CN106165039B - 用于夹紧工件的系统和方法 - Google Patents

用于夹紧工件的系统和方法 Download PDF

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Publication number
CN106165039B
CN106165039B CN201580007757.6A CN201580007757A CN106165039B CN 106165039 B CN106165039 B CN 106165039B CN 201580007757 A CN201580007757 A CN 201580007757A CN 106165039 B CN106165039 B CN 106165039B
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CN
China
Prior art keywords
workpiece
platen
electrode
hiv
voltage
Prior art date
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Active
Application number
CN201580007757.6A
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English (en)
Chinese (zh)
Other versions
CN106165039A (zh
Inventor
上原利夫
P·麦凯恩
D·赫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trek Inc
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Trek Inc
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Publication date
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Publication of CN106165039A publication Critical patent/CN106165039A/zh
Application granted granted Critical
Publication of CN106165039B publication Critical patent/CN106165039B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/02—Electrets, i.e. having a permanently-polarised dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
CN201580007757.6A 2014-02-07 2015-02-09 用于夹紧工件的系统和方法 Active CN106165039B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461937050P 2014-02-07 2014-02-07
US61/937,050 2014-02-07
PCT/US2015/015078 WO2015120419A1 (en) 2014-02-07 2015-02-09 System and method for clamping a work piece

Publications (2)

Publication Number Publication Date
CN106165039A CN106165039A (zh) 2016-11-23
CN106165039B true CN106165039B (zh) 2019-06-07

Family

ID=53778527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580007757.6A Active CN106165039B (zh) 2014-02-07 2015-02-09 用于夹紧工件的系统和方法

Country Status (12)

Country Link
US (1) US11282732B2 (enExample)
EP (1) EP3103127B1 (enExample)
JP (1) JP2017512378A (enExample)
KR (1) KR102402214B1 (enExample)
CN (1) CN106165039B (enExample)
DE (1) DE112015000700T5 (enExample)
GB (1) GB2540883B (enExample)
HK (1) HK1231629A1 (enExample)
MY (1) MY174723A (enExample)
PH (1) PH12016501425B1 (enExample)
SG (1) SG11201605836SA (enExample)
WO (1) WO2015120419A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019197128A2 (en) * 2018-04-12 2019-10-17 Asml Netherlands B.V. Apparatus and method
US11073544B2 (en) 2019-05-23 2021-07-27 Advanced Energy Industries, Inc. System and method to measure and adjust a charge of a workpiece
US11610800B2 (en) * 2021-03-22 2023-03-21 Applied Materials, Inc. Capacitive method of detecting wafer chucking and de-chucking
US11817340B2 (en) 2021-04-28 2023-11-14 Advanced Energy Industries, Inc. System and method for improved electrostatic chuck clamping performance

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299354A (ja) * 1992-04-21 1993-11-12 Kokusai Electric Co Ltd プラズマ処理装置のウェーハ保持装置
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
CN1224544A (zh) * 1996-04-09 1999-07-28 德尔西斯药品公司 静电吸盘
CN102081362A (zh) * 2009-08-07 2011-06-01 特瑞克股份有限公司 静电夹钳优化程序

