CN106569396B - 目标定位装置 - Google Patents
目标定位装置 Download PDFInfo
- Publication number
- CN106569396B CN106569396B CN201610901826.4A CN201610901826A CN106569396B CN 106569396 B CN106569396 B CN 106569396B CN 201610901826 A CN201610901826 A CN 201610901826A CN 106569396 B CN106569396 B CN 106569396B
- Authority
- CN
- China
- Prior art keywords
- motor
- supporting table
- carrier
- target locating
- locating set
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009958 sewing Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 27
- 238000001459 lithography Methods 0.000 claims description 26
- 238000004891 communication Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000000747 cardiac effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000011554 ferrofluid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000009432 framing Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000595 mu-metal Inorganic materials 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/026—Shields
- H01J2237/0266—Shields electromagnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2005—Seal mechanisms
- H01J2237/2006—Vacuum seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20278—Motorised movement
- H01J2237/20285—Motorised movement computer-controlled
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Mathematical Physics (AREA)
- Public Health (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161533404P | 2011-09-12 | 2011-09-12 | |
| US201161533398P | 2011-09-12 | 2011-09-12 | |
| US61/533,398 | 2011-09-12 | ||
| NL2007403 | 2011-09-12 | ||
| NL2007403 | 2011-09-12 | ||
| NL2007404 | 2011-09-12 | ||
| NL2007404 | 2011-09-12 | ||
| US61/533,404 | 2011-09-12 | ||
| CN201280051562.8A CN103946749B (zh) | 2011-09-12 | 2012-09-12 | 目标定位装置 |
| PCT/NL2012/050637 WO2013039389A2 (en) | 2011-09-12 | 2012-09-12 | Target positioning device, method for driving a target positioning device, and a lithography system comprising such a target positioning device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280051562.8A Division CN103946749B (zh) | 2011-09-12 | 2012-09-12 | 目标定位装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106569396A CN106569396A (zh) | 2017-04-19 |
| CN106569396B true CN106569396B (zh) | 2018-10-19 |
Family
ID=47883905
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610901826.4A Active CN106569396B (zh) | 2011-09-12 | 2012-09-12 | 目标定位装置 |
| CN201280051562.8A Active CN103946749B (zh) | 2011-09-12 | 2012-09-12 | 目标定位装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280051562.8A Active CN103946749B (zh) | 2011-09-12 | 2012-09-12 | 目标定位装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9030649B2 (enExample) |
| JP (1) | JP5844468B2 (enExample) |
| CN (2) | CN106569396B (enExample) |
| NL (1) | NL1039797C2 (enExample) |
| TW (1) | TW201312300A (enExample) |
| WO (1) | WO2013039389A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032609A (ja) * | 2013-07-31 | 2015-02-16 | キヤノン株式会社 | 駆動装置、荷電粒子線照射装置、及びデバイスの製造方法 |
| CN108020252B (zh) * | 2016-11-03 | 2020-03-06 | 香港城市大学深圳研究院 | 样品台、微观观察装置和样品台调整方法 |
| US10559710B2 (en) * | 2017-07-19 | 2020-02-11 | Intevac, Inc. | System of height and alignment rollers for precise alignment of wafers for ion implantation |
| CN113917796A (zh) * | 2021-09-22 | 2022-01-11 | 哈尔滨工业大学 | 一种多自由度宏微混合的精密运动台 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4972574A (en) * | 1988-06-08 | 1990-11-27 | Mamiya Denshi Co., Ltd. | Table driving apparatus |
