテッド 研磨方法、研磨パッド
JP7420728B2 (ja) * 2018-09-28 2024-01-23 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
TW380078B (en) * 1997-11-25 2000-01-21 Speedfam Co Ltd Surface polishing pad
CN1254441A (zh) * 1997-04-30 2000-05-24 美国3M公司 对半导体晶片表面进行平整的方法
JP2002283220A (ja) * 2001-03-23 2002-10-03 Nippon Electric Glass Co Ltd ガラス物品の研磨装置
JP2005131720A (ja) * 2003-10-29 2005-05-26 Toray Ind Inc 研磨パッドの製造方法
CN101080305A (zh) * 2004-12-16 2007-11-28 3M创新有限公司 弹性构造的砂磨物品
JP5292958B2 (ja) * 2007-07-18 2013-09-18 東レ株式会社 研磨パッド

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038589A (ja) * 1999-08-03 2001-02-13 Speedfam Co Ltd ワーク外周部用研磨装置
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
CN103648717A (zh) * 2011-07-15 2014-03-19 东丽株式会社 研磨垫
WO2013039181A1 (ja) * 2011-09-15 2013-03-21 東レ株式会社 研磨パッド
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
TWI516373B (zh) * 2014-01-17 2016-01-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法
TWI597125B (zh) * 2014-09-25 2017-09-01 三芳化學工業股份有限公司 拋光墊及其製造方法
US9630293B2 (en) * 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
CN1254441A (zh) * 1997-04-30 2000-05-24 美国3M公司 对半导体晶片表面进行平整的方法
TW380078B (en) * 1997-11-25 2000-01-21 Speedfam Co Ltd Surface polishing pad
JP2002283220A (ja) * 2001-03-23 2002-10-03 Nippon Electric Glass Co Ltd ガラス物品の研磨装置
JP2005131720A (ja) * 2003-10-29 2005-05-26 Toray Ind Inc 研磨パッドの製造方法
CN101080305A (zh) * 2004-12-16 2007-11-28 3M创新有限公司 弹性构造的砂磨物品
JP5292958B2 (ja) * 2007-07-18 2013-09-18 東レ株式会社 研磨パッド

Also Published As

Publication number Publication date
EP3195979A1 (en) 2017-07-26
US20170252892A1 (en) 2017-09-07
JP2016047566A (ja) 2016-04-07
WO2016031143A1 (ja) 2016-03-03
TW201628786A (zh) 2016-08-16
EP3195979A4 (en) 2017-09-20

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170510

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