CN106455473B - 托盘搬送装置以及安装装置 - Google Patents
托盘搬送装置以及安装装置 Download PDFInfo
- Publication number
- CN106455473B CN106455473B CN201610649281.2A CN201610649281A CN106455473B CN 106455473 B CN106455473 B CN 106455473B CN 201610649281 A CN201610649281 A CN 201610649281A CN 106455473 B CN106455473 B CN 106455473B
- Authority
- CN
- China
- Prior art keywords
- pallet
- microscope carrier
- back side
- illusory
- abutting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 238000011084 recovery Methods 0.000 claims abstract description 21
- 238000006073 displacement reaction Methods 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 9
- 238000004064 recycling Methods 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 description 34
- 238000001179 sorption measurement Methods 0.000 description 18
- 238000002788 crimping Methods 0.000 description 10
- 239000002390 adhesive tape Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 208000036829 Device dislocation Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015159610A JP2017038012A (ja) | 2015-08-12 | 2015-08-12 | トレイ搬送装置及び実装装置 |
| JP2015-159610 | 2015-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455473A CN106455473A (zh) | 2017-02-22 |
| CN106455473B true CN106455473B (zh) | 2019-06-04 |
Family
ID=58047503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610649281.2A Active CN106455473B (zh) | 2015-08-12 | 2016-08-10 | 托盘搬送装置以及安装装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2017038012A (enExample) |
| CN (1) | CN106455473B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278451B (zh) * | 2017-07-11 | 2023-12-05 | 成都宇亨智能科技有限公司 | 一种种植机种盘输送结构 |
| CN107306556B (zh) * | 2017-07-11 | 2023-12-05 | 成都宇亨智能科技有限公司 | 一种种植机种盘交替输送结构 |
| JP7233237B2 (ja) * | 2019-02-12 | 2023-03-06 | 芝浦メカトロニクス株式会社 | トレイ搬送装置及び実装装置 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024389A (ja) * | 1999-07-06 | 2001-01-26 | Juki Corp | 部品供給装置 |
| JP2001251072A (ja) * | 2000-03-03 | 2001-09-14 | Seiko Instruments Inc | 搬送用トレイ |
| CN201004457Y (zh) * | 2006-11-06 | 2008-01-09 | 硕达科技股份有限公司 | 供电子产品使用的出货用承载盘 |
| CN101373725A (zh) * | 2007-08-20 | 2009-02-25 | 精工爱普生株式会社 | 半导体芯片收容托盘 |
| TWI311033B (en) * | 2006-04-07 | 2009-06-11 | Au Optronics Corp | Tray for carrying plate |
| CN103249291A (zh) * | 2011-11-07 | 2013-08-14 | 松下电器产业株式会社 | 盘式供料器及料盘安装用的托盘以及料盘安装方法 |
| CN104010482A (zh) * | 2013-02-26 | 2014-08-27 | 松下电器产业株式会社 | 元件供给装置 |
| JP2015023077A (ja) * | 2013-07-17 | 2015-02-02 | パナソニック株式会社 | トレイ供給装置及びトレイ供給方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11301776A (ja) * | 1998-04-21 | 1999-11-02 | Hitachi Ltd | 収納容器 |
| JP2002265056A (ja) * | 2001-03-08 | 2002-09-18 | Osaka Seiko Kk | 段ばらし装置とそれを用いたトレイフィーダー |
| JP3941738B2 (ja) * | 2003-05-26 | 2007-07-04 | 松下電器産業株式会社 | ワーク供給装置 |
| JP4828574B2 (ja) * | 2008-05-26 | 2011-11-30 | ルネサスエレクトロニクス株式会社 | 半導体装置の搬送方法 |
| JP5467368B2 (ja) * | 2011-01-28 | 2014-04-09 | パナソニック株式会社 | トレイ供給装置及び部品実装装置 |
-
2015
- 2015-08-12 JP JP2015159610A patent/JP2017038012A/ja active Pending
-
2016
- 2016-08-10 CN CN201610649281.2A patent/CN106455473B/zh active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024389A (ja) * | 1999-07-06 | 2001-01-26 | Juki Corp | 部品供給装置 |
| JP2001251072A (ja) * | 2000-03-03 | 2001-09-14 | Seiko Instruments Inc | 搬送用トレイ |
| TWI311033B (en) * | 2006-04-07 | 2009-06-11 | Au Optronics Corp | Tray for carrying plate |
| CN201004457Y (zh) * | 2006-11-06 | 2008-01-09 | 硕达科技股份有限公司 | 供电子产品使用的出货用承载盘 |
| CN101373725A (zh) * | 2007-08-20 | 2009-02-25 | 精工爱普生株式会社 | 半导体芯片收容托盘 |
| CN103249291A (zh) * | 2011-11-07 | 2013-08-14 | 松下电器产业株式会社 | 盘式供料器及料盘安装用的托盘以及料盘安装方法 |
| CN104010482A (zh) * | 2013-02-26 | 2014-08-27 | 松下电器产业株式会社 | 元件供给装置 |
| JP2015023077A (ja) * | 2013-07-17 | 2015-02-02 | パナソニック株式会社 | トレイ供給装置及びトレイ供給方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017038012A (ja) | 2017-02-16 |
| CN106455473A (zh) | 2017-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |