CN105993208A - Handheld device and handheld pan-tilt and electronic device using the same - Google Patents
Handheld device and handheld pan-tilt and electronic device using the same Download PDFInfo
- Publication number
- CN105993208A CN105993208A CN201580003653.8A CN201580003653A CN105993208A CN 105993208 A CN105993208 A CN 105993208A CN 201580003653 A CN201580003653 A CN 201580003653A CN 105993208 A CN105993208 A CN 105993208A
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- China
- Prior art keywords
- heat
- hand
- circuit board
- housing
- held
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
- Accessories Of Cameras (AREA)
Abstract
A handheld device (100) includes a shell (110) and an electronic device disposed in the shell (110), and an expansion interface (165) used for connecting with the electronic device is disposed on the shell (110). The expansion interface (165) is a heat conduction interface, and extends from outside of the shell to inside of the shell. The expansion interface (165) can conduct the heat generated by the electronic device in the working out of the shell. The invention also discloses a handheld pan-tilt (1000) and an electronic device using the handheld device (100), and the handheld device (100) and the handheld pan-tilt (1000) and the electronic device using the same have good heat dissipation function and are beneficial to miniaturize.
Description
Technical field
The present invention relates to a kind of hand-held device, and use hand-held The Cloud Terrace and the electronics dress of described hand-held device
Put.
Background technology
Usual hand-held The Cloud Terrace includes housing and the circuit board being arranged in described housing.Set on described circuit board
It is equipped with multiple functional module for realizing difference in functionality, such as image processing module, power module etc.,
Described functional module operationally would generally produce heat.Owing to described functional module is positioned at described housing shape
In the airtight space becoming, therefore, the heat that described functional module produces often is difficult to effectively, timely
Disperse.If described thermal accumlation is to a certain extent, by the performance of described for impact functional module, Jin Erying
Ring the overall performance of described The Cloud Terrace.
Although in addition, some hand-held The Cloud Terraces be in order to dispel the heat to above-mentioned functions module, be separately provided and dissipated
Thermal, for example, fan etc..But, this heat abstractor can increase the volume of hand-held The Cloud Terrace so that hand
Hold The Cloud Terrace and be unfavorable for Miniaturization Design.
Content of the invention
In view of this, it is necessary to provide a kind of thermal diffusivity preferable and beneficially Miniaturization Design hand-held dress
Put and use hand-held The Cloud Terrace and the electronic installation of described hand-held device.
A kind of hand-held device, including housing and the electronic component being arranged in described housing, described housing
On be provided with the expansion interface for connecting electronic equipment, described expansion interface is heat conducting interface from described
Extend in described housing outside housing, produce when described electronic component can be worked by described expansion interface
Heat is derived outside described housing.
Further, the inner chamber of described housing include battery cavities and and accommodating cavity, described battery cavities is used for receiving
Hold battery component.
Further, described accommodating cavity includes electric chamber and the heat dissipation cavity being connected with described electric chamber, institute
Stating electronic component to be arranged in described electric chamber, the heat producing in described electric chamber is by described heat dissipation cavity
Pass to described expansion interface.
Further, being provided with heat absorbing member in described heat dissipation cavity, described heat absorbing member absorbs described electronic component work
The heat producing when making, and described heat is passed to described expansion interface.
Further, described expansion interface includes heat-conducting part and extends fixed part from described heat-conducting part, institute
Stating fixed part pass through described housing and extend in described heat dissipation cavity, described heat-conducting part is against described housing
Outer surface, described fixed part is for fixing on the housing described heat-conducting part.
Further, described housing being provided with installing hole and multiple louvre, multiple described louvres lean on
Near and around described installing hole, described heat-conducting part is fixed on described by described installing hole by described fixed part
On shell, described heat-conducting part is against the outer surface of described housing and covers multiple described louvre.
Further, described heat absorbing member includes body and is convexly equipped in the covering portion of described body rim, described
The covering portion described fixed part of cladding and in the outer rim of multiple described louvres against the inner surface of described housing,
Described in described bulk absorption electronic component produce heat and described heat is passed to described covering portion, institute
Stating covering portion by described heat by the described fixed part described heat-conducting part of transmission, described covering portion is also by described
Heat passes to described heat-conducting part by multiple described louvres, and described heat is derived institute by described heat-conducting part
State outside housing.
Further, described fixed part is cylindrical, and described covering portion is curved.
Further, described heat absorbing member includes body and is convexly equipped in the covering portion of described body rim, described
The covering portion described fixed part of cladding, the heat that electronic component described in described bulk absorption produces by described heat
Amount passes to described covering portion, and described heat is transmitted described heat conduction by described fixed part by described covering portion
Portion, described heat-conducting part derives described heat outside described housing.
