EP3195979A4 - Polishing pad - Google Patents

Polishing pad Download PDF

Info

Publication number
EP3195979A4
EP3195979A4 EP15837016.3A EP15837016A EP3195979A4 EP 3195979 A4 EP3195979 A4 EP 3195979A4 EP 15837016 A EP15837016 A EP 15837016A EP 3195979 A4 EP3195979 A4 EP 3195979A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15837016.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3195979A1 (en
Inventor
Koji Katayama
Keigo Ohashi
Eiichi Yamada
Hitoshi Morinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP3195979A1 publication Critical patent/EP3195979A1/en
Publication of EP3195979A4 publication Critical patent/EP3195979A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP15837016.3A 2014-08-27 2015-07-30 Polishing pad Withdrawn EP3195979A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014172978A JP2016047566A (ja) 2014-08-27 2014-08-27 研磨パッド
PCT/JP2015/003854 WO2016031143A1 (ja) 2014-08-27 2015-07-30 研磨パッド

Publications (2)

Publication Number Publication Date
EP3195979A1 EP3195979A1 (en) 2017-07-26
EP3195979A4 true EP3195979A4 (en) 2017-09-20

Family

ID=55399064

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15837016.3A Withdrawn EP3195979A4 (en) 2014-08-27 2015-07-30 Polishing pad

Country Status (6)

Country Link
US (1) US20170252892A1 (ja)
EP (1) EP3195979A4 (ja)
JP (1) JP2016047566A (ja)
CN (1) CN106660190A (ja)
TW (1) TW201628786A (ja)
WO (1) WO2016031143A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3421174B1 (en) 2016-02-26 2023-08-09 Fujimi Incorporated Polishing method
WO2020066671A1 (ja) * 2018-09-28 2020-04-02 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0919336A2 (en) * 1997-11-25 1999-06-02 Speedfam Co., Ltd. Surface polishing pad
EP1447841A1 (en) * 2002-08-08 2004-08-18 JSR Corporation Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
TW479285B (en) * 1997-04-30 2002-03-11 Minnesota Mining & Mfg Method of modifying a wafer suited for semiconductor fabrication
JP2001038589A (ja) * 1999-08-03 2001-02-13 Speedfam Co Ltd ワーク外周部用研磨装置
JP2002283220A (ja) * 2001-03-23 2002-10-03 Nippon Electric Glass Co Ltd ガラス物品の研磨装置
JP2005131720A (ja) * 2003-10-29 2005-05-26 Toray Ind Inc 研磨パッドの製造方法
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
JP5292958B2 (ja) * 2007-07-18 2013-09-18 東レ株式会社 研磨パッド
WO2013011922A1 (ja) * 2011-07-15 2013-01-24 東レ株式会社 研磨パッド
JPWO2013039181A1 (ja) * 2011-09-15 2015-03-26 東レ株式会社 研磨パッド
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
TWI516373B (zh) * 2014-01-17 2016-01-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法
TWI597125B (zh) * 2014-09-25 2017-09-01 三芳化學工業股份有限公司 拋光墊及其製造方法
US9630293B2 (en) * 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0919336A2 (en) * 1997-11-25 1999-06-02 Speedfam Co., Ltd. Surface polishing pad
EP1447841A1 (en) * 2002-08-08 2004-08-18 JSR Corporation Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016031143A1 *

Also Published As

Publication number Publication date
EP3195979A1 (en) 2017-07-26
JP2016047566A (ja) 2016-04-07
WO2016031143A1 (ja) 2016-03-03
CN106660190A (zh) 2017-05-10
US20170252892A1 (en) 2017-09-07
TW201628786A (zh) 2016-08-16

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