CN106449499B - Cigs柔性电池片拼接装置及其工作方法 - Google Patents
Cigs柔性电池片拼接装置及其工作方法 Download PDFInfo
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- CN106449499B CN106449499B CN201610884029.XA CN201610884029A CN106449499B CN 106449499 B CN106449499 B CN 106449499B CN 201610884029 A CN201610884029 A CN 201610884029A CN 106449499 B CN106449499 B CN 106449499B
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000003028 elevating effect Effects 0.000 claims abstract description 13
- 230000033001 locomotion Effects 0.000 claims abstract description 12
- 230000005389 magnetism Effects 0.000 claims description 13
- 230000009471 action Effects 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 3
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 abstract description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610884029.XA CN106449499B (zh) | 2016-10-10 | 2016-10-10 | Cigs柔性电池片拼接装置及其工作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610884029.XA CN106449499B (zh) | 2016-10-10 | 2016-10-10 | Cigs柔性电池片拼接装置及其工作方法 |
Publications (2)
Publication Number | Publication Date |
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CN106449499A CN106449499A (zh) | 2017-02-22 |
CN106449499B true CN106449499B (zh) | 2019-04-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610884029.XA Active CN106449499B (zh) | 2016-10-10 | 2016-10-10 | Cigs柔性电池片拼接装置及其工作方法 |
Country Status (1)
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CN (1) | CN106449499B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108243777A (zh) * | 2017-12-29 | 2018-07-06 | 国网甘肃省电力公司电力科学研究院 | 一种栽培槽可移动的光伏设施农业栽培支架系统 |
CN110676208B (zh) * | 2019-09-27 | 2022-06-07 | 库卡工业自动化(昆山)有限公司 | 磁吸附电池片翻转装置 |
CN117691001A (zh) * | 2024-02-02 | 2024-03-12 | 晶科能源(海宁)有限公司 | 光伏组件层压机和光伏组件的层压方法 |
CN118197979A (zh) * | 2024-04-07 | 2024-06-14 | 上海玲尧电子科技有限公司 | 一种异质结电池片的定位机构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201435402Y (zh) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | 太阳能硅片自动化定位装置 |
CN104084716A (zh) * | 2014-04-02 | 2014-10-08 | 太原风华信息装备股份有限公司 | 太阳能电池片串焊机的自动传送焊接载台 |
CN204621453U (zh) * | 2015-05-12 | 2015-09-09 | 武汉开锐智能设备有限公司 | 一种电池片的机械定位装置 |
-
2016
- 2016-10-10 CN CN201610884029.XA patent/CN106449499B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201435402Y (zh) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | 太阳能硅片自动化定位装置 |
CN104084716A (zh) * | 2014-04-02 | 2014-10-08 | 太原风华信息装备股份有限公司 | 太阳能电池片串焊机的自动传送焊接载台 |
CN204621453U (zh) * | 2015-05-12 | 2015-09-09 | 武汉开锐智能设备有限公司 | 一种电池片的机械定位装置 |
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CN106449499A (zh) | 2017-02-22 |
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Effective date of registration: 20210508 Address after: 355200 No.44 Jishi Road, Taimushan Town, Fuding City, Ningde City, Fujian Province Patentee after: Lin Chenyi Address before: 241000 No. 18 Longjiang Road, Jiujiang Economic Development Zone, Wuhu City, Anhui Province Patentee before: ANHUI DINGHUI NEW ENERGY TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20211125 Address after: 257100 room 222, block B, No. 59, Fuqian street, Dongying District, Dongying City, Shandong Province Patentee after: Dongying dongkai high end equipment manufacturing Industrial Park Co.,Ltd. Address before: 355200 No.44 Jishi Road, Taimushan Town, Fuding City, Ningde City, Fujian Province Patentee before: Lin Chenyi |
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Effective date of registration: 20221221 Address after: Room 305, South Office Building, 260m east of the intersection of South 1st Road and Xuzhou Road, Dongying Development Zone, Shandong 257091 Patentee after: Dongying Dongkai Park Operation Management Co.,Ltd. Address before: 257100 room 222, block B, No. 59, Fuqian street, Dongying District, Dongying City, Shandong Province Patentee before: Dongying dongkai high end equipment manufacturing Industrial Park Co.,Ltd. |
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