CN1064767A - 用于电子电路组件的壳体 - Google Patents

用于电子电路组件的壳体 Download PDF

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Publication number
CN1064767A
CN1064767A CN92101206A CN92101206A CN1064767A CN 1064767 A CN1064767 A CN 1064767A CN 92101206 A CN92101206 A CN 92101206A CN 92101206 A CN92101206 A CN 92101206A CN 1064767 A CN1064767 A CN 1064767A
Authority
CN
China
Prior art keywords
assembly
cooling
housing
connector
flat cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN92101206A
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English (en)
Chinese (zh)
Inventor
卡尔斯特·拉斯·冈纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mhr Institutional Partners Iia LP
Original Assignee
Mhr Institutional Partners Iia LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mhr Institutional Partners Iia LP filed Critical Mhr Institutional Partners Iia LP
Publication of CN1064767A publication Critical patent/CN1064767A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN92101206A 1991-03-01 1992-02-29 用于电子电路组件的壳体 Pending CN1064767A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9100596-7 1991-03-01
SE9100596A SE9100596D0 (sv) 1991-03-01 1991-03-01 Magasin foer stora vlsi-kapslar

Publications (1)

Publication Number Publication Date
CN1064767A true CN1064767A (zh) 1992-09-23

Family

ID=20382021

Family Applications (1)

Application Number Title Priority Date Filing Date
CN92101206A Pending CN1064767A (zh) 1991-03-01 1992-02-29 用于电子电路组件的壳体

Country Status (11)

Country Link
US (1) US5404270A (cg-RX-API-DMAC7.html)
EP (1) EP0573533B1 (cg-RX-API-DMAC7.html)
JP (1) JPH06504879A (cg-RX-API-DMAC7.html)
CN (1) CN1064767A (cg-RX-API-DMAC7.html)
AU (1) AU1336392A (cg-RX-API-DMAC7.html)
DE (1) DE69211538T2 (cg-RX-API-DMAC7.html)
IL (1) IL101108A0 (cg-RX-API-DMAC7.html)
SE (1) SE9100596D0 (cg-RX-API-DMAC7.html)
TW (1) TW222365B (cg-RX-API-DMAC7.html)
WO (1) WO1992016092A1 (cg-RX-API-DMAC7.html)
ZA (1) ZA921529B (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104756620A (zh) * 2012-11-02 2015-07-01 日立汽车系统株式会社 电子控制装置
CN105551675A (zh) * 2012-07-30 2016-05-04 株式会社村田制作所 扁平电缆
CN109411428A (zh) * 2018-10-10 2019-03-01 李汝和 一种芯片的高效散热封装金属壳

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SE9604705L (sv) 1996-12-20 1998-06-21 Ericsson Telefon Ab L M Förfarande och medel för att arrangera värmeöverföring
US5945746A (en) * 1997-08-21 1999-08-31 Tracewell Power, Inc. Power supply and power supply/backplane assembly and system
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6142090A (en) * 1998-10-07 2000-11-07 Electric Boat Corporation Power converter arrangement for integration into a ship structure
US7373268B1 (en) * 2003-07-30 2008-05-13 Hewlett-Packard Development Company, L.P. Method and system for dynamically controlling cooling resources in a data center
WO2009032144A2 (en) * 2007-08-28 2009-03-12 General Dynamics Advanced Information Systems, Inc. System and method for interconnecting circuit boards
US20090120607A1 (en) * 2007-11-08 2009-05-14 Cheon Peter Cooler for spatially confined cooling
DE102017223476A1 (de) 2017-12-20 2019-06-27 Elringklinger Ag Kühlmodul für einen Zellstapel, Zellstapel, Batterievorrichtung und Verfahren zum Kühlen von Zellen
DE102017223474A1 (de) * 2017-12-20 2019-06-27 Elringklinger Ag Kühlmodul für einen Zellstapel, Zellstapel, Batterievorrichtung und Verfahren zum Kühlen von Zellen
DE102017223479A1 (de) * 2017-12-20 2019-06-27 Elringklinger Ag Kühlmodul für einen Zellstapel, Zellstapel, Batterievorrichtung und Verfahren zum Kühlen von Zellen
US10582645B1 (en) * 2018-09-28 2020-03-03 Hewlett Packard Enterprise Development Lp Cooling apparatus for electronic components
CN113015394A (zh) * 2021-03-02 2021-06-22 豪业(广州)五金有限公司 一种用于信号基站机房的节能型日常维护装置