Further, described fixed part is cylindrical, and described covering portion is curved.
Further, described heat-conducting part is provided with heat radiation projection；
And/or, described heat-conducting part is provided with heat radiation groove.
Further, the outer surface of described housing is provided with for the operating surface of installation function button and for pacifying
Fill the installed surface of described expansion interface；Described operating surface is plane, and axial relative to described housing
Being obliquely installed, described installed surface is axially extending along described housing.
Further, described electronic component includes first circuit board, and described first circuit board is vertically arranged at
In described electric chamber, and axially arranged along described housing.
Further, described first circuit board includes following at least one: wireless fidelity module, voltage turn
Die change block, photoelectric conversion module, image processing module and image transmission module, described wireless fidelity module
For realizing Wireless Fidelity function, described voltage transformation module is used for realizing voltage conversion function, described light
Electricity modular converter is used for realizing photoelectric converting function, and described image processing module is used for image
Reason, described image transmission module is used for transmitting image.
Further, described electronic component also includes second circuit board, and described second circuit board is positioned at described
First circuit board towards the side of described operating surface, and in the face of described operating surface arrange；Described second circuit
Plate includes following at least one: power management module and The Cloud Terrace management module, described power management module is used
In realizing power management function, described The Cloud Terrace management module is used for realizing The Cloud Terrace management function.
Further, described electronic component also includes tertiary circuit plate, and described tertiary circuit plate corresponds to institute
State one end of first circuit board and be perpendicular to described first circuit board；Described tertiary circuit plate includes connection mode
Block, described link block is for realizing the interface linkage function of described hand-held device and cradle head device.
Further, described electronic component also includes the 4th circuit board, and described 4th circuit board is positioned at described
It between tertiary circuit plate and described first circuit board, and is parallel to the setting of described tertiary circuit plate；Described
Four circuit boards include following at least one: audio signal sample module and displacement sensing module, described audio frequency
Signal acquisition module is used for realizing audio signal sample function, and described location sensing modules is used for realizing described
The displacement sensing function of hand-held device.
Further, described heat absorbing member is to be parallel to the heat sink that described first circuit board is arranged.
Further, described heat absorbing member is arranged at described first circuit board towards the one of described second circuit board
Side.
Further, described hand-held device also includes being arranged at described first circuit board towards described second electricity
Bearing part on the surface of road plate, described bearing part is used for carrying described heat absorbing member.
Further, described hand-held device also includes being arranged between described bearing part and described heat absorbing member
Electromagnetic shielding plate, described heat absorbing member produces when absorbing the work of described first circuit board by described electromagnetic shielding plate
Raw heat.
A kind of hand-held The Cloud Terrace, including hand-held device and the cradle head device being arranged on described hand-held device, institute
State hand-held device and include housing and the electronic component being arranged in described housing, described housing is provided with
For connecting expansion interface and the connector of electronic equipment, described hand-held device by described connector with
Described cradle head device is connected, and described expansion interface is heat conducting interface and extends to described shell outside described housing
Internal, the heat producing when described electronic component can be worked by described expansion interface derives described housing
Outward.
Further, the inner chamber of described housing include battery cavities and and accommodating cavity, described battery cavities is used for receiving
Hold battery component.
Further, described accommodating cavity includes electric chamber and the heat dissipation cavity being connected with described electric chamber, institute
Stating electronic component to be arranged in described electric chamber, the heat producing in described electric chamber is by described heat dissipation cavity
Pass to described expansion interface.
Further, being provided with heat absorbing member in described heat dissipation cavity, described heat absorbing member absorbs described electronic component work
The heat producing when making, and described heat is passed to described expansion interface.
Further, described expansion interface includes heat-conducting part and extends fixed part from described heat-conducting part, institute
Stating fixed part pass through described housing and extend in described heat dissipation cavity, described heat-conducting part is against described housing
Outer surface, described fixed part is for fixing on the housing described heat-conducting part.
Further, described housing being provided with installing hole and multiple louvre, multiple described louvres lean on
Near and around described installing hole, described heat-conducting part is fixed on described by described installing hole by described fixed part
On shell, described heat-conducting part is against the outer surface of described housing and covers multiple described louvre.
Further, described heat absorbing member includes body and is convexly equipped in the covering portion of described body rim, described
The covering portion described fixed part of cladding and in the outer rim of multiple described louvres against the inner surface of described housing,
Described in described bulk absorption electronic component produce heat and described heat is passed to described covering portion, institute
Stating covering portion by described heat by the described fixed part described heat-conducting part of transmission, described covering portion is also by described
Heat passes to described heat-conducting part by multiple described louvres