CN106047278A - 一种高折射率耐黄变led封装硅胶 - Google Patents
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Abstract
一种高折射率的LED封装硅胶,包括组分A和组分B,所述组分A与组分B的重量比为4:1;组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂80~90份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅8~18份,铂系催化剂0.1~0.3份,粘接剂1~5份;组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅30‑50份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅50~70份,抑制剂0.1~0.3份。本发明的有益效果是:在配方的分子结构设计中,不含有苯环,而是引入主链含有环己基、树脂含有环己基的分子结构,除了具有优异的光学结构,高的折光率,而且具有极低的高温及UV黄变性能。
Description
技术领域
本发明涉及一种高折射率LED封装硅胶特别是高折射率耐黄变的LED封装硅胶,属于胶粘剂技术领域。
背景技术
LED被称为第四代照明光源或绿色光源。其具有节能、环保、寿命长、体积小等特点,可以广泛应用于照明(包括通用照明与景观装饰照明)、背光、指示显示等领域。LED产业的兴起,给节能减排、能源环保带来了新的希望,展现出了极其广阔的应用前景。随着LED产业尤其是照明产业的迅速发展,LED逐步向大功率方向发展,因此对封装材料提出了更多更全面的要求。高折射率LED封装硅胶因为内应力小,耐老化、耐高低温性能好,高光通量等性能成为重要的封装材料,被广泛用于LED封装领域。
目前的LED发展,功率越来越高,因此对封装材料的要求也越来越高。目前的有机硅材料特别是高折射率有机硅材料,要达到高的折光率,基本都是通过结构中引入大量苯基来实现的。较高的苯基含量,使高折射率LED封装材料结构致密,刚性强,极性强,粘接性优异,但同时带来的问题就是,苯环的存在,使得高折射率LED硅胶体系高温及UV老化黄变严重,导致灯珠在光、热的存在下光衰严重。
发明内容
本发明所要解决的技术问题是提供一种高折射率的LED封装硅胶特别是高折射率、耐黄变LED封装硅胶。
本发明解决上述技术问题的技术方案如下:一种高折射率的LED封装硅胶,包括组分A和组分B,所述组分A与组分B的重量比为4:1;
其中,所述组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂80~90份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅8~18份,铂系催化剂0.1~0.3份,粘接剂1~5份;
所述组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅30-50份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅50~70份,抑制剂0.1~0.3份。
本发明的有益效果是:在配方的分子结构设计中,不含有苯环,而是引入主链含有环己基、树脂含有环己基的分子结构,除了具有优异的光学结构,高的折光率,而且具有极低的高温及UV黄变性能。
进一步,所述甲基环己基乙烯基硅树脂分子式为(ViMe2SiO1/2)1(ChSiO3/2)3.3,其中,所述Me为甲基,Vi为乙烯基,Ch为环己基。
采用上述进一步方案的有益效果是,作为基体树脂,是一种硅树脂,含有乙烯基,提高产品强度与硬度,提高耐硫化性能。
环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅结构如下:
进一步,所述的粘接剂含有环氧基的偶联剂其结构式为:
粘接剂的加入,提高了封装材料对塑料及金属基材的粘接性。
进一步,所述铂系催化剂为铂-甲基苯基聚硅氧烷配合物或铂-烯烃配合物中的任意一种。优选为铂-甲基苯基聚硅氧烷配合物,其中,铂含量为5000ppm。
进一步,所述扩链剂为硅氢封端的主链含有环烃基结构的改性有机硅,其结构式如下:
采用上述进一步方案的有益效果是,作为扩链剂,不仅提供了活泼氢参与扩链反应,提高了交联密度,提高了聚合物的韧性,提高了耐冷热冲击性能,并且粘度低,对于整个体系起到粘度降低,强度、韧性提高的作用。
进一步,所述抑制剂为乙炔基环己醇或1,1,3-三苯基-2-丙炔-1-醇中的任意一种。优选为1,1,3-三苯基-2-丙炔-1-醇,其结构式如下:
具体实施方式
以下对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
组分A与组分B的重量比为4:1;铂系催化剂为铂-甲基苯基聚硅氧烷配合物,其中,铂含量为5000ppm;抑制剂为1,1,3-三苯基-2-丙炔-1-醇。
实施例1
组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂80份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)18份,铂系催化剂0.1份,粘接剂(结构式二)1.9份,室温下搅拌2小时,混合均匀;
