CN106084797A - 用于电子产品的硅胶垫片 - Google Patents

用于电子产品的硅胶垫片 Download PDF

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CN106084797A
CN106084797A CN201610552169.7A CN201610552169A CN106084797A CN 106084797 A CN106084797 A CN 106084797A CN 201610552169 A CN201610552169 A CN 201610552169A CN 106084797 A CN106084797 A CN 106084797A
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silica gel
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gel pad
boron nitride
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闫森源
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Strong New Genuine (suzhou) Environmental Mstar Technology Ltd
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract

本发明公开了一种用于电子产品的硅胶垫片，包括如下组分：环氧树脂30‑50份，乙烯基硅油60‑100份，氮化硼35‑50份，石墨粉100‑150份，硅烷偶联剂0.2‑0.4份，触变剂1‑5份，增韧剂1‑5份，份数均为质量份数。本发明提供的用于电子产品的硅胶垫片中，采用用于电子产品的硅胶垫片以环氧树脂和乙烯基硅油配合为导热基材，采用石墨粉、氮化硼作为主要导热剂，通过设计特殊成分稳定剂，加入氮化硼阻燃剂，使得产品具有优质的性能，防腐耐磨，抗阻燃，承载力也强。

Description

用于电子产品的硅胶垫片
技术领域
本发明涉及一种用于电子产品的硅胶垫片，属于LED硅胶技术领域。
背景技术
在高科技不断研发生产的今天，导热材料的行业也在萌发中，用于电子产品的硅胶垫片起着很大的核心做用.由于一般的导热材料难于对电子重要部位起着既导热又有很好粘性的作用，用于电子产品的硅胶垫片完全解决了这个问题；特别是在电子、LED照明行业与LED电视领域中起到了重大的作用。
用于电子产品的硅胶垫片是由压克力聚合物填充导热陶瓷粉末，与有机硅胶粘剂复合而成。具有高导热和绝缘的特性，并具有柔软性、压缩性、服帖性、强粘性。适应温度范围大，可填补不平整的表面，能紧密牢固地贴合热源器件和散热片，将热量快速传导出去。
发明内容
目的：为解决现有技术的不足，本发明提供一种用于电子产品的硅胶垫片。
技术方案：为解决上述技术问题，本发明采用的技术方案为：
一种用于电子产品的硅胶垫片，其特征在于：包括如下组分：环氧树脂30-50份，乙烯基硅油60-100份，氮化硼35-50份，石墨粉100-150份，硅烷偶联剂0.2-0.4份，触变剂1-5份，增韧剂1-5份，份数均为质量份数。
作为优选方案，所述的用于电子产品的硅胶垫片，其特征在于，原料组成为：环氧树脂40份，乙烯基硅油100份，氮化硼42份，石墨粉125份，硅烷偶联剂0.3份，触变剂3份，增韧剂3份，份数均为质量份数。
作为优选方案，所述的用于电子产品的硅胶垫片，其特征在于：所述氮化硼的直径小于30um。
作为优选方案，所述的用于电子产品的硅胶垫片，其特征在于：所述石墨粉的粒径为2-8 um。
作为优选方案，所述的用于电子产品的硅胶垫片，其特征在于：所述触变剂选用过氧化苯甲酰。
作为优选方案，所述的用于电子产品的硅胶垫片，其特征在于：还包括稳定剂1-3份，所述稳定剂为对苯二酚。
有益效果：本发明提供的用于电子产品的硅胶垫片，用于电子产品的硅胶垫片带以高导热橡胶乙烯基硅油为导热基材，采用氧化锌、石墨粉、氮化硼等作为导热剂，单面或双面背有压敏用于电子产品的硅胶垫片，粘接可靠、强度高。用于电子产品的硅胶垫片带厚度薄，柔韧性好，非常易于贴合器件和散热器表面。用于电子产品的硅胶垫片带还能适应冷、热温度的变化，保证性能的一致和稳定。
具体实施方式
下面结合实例对本发明做具体说明：
实施例1：一种用于电子产品的硅胶垫片，组成如下：
环氧树脂30份，乙烯基硅油60份，氮化硼35份，石墨粉100份，硅烷偶联剂0.2份，触变剂1份，增韧剂1份，份数均为质量份数。
实施例2：一种用于电子产品的硅胶垫片，组成如下：
环氧树脂40份，乙烯基硅油100份，氮化硼42份，石墨粉125份，硅烷偶联剂0.3份，触变剂3份，增韧剂3份，份数均为质量份数。
实施例3：一种用于电子产品的硅胶垫片，组成如下：
环氧树脂50份，乙烯基硅油100份，氮化硼50份，石墨粉150份，硅烷偶联剂0.4份，触变剂5份，增韧剂5份，份数均为质量份数。
实施例4：一种用于电子产品的硅胶垫片，组成如下：
环氧树脂40份，乙烯基硅油100份，氮化硼42份，石墨粉125份，硅烷偶联剂0.3份，触变剂3份，增韧剂3份，稳定剂3份，份数均为质量份数。
以上实施例得到的产品，经过实验测试：本发明提供的用于电子产品的硅胶垫片中，采用用于电子产品的硅胶垫片以环氧树脂和乙烯基硅油配合为导热基材，采用石墨粉、氮化硼作为主要导热剂，通过设计特殊成分稳定剂，加入氮化硼阻燃剂，使得产品具有优质的性能，防腐耐磨，抗阻燃，承载力也强。
以上已以较佳实施例公开了本发明，然其并非用以限制本发明，凡采用等同替换或者等效变换方式所获得的技术方案，均落在本发明的保护范围之内。

