CN106273011B - 切断装置 - Google Patents

切断装置 Download PDF

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Publication number
CN106273011B
CN106273011B CN201610325679.0A CN201610325679A CN106273011B CN 106273011 B CN106273011 B CN 106273011B CN 201610325679 A CN201610325679 A CN 201610325679A CN 106273011 B CN106273011 B CN 106273011B
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China
Prior art keywords
substrate
cutting
image
cutting blade
scribe line
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CN201610325679.0A
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English (en)
Chinese (zh)
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CN106273011A (zh
Inventor
时本育往
吉田圭吾
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN106273011A publication Critical patent/CN106273011A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Forests & Forestry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201610325679.0A 2015-06-29 2016-05-17 切断装置 Active CN106273011B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-129403 2015-06-29
JP2015129403A JP6520466B2 (ja) 2015-06-29 2015-06-29 ブレーク装置

Publications (2)

Publication Number Publication Date
CN106273011A CN106273011A (zh) 2017-01-04
CN106273011B true CN106273011B (zh) 2020-09-08

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ID=57651245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610325679.0A Active CN106273011B (zh) 2015-06-29 2016-05-17 切断装置

Country Status (4)

Country Link
JP (1) JP6520466B2 (ja)
KR (1) KR102493063B1 (ja)
CN (1) CN106273011B (ja)
TW (1) TWI703101B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019082724A1 (ja) * 2017-10-27 2020-11-12 三星ダイヤモンド工業株式会社 メタル膜付き基板の分断方法
CN108793713B (zh) * 2018-06-27 2021-07-23 武汉华星光电技术有限公司 一种用于切割玻璃基板的切割机及玻璃基板的切割方法
CN109231806B (zh) * 2018-10-18 2023-10-31 常州大学怀德学院 一种止损生产中的玻璃裁宽失误的周转系统及方法
TWI797352B (zh) 2018-10-30 2023-04-01 日商三星鑽石工業股份有限公司 裂斷裝置
JP7257675B2 (ja) * 2019-07-29 2023-04-14 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
WO2022045077A1 (ja) * 2020-08-28 2022-03-03 三星ダイヤモンド工業株式会社 基板の分断検出装置及び基板の分断検出方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101197301A (zh) * 2006-12-08 2008-06-11 奥林巴斯株式会社 缺陷检查装置及缺陷检查方法
CN101355045A (zh) * 2007-07-25 2009-01-28 大日本网屏制造株式会社 基板检测装置和基板处理装置
CN102528562A (zh) * 2012-02-28 2012-07-04 上海大学 微型铣刀在线自动对刀与破损检测装置
JP2012183644A (ja) * 2011-03-03 2012-09-27 Denso Corp 基板の分割方法及び分割装置
CN103369231A (zh) * 2012-03-09 2013-10-23 欧姆龙株式会社 图像处理装置、图像处理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293141A (ja) * 1996-04-24 1997-11-11 Hitachi Ltd 移動物体検出装置
JPH10148620A (ja) * 1996-11-19 1998-06-02 Sekisui Chem Co Ltd 表面状態検査装置
JPH10214327A (ja) * 1997-01-30 1998-08-11 Nippon Telegr & Teleph Corp <Ntt> 画像を用いた表面欠陥検出方法
JP4169565B2 (ja) 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
JP2009148982A (ja) * 2007-12-20 2009-07-09 Daitron Technology Co Ltd ブレーキング装置
JP2012114126A (ja) * 2010-11-19 2012-06-14 Sharp Corp 基板分割装置および電子部品の製造方法
TWI455200B (zh) * 2012-01-05 2014-10-01 Wecon Automation Corp 切割裝置及方法
JP2013038434A (ja) * 2012-09-13 2013-02-21 Daitron Technology Co Ltd ブレーキング装置
JP6043149B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置および脆性材料基板のブレイク方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101197301A (zh) * 2006-12-08 2008-06-11 奥林巴斯株式会社 缺陷检查装置及缺陷检查方法
CN101355045A (zh) * 2007-07-25 2009-01-28 大日本网屏制造株式会社 基板检测装置和基板处理装置
JP2012183644A (ja) * 2011-03-03 2012-09-27 Denso Corp 基板の分割方法及び分割装置
CN102528562A (zh) * 2012-02-28 2012-07-04 上海大学 微型铣刀在线自动对刀与破损检测装置
CN103369231A (zh) * 2012-03-09 2013-10-23 欧姆龙株式会社 图像处理装置、图像处理方法

Also Published As

Publication number Publication date
TWI703101B (zh) 2020-09-01
KR20170002277A (ko) 2017-01-06
JP2017013255A (ja) 2017-01-19
JP6520466B2 (ja) 2019-05-29
CN106273011A (zh) 2017-01-04
KR102493063B1 (ko) 2023-01-27
TW201702197A (zh) 2017-01-16

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