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AT245699B (de) * 1961-06-06 1966-03-10 Hermsdorf Keramik Veb Modulbaustein
DE1440835A1 (de) * 1963-06-29 1969-10-09 Bbc Brown Boveri & Cie Linschiebbarer Geraeterahmen zur Aufnahme elektrischer Anlageteile,vorzugsweise fuerelektronische Anlagen
FR1433088A (fr) * 1965-05-05 1966-03-25 Ibm Procédé pour fabriquer des montages à couches multiples de circuits imprimés
US3492538A (en) * 1967-09-07 1970-01-27 Thomas & Betts Corp Removable stack interconnection system
US3639891A (en) * 1969-12-15 1972-02-01 Itt Termination of flat cables
GB1295138A (cg-RX-API-DMAC7.html) * 1970-05-30 1972-11-01
DE2320202A1 (de) * 1973-04-19 1974-11-07 Siemens Ag Anordnung zur wechselseitigen elektrischen verbindung einer mehrzahl von bauteiletraegern (z.b. von gedruckten leiterplatten)
US4019798A (en) * 1976-03-24 1977-04-26 Owens-Illinois, Inc. Flexible electrical circuit connections
US4116516A (en) * 1977-06-24 1978-09-26 Gte Sylvania Incorporated Multiple layered connector
US4237546A (en) * 1979-01-31 1980-12-02 Technology Marketing, Inc. Multi-layered back plane for a computer system
CA1115368A (en) * 1979-06-04 1981-12-29 Ralph D. Whaley Multi-conductor flat cable connector
GB2123216B (en) * 1982-06-19 1985-12-18 Ferranti Plc Electrical circuit assemblies
DE3435836A1 (de) * 1984-09-28 1986-04-17 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Anschlusseinrichtung einer schaltungsfolie
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
CA1306795C (en) * 1987-09-25 1992-08-25 Minnesota Mining And Manufacturing Company Thermal transfer bag
US4997032A (en) * 1987-09-25 1991-03-05 Minnesota Mining And Manufacturing Company Thermal transfer bag
US4938279A (en) * 1988-02-05 1990-07-03 Hughes Aircraft Company Flexible membrane heat sink
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
JPH0330399A (ja) * 1989-06-27 1991-02-08 Mitsubishi Electric Corp 電子冷却装置
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
US5131859A (en) * 1991-03-08 1992-07-21 Cray Research, Inc. Quick disconnect system for circuit board modules
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105551675A (zh) * 2012-07-30 2016-05-04 株式会社村田制作所 扁平电缆
CN105551675B (zh) * 2012-07-30 2017-06-13 株式会社村田制作所 扁平电缆
CN104756620A (zh) * 2012-11-02 2015-07-01 日立汽车系统株式会社 电子控制装置
CN104756620B (zh) * 2012-11-02 2017-05-17 日立汽车系统株式会社 电子控制装置
CN109411428A (zh) * 2018-10-10 2019-03-01 李汝和 一种芯片的高效散热封装金属壳

Also Published As

Publication number Publication date
EP0573533A1 (en) 1993-12-15
DE69211538D1 (de) 1996-07-18
SE9100596D0 (sv) 1991-03-01
US5404270A (en) 1995-04-04
IL101108A0 (en) 1992-11-15
DE69211538T2 (de) 1997-01-09
TW222365B (cg-RX-API-DMAC7.html) 1994-04-11
WO1992016092A1 (en) 1992-09-17
ZA921529B (en) 1993-08-30
AU1336392A (en) 1992-10-06
EP0573533B1 (en) 1996-06-12
JPH06504879A (ja) 1994-06-02

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WD01 Invention patent application deemed withdrawn after publication