CN106024680B - 端口门定位装置及相关的方法 - Google Patents

端口门定位装置及相关的方法 Download PDF

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Publication number
CN106024680B
CN106024680B CN201610416629.3A CN201610416629A CN106024680B CN 106024680 B CN106024680 B CN 106024680B CN 201610416629 A CN201610416629 A CN 201610416629A CN 106024680 B CN106024680 B CN 106024680B
Authority
CN
China
Prior art keywords
port door
door
framework
closing organ
movable closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610416629.3A
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English (en)
Chinese (zh)
Other versions
CN106024680A (zh
Inventor
A.C.波诺拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of CN106024680A publication Critical patent/CN106024680A/zh
Application granted granted Critical
Publication of CN106024680B publication Critical patent/CN106024680B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B7/00—Special arrangements or measures in connection with doors or windows
    • E06B7/28—Other arrangements on doors or windows, e.g. door-plates, windows adapted to carry plants, hooks for window cleaners
    • E06B7/32—Serving doors; Passing-through doors ; Pet-doors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
    • E06B3/50—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
    • E06B3/50—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement
    • E06B3/5009—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement where the sliding and rotating movements are necessarily performed simultaneously
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B5/00—Doors, windows, or like closures for special purposes; Border constructions therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
CN201610416629.3A 2010-06-30 2011-06-29 端口门定位装置及相关的方法 Active CN106024680B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/828,236 2010-06-30
US12/828,236 US8870516B2 (en) 2010-06-30 2010-06-30 Port door positioning apparatus and associated methods
CN201180041909.6A CN103155132B (zh) 2010-06-30 2011-06-29 端口门定位装置及相关的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180041909.6A Division CN103155132B (zh) 2010-06-30 2011-06-29 端口门定位装置及相关的方法

Publications (2)

Publication Number Publication Date
CN106024680A CN106024680A (zh) 2016-10-12
CN106024680B true CN106024680B (zh) 2019-02-19

Family

ID=45398872

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610416629.3A Active CN106024680B (zh) 2010-06-30 2011-06-29 端口门定位装置及相关的方法
CN201180041909.6A Active CN103155132B (zh) 2010-06-30 2011-06-29 端口门定位装置及相关的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201180041909.6A Active CN103155132B (zh) 2010-06-30 2011-06-29 端口门定位装置及相关的方法

Country Status (5)

Country Link
US (2) US8870516B2 (https=)
JP (2) JP5732132B2 (https=)
KR (1) KR101545067B1 (https=)
CN (2) CN106024680B (https=)
WO (1) WO2012003240A2 (https=)

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JP2912315B1 (ja) 1998-01-12 1999-06-28 鹿児島日本電気株式会社 蛍光表示管の排気装置
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
JP5736686B2 (ja) 2010-08-07 2015-06-17 シンフォニアテクノロジー株式会社 ロードポート
JP5729148B2 (ja) * 2011-06-07 2015-06-03 東京エレクトロン株式会社 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置
JP5727609B2 (ja) * 2011-07-06 2015-06-03 平田機工株式会社 容器開閉装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
CN103214474B (zh) * 2013-05-02 2016-04-27 南开大学 一类含4,5-二氢噻唑醇酸酯的5-甲基-1,2,3-噻二唑衍生物及其制备方法和用途
US20150345810A1 (en) * 2014-05-30 2015-12-03 Denso International America, Inc. Dual layer door
DK178586B1 (en) * 2015-02-02 2016-07-25 Vestas Wind Sys As Wind turbine access panel and method for securing same
KR101695948B1 (ko) * 2015-06-26 2017-01-13 주식회사 테라세미콘 기판처리 시스템
USD811627S1 (en) 2016-06-16 2018-02-27 Curtis Alan Roys LED lamp
JP6414535B2 (ja) * 2015-10-28 2018-10-31 株式会社ダイフク 収納容器
US10622236B2 (en) * 2017-08-30 2020-04-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for handling wafer carrier doors
JP6697428B2 (ja) * 2017-11-01 2020-05-20 ファナック株式会社 ファンユニットを備えるモータ駆動装置
KR101831202B1 (ko) 2017-12-20 2018-02-22 주식회사 싸이맥스 로드포트의 포트도어 구동장치
CN108005549B (zh) * 2018-01-12 2024-03-26 珠海市优氧健康产业有限公司 一种健康舱舱门密封结构
CN109615781B (zh) * 2018-12-17 2023-09-19 航天信息股份有限公司 自动出货装置
KR20230007951A (ko) 2021-07-06 2023-01-13 에이에스엠 아이피 홀딩 비.브이. 카세트 덮개 개방 장치
US12077938B2 (en) * 2021-10-12 2024-09-03 Caterpillar Inc. Secondary control system and method for mounting with service orientation

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US5302120A (en) * 1992-06-15 1994-04-12 Semitool, Inc. Door assembly for semiconductor processor
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CN1543663A (zh) * 2001-07-13 2004-11-03 包含智能通道门的smif装载通道接口
CN1743254A (zh) * 2004-08-30 2006-03-08 阿尔卡特公司 在微环境晶片传送盒和设备零件之间的真空接口
TWI278057B (en) * 2004-10-26 2007-04-01 Tdk Corp Enclosed container lid opening/closing system and enclosed container lid opening/closing method
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JPH05109863A (ja) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd 機械式インターフエース装置
US5302120A (en) * 1992-06-15 1994-04-12 Semitool, Inc. Door assembly for semiconductor processor
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
CN1543663A (zh) * 2001-07-13 2004-11-03 包含智能通道门的smif装载通道接口
CN1743254A (zh) * 2004-08-30 2006-03-08 阿尔卡特公司 在微环境晶片传送盒和设备零件之间的真空接口
JP2006074033A (ja) * 2004-08-30 2006-03-16 Alcatel ミニエンバイロメントポッドと装置との間の真空インタフェース
TWI278057B (en) * 2004-10-26 2007-04-01 Tdk Corp Enclosed container lid opening/closing system and enclosed container lid opening/closing method
TW200943463A (en) * 2007-10-03 2009-10-16 Tokyo Electron Ltd Inlet port mechanism for introducing object and treatment system

Also Published As

Publication number Publication date
US8870516B2 (en) 2014-10-28
US9378995B2 (en) 2016-06-28
US20150021230A1 (en) 2015-01-22
JP5732132B2 (ja) 2015-06-10
CN106024680A (zh) 2016-10-12
CN103155132B (zh) 2016-08-03
WO2012003240A3 (en) 2012-04-12
US20120000816A1 (en) 2012-01-05
JP2015128197A (ja) 2015-07-09
JP6101302B2 (ja) 2017-03-22
CN103155132A (zh) 2013-06-12
WO2012003240A2 (en) 2012-01-05
JP2013539203A (ja) 2013-10-17
KR101545067B1 (ko) 2015-08-17
KR20130054326A (ko) 2013-05-24

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