所述组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)50份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅(结构式三)50份,抑制剂(结构式四)0.3份,室温下搅拌2小时,混合均匀。
实施例2
组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂90份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)8份,铂系催化剂0.3份,粘接剂(结构式二)1.7份,室温下搅拌2小时,混合均匀;
所述组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)30份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅(结构式三)70份,抑制剂(结构式四)0.1份,室温下搅拌2小时,混合均匀。
实施例3
组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂85份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)13份,铂系催化剂0.2份,粘接剂(结构式二)1.8份,室温下搅拌2小时,混合均匀;
所述组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅(结构式一)40份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅(结构式三)60份,抑制剂(结构式四)0.2份,室温下搅拌2小时,混合均匀。
对比实施例1
组分A包括以下重量份的原料:甲基苯基乙烯基硅树脂85份,乙烯基甲基苯基聚硅氧烷13份(结构式五),铂系催化剂0.2份,粘接剂1.8份,室温下搅拌2小时,混合均匀;
所述组分B包括以下重量份的原料:乙烯基甲基苯基聚硅氧烷40份(结构式五),扩链剂端含氢二苯基聚硅氧烷60份(m=3),抑制剂0.2份,室温下搅拌2小时,混合均匀。
其中所述甲基苯基乙烯基硅树脂分子(ViMe2SiO1/2)1(PhSiO3/2)3.3,其中,所述Me为甲基,Vi为乙烯基,Ph为苯基。
含有乙烯基甲基苯基的聚硅氧烷结构如下:
其中,Me为甲基,Ph为苯基,x=10
使用时,将所述A组分、B组分按重量比为4:1的配比室温下搅拌2小时,混合均匀,真空脱泡30分钟,然后点胶或灌胶于待封装件上,先在80℃加热1小时,再在150℃加热4小时,即可。
将实施例1-3和对比实施例1的A、B组分按重量比4:1的比例称量,室温下搅拌2小时,混合均匀,真空脱泡30分钟,将混合物倒入1mm深度载玻片自制模具内。固化条件:先在80℃加热1小时,再在150℃加热4小时,即可。
取出固化后胶片,用紫外分光光度计测试其初始黄变值b值。然后分别放入180℃高温老化200小时,放入UV老化箱老化(60℃,UVA,0.43mW/cm2)200小时。
测试数据对比如下表
表1性能指标表
通过表1可以看出,实施例1、2、3与对比实施例1对比,因为分子结构中引入了脂环结构替代了苯环,因此在高温老化与UV老化200h后,黄变b值明显低。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (5)
1.一种高折射率耐黄变LED封装硅胶,其特征在于,包括组分A和组分B,组分A与组分B的重量比为4:1;所述组分A包括以下重量份的原料:甲基环己基乙烯基硅树脂80~90份,环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅8~18份,铂系催化剂0.1~0.3份,粘接剂1~5份;
所述组分B包括以下重量份的原料:环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅30-50份,扩链剂硅氢封端的主链含有环烃基结构的改性有机硅50~70份,抑制剂0.1~0.3份;
所述甲基环己基乙烯基硅树脂分子式为(ViMe2SiO1/2)1(ChSiO3/2)3.3,其中,所述Me为甲基,Vi为乙烯基,C h为环己基;
所述环烯烃基封端的主链含有环己基与环烃基结构的改性有机硅结构如下:
2.根据权利要求1所述的封装硅胶,其特征在于,所述的粘接剂为含有环氧基的偶联剂,其结构式为:
3.根据权利要求1所述的封装硅胶,其特征在于,所述铂系催化剂为铂-甲基苯基聚硅氧烷配合物或铂-烯烃配合物中的任意一种,铂含量为5000ppm。
4.根据权利要求1所述的封装硅胶,其特征在于,所述扩链剂为硅氢封端的主链含有环烃基结构的改性有机硅,其结构式为:
5.根据权利要求1所述的封装硅胶,其特征在于,所述抑制剂为乙炔基环己醇或1,1,3-三苯基-2-丙炔-1-醇中的任意一种。
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CN110218456A (zh) * | 2019-06-20 | 2019-09-10 | 广东信翼科技有限公司 | 环己基led封装材料及其制备方法 |
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