Claims (6)

1.一种用于电子产品的硅胶垫片，其特征在于：包括如下组分：环氧树脂30-50份，乙烯基硅油60-100份，氮化硼35-50份，石墨粉100-150份，硅烷偶联剂0.2-0.4份，触变剂1-5份，增韧剂1-5份，份数均为质量份数。
2.根据权利要求1所述的用于电子产品的硅胶垫片，其特征在于，原料组成为：环氧树脂40份，乙烯基硅油100份，氮化硼42份，石墨粉125份，硅烷偶联剂0.3份，触变剂3份，增韧剂3份，份数均为质量份数。
3.根据权利要求1所述的用于电子产品的硅胶垫片，其特征在于：所述氮化硼的直径小于30um。
4.根据权利要求1所述的用于电子产品的硅胶垫片，其特征在于：所述石墨粉的粒径为2-8 um。
5.根据权利要求1所述的用于电子产品的硅胶垫片，其特征在于：所述触变剂选用过氧化苯甲酰。
6.根据权利要求1或2所述的用于电子产品的硅胶垫片，其特征在于：还包括稳定剂1-3份，所述稳定剂为对苯二酚。
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107286660A (zh) * 2017-06-20 2017-10-24 安徽燕青科技集团有限公司 一种led照明灯具用的防水密封硅胶圈
CN107418145A (zh) * 2017-05-26 2017-12-01 成都东浩散热器有限公司 耐老化的导热导电垫片组合物及其制备方法
CN109111697A (zh) * 2018-08-24 2019-01-01 东莞市昌圣硅胶制品有限公司 一种基于通讯器材应用的硅胶垫片
CN109467937A (zh) * 2018-09-30 2019-03-15 东莞市臻邦新材料科技有限公司 一种低密度高导热硅胶垫片及其制备方法
CN110317562A (zh) * 2019-06-20 2019-10-11 迪马新材料科技（苏州）有限公司 一种有机硅改性的环氧灌封胶

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CN101954766A (zh) * 2009-06-29 2011-01-26 信越化学工业株式会社 导热硅橡胶复合片材
CN102234410A (zh) * 2010-04-28 2011-11-09 上海合复新材料科技有限公司 导热型热固性模塑复合材料及其用途
CN105368051A (zh) * 2015-11-13 2016-03-02 深圳德邦界面材料有限公司 一种高导热率导热硅胶垫片及其制备方法

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CN1497035A (zh) * 2002-10-04 2004-05-19 ��Խ��ѧ��ҵ��ʽ���� 导热硅橡胶复合片材
CN101954766A (zh) * 2009-06-29 2011-01-26 信越化学工业株式会社 导热硅橡胶复合片材
CN102234410A (zh) * 2010-04-28 2011-11-09 上海合复新材料科技有限公司 导热型热固性模塑复合材料及其用途
CN105368051A (zh) * 2015-11-13 2016-03-02 深圳德邦界面材料有限公司 一种高导热率导热硅胶垫片及其制备方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107418145A (zh) * 2017-05-26 2017-12-01 成都东浩散热器有限公司 耐老化的导热导电垫片组合物及其制备方法
CN107286660A (zh) * 2017-06-20 2017-10-24 安徽燕青科技集团有限公司 一种led照明灯具用的防水密封硅胶圈
CN109111697A (zh) * 2018-08-24 2019-01-01 东莞市昌圣硅胶制品有限公司 一种基于通讯器材应用的硅胶垫片
CN109467937A (zh) * 2018-09-30 2019-03-15 东莞市臻邦新材料科技有限公司 一种低密度高导热硅胶垫片及其制备方法
CN110317562A (zh) * 2019-06-20 2019-10-11 迪马新材料科技（苏州）有限公司 一种有机硅改性的环氧灌封胶
CN110317562B (zh) * 2019-06-20 2021-11-19 迪马新材料科技（苏州）有限公司 一种有机硅改性的环氧灌封胶

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