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EP0491810A1 (en) 1989-09-22 1992-07-01 Blanchard Marketing Services Limited Sensing method and device for aggregation control
JP2886934B2 (ja) 1990-03-10 1999-04-26 株式会社クラレ ジヒドロフラン系化合物の製造方法
US5452177A (en) 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
JPH04162443A (ja) * 1990-10-24 1992-06-05 Japan Synthetic Rubber Co Ltd 静電チャック装置
US5436790A (en) 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor
JPH0786384A (ja) * 1993-09-17 1995-03-31 Sumitomo Metal Ind Ltd 試料台、該試料台のモニタリングシステム及び半導体製造装置
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
JP2976861B2 (ja) 1994-09-30 1999-11-10 日本電気株式会社 静電チャック及びその製造方法
JP3847363B2 (ja) 1996-02-02 2006-11-22 富士通株式会社 半導体ウェハ処理装置及び半導体ウェハ処理方法
US5708250A (en) * 1996-03-29 1998-01-13 Lam Resarch Corporation Voltage controller for electrostatic chuck of vacuum plasma processors
US5858099A (en) * 1996-04-09 1999-01-12 Sarnoff Corporation Electrostatic chucks and a particle deposition apparatus therefor
US5793192A (en) 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US6075375A (en) 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
JPH1167885A (ja) 1997-08-25 1999-03-09 Nissin Electric Co Ltd 基板保持装置
US6198616B1 (en) 1998-04-03 2001-03-06 Applied Materials, Inc. Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
JP3058615B2 (ja) 1998-04-10 2000-07-04 株式会社山武 ウエハ検出装置
JP3323135B2 (ja) 1998-08-31 2002-09-09 京セラ株式会社 静電チャック
US6965506B2 (en) 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6267839B1 (en) 1999-01-12 2001-07-31 Applied Materials, Inc. Electrostatic chuck with improved RF power distribution
US6741446B2 (en) 2001-03-30 2004-05-25 Lam Research Corporation Vacuum plasma processor and method of operating same
JP2002305237A (ja) 2001-04-05 2002-10-18 Hitachi Ltd 半導体製造方法および製造装置
KR101003387B1 (ko) 2002-09-27 2010-12-23 쓰쿠바 세이코 가부시키가이샤 정전 지지 장치 및 이를 이용한 정전 핀셋
US7072166B2 (en) 2003-09-12 2006-07-04 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage
KR20050056757A (ko) * 2003-12-10 2005-06-16 삼성전자주식회사 이온화 공정 챔버
JP4641290B2 (ja) 2006-07-31 2011-03-02 富士通テン株式会社 運転情報記録装置
JP2008047564A (ja) 2006-08-10 2008-02-28 Tokyo Electron Ltd 真空処理装置、静電チャックの診断方法及び記憶媒体
US8175821B2 (en) * 2006-09-12 2012-05-08 The University Of Tokyo Method for measuring physical quantity distribution and measurement system using sensor for physical quantity distribution
US7813103B2 (en) * 2007-10-11 2010-10-12 Applied Materials, Inc. Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes
KR20090068055A (ko) * 2007-12-22 2009-06-25 주식회사 동부하이텍 반도체 제조장비의 바이폴라형 정전척
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
JP5399791B2 (ja) * 2009-06-30 2014-01-29 コバレントマテリアル株式会社 静電チャック
JP5358364B2 (ja) 2009-09-11 2013-12-04 株式会社日立ハイテクノロジーズ プラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299354A (ja) * 1992-04-21 1993-11-12 Kokusai Electric Co Ltd プラズマ処理装置のウェーハ保持装置
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
CN1224544A (zh) * 1996-04-09 1999-07-28 德尔西斯药品公司 静电吸盘
CN102081362A (zh) * 2009-08-07 2011-06-01 特瑞克股份有限公司 静电夹钳优化程序

Also Published As

Publication number Publication date
PH12016501425B1 (en) 2020-01-31
GB2540883B (en) 2018-12-26
JP2017512378A (ja) 2017-05-18
SG11201605836SA (en) 2016-08-30
US20170162415A1 (en) 2017-06-08
KR20160118347A (ko) 2016-10-11
GB2540883A (en) 2017-02-01
DE112015000700T5 (de) 2016-11-24
GB201613425D0 (en) 2017-01-04
HK1231629A1 (zh) 2017-12-22
WO2015120419A1 (en) 2015-08-13
KR102402214B1 (ko) 2022-05-26
US11282732B2 (en) 2022-03-22
EP3103127A1 (en) 2016-12-14
CN106165039A (zh) 2016-11-23
EP3103127B1 (en) 2021-03-24
EP3103127A4 (en) 2017-06-28
PH12016501425A1 (en) 2017-02-06
MY174723A (en) 2020-05-10

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