CN106057755A - 一种用于多芯片封装的散热机构 - Google Patents
一种用于多芯片封装的散热机构 Download PDFInfo
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- CN106057755A CN106057755A CN201610705008.7A CN201610705008A CN106057755A CN 106057755 A CN106057755 A CN 106057755A CN 201610705008 A CN201610705008 A CN 201610705008A CN 106057755 A CN106057755 A CN 106057755A
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- radiating tube
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- cooling mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610705008.7A CN106057755B (zh) | 2016-08-22 | 2016-08-22 | 一种用于多芯片封装的散热机构 |
Applications Claiming Priority (1)
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CN201610705008.7A CN106057755B (zh) | 2016-08-22 | 2016-08-22 | 一种用于多芯片封装的散热机构 |
Publications (2)
Publication Number | Publication Date |
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CN106057755A true CN106057755A (zh) | 2016-10-26 |
CN106057755B CN106057755B (zh) | 2018-08-07 |
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CN201610705008.7A Active CN106057755B (zh) | 2016-08-22 | 2016-08-22 | 一种用于多芯片封装的散热机构 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI718449B (zh) * | 2018-12-07 | 2021-02-11 | 廖文池 | 可堆疊的熱管組件及其製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5157588A (en) * | 1991-03-30 | 1992-10-20 | Samsung Electronics Co., Ltd. | Semiconductor package and manufacture thereof |
CN1463075A (zh) * | 2002-05-27 | 2003-12-24 | 三星电机株式会社 | 带散热盖的陶瓷封装 |
CN1823561A (zh) * | 2003-07-16 | 2006-08-23 | 麦斯韦尔技术股份有限公司 | 用于提高可靠性的半导体器件封装 |
JP2008010825A (ja) * | 2006-06-29 | 2008-01-17 | Hynix Semiconductor Inc | 積層パッケージ |
-
2016
- 2016-08-22 CN CN201610705008.7A patent/CN106057755B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5157588A (en) * | 1991-03-30 | 1992-10-20 | Samsung Electronics Co., Ltd. | Semiconductor package and manufacture thereof |
CN1463075A (zh) * | 2002-05-27 | 2003-12-24 | 三星电机株式会社 | 带散热盖的陶瓷封装 |
CN1823561A (zh) * | 2003-07-16 | 2006-08-23 | 麦斯韦尔技术股份有限公司 | 用于提高可靠性的半导体器件封装 |
JP2008010825A (ja) * | 2006-06-29 | 2008-01-17 | Hynix Semiconductor Inc | 積層パッケージ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI718449B (zh) * | 2018-12-07 | 2021-02-11 | 廖文池 | 可堆疊的熱管組件及其製造方法 |
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Publication number | Publication date |
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CN106057755B (zh) | 2018-08-07 |
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Effective date of registration: 20180517 Address after: 318050 9 Mei Ting Road, Feng Jiang Street, Luqiao District, Taizhou, Zhejiang Applicant after: Xu Enming Address before: 523000 A1112, Huai Kai square, Yuan Mei Road, Nancheng District, Dongguan, Guangdong Applicant before: Wang Wenqing |
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Effective date of registration: 20200312 Address after: 510000 factory building 8, guangtangxi Road, Tianhe District, Guangzhou City, Guangdong Province (F3, building f) Patentee after: GUANGZHOU NINE CHIP ELECTRONIC SCIENCE & TECHNOLOGY CO., LTD. Address before: Taizhou City, Zhejiang province Luqiao District 318050 peak River Street No. 9, Mei Ting Lu Patentee before: Xu Enming |
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