| CN101206409A (zh) * | 2007-12-17 | 2008-06-25 | 上海微电子装备有限公司 | 一种工件台平衡质量定位系统 |
| CN201134009Y (zh) * | 2007-11-14 | 2008-10-15 | 上海微电子装备有限公司 | 一种工件台平衡定位装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124286A (ja) * | 1988-10-28 | 1990-05-11 | Mamiya Denshi:Kk | 組立ロボット |
| EP0366420A3 (en) * | 1988-10-28 | 1992-04-15 | Mamiya Denshi Co. Ltd. | Table driving apparatus |
| US6279490B1 (en) * | 1999-10-08 | 2001-08-28 | Etec Systems, Inc. | Epicyclic stage |
| TW546551B (en) * | 1999-12-21 | 2003-08-11 | Asml Netherlands Bv | Balanced positioning system for use in lithographic apparatus |
| TWI264617B (en) * | 1999-12-21 | 2006-10-21 | Asml Netherlands Bv | Balanced positioning system for use in lithographic apparatus |
| DE602004022947D1 (de) * | 2003-07-17 | 2009-10-15 | Newport Corp | Hochauflösender dynamischer positionierungsmechanismus |
| DE10359273A1 (de) * | 2003-12-17 | 2005-07-21 | Erich Thallner | Justiervorrichtung |
| JP4307288B2 (ja) * | 2004-02-25 | 2009-08-05 | キヤノン株式会社 | 位置決め装置 |
| JP5028659B2 (ja) * | 2007-08-24 | 2012-09-19 | 秋田県 | 位置決め機構 |
| NL1036557A1 (nl) * | 2008-03-11 | 2009-09-14 | Asml Netherlands Bv | Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface. |
| WO2010002153A2 (ko) | 2008-06-30 | 2010-01-07 | 엘지전자주식회사 | 다중안테나 시스템에서 동기신호의 전송장치 |
| US8796644B2 (en) * | 2008-08-18 | 2014-08-05 | Mapper Lithography Ip B.V. | Charged particle beam lithography system and target positioning device |
| TWI472884B (zh) * | 2008-08-18 | 2015-02-11 | Mapper Lithography Ip Bv | 帶電粒子射束微影系統以及目標物定位裝置 |
| US7959141B2 (en) | 2008-12-23 | 2011-06-14 | Sumitomo Heavy Industries, Ltd. | Stage apparatus |
| US20100158645A1 (en) * | 2008-12-23 | 2010-06-24 | Sumitono Heavy Industries, Ltd. | Stage apparatus |
| JP5953177B2 (ja) * | 2011-10-31 | 2016-07-20 | 株式会社日立ハイテクノロジーズ | 試料ステージ及び荷電粒子装置 |
-
2012
- 2012-09-12 NL NL1039797A patent/NL1039797C2/en active
- 2012-09-12 US US13/612,496 patent/US9030649B2/en active Active
- 2012-09-12 CN CN201610901826.4A patent/CN106569396B/zh active Active
- 2012-09-12 CN CN201280051562.8A patent/CN103946749B/zh active Active
- 2012-09-12 TW TW101133457A patent/TW201312300A/zh unknown
- 2012-09-12 JP JP2014529638A patent/JP5844468B2/ja active Active
- 2012-09-12 WO PCT/NL2012/050637 patent/WO2013039389A2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4972574A (en) * | 1988-06-08 | 1990-11-27 | Mamiya Denshi Co., Ltd. | Table driving apparatus |
| CN201134009Y (zh) * | 2007-11-14 | 2008-10-15 | 上海微电子装备有限公司 | 一种工件台平衡定位装置 |
| CN101206409A (zh) * | 2007-12-17 | 2008-06-25 | 上海微电子装备有限公司 | 一种工件台平衡质量定位系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014528165A (ja) | 2014-10-23 |
| NL1039797A (en) | 2013-03-13 |
| WO2013039389A3 (en) | 2013-07-11 |
| US9030649B2 (en) | 2015-05-12 |
| US20130094008A1 (en) | 2013-04-18 |
| CN103946749A (zh) | 2014-07-23 |
| NL1039797C2 (en) | 2015-02-09 |
| CN106569396A (zh) | 2017-04-19 |
| WO2013039389A2 (en) | 2013-03-21 |
| CN103946749B (zh) | 2016-11-16 |
| JP5844468B2 (ja) | 2016-01-20 |
| TW201312300A (zh) | 2013-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190529 Address after: Holland Weide Eindhoven Patentee after: ASML Holland Co., Ltd. Address before: Delft Patentee before: Mapper Lithography IP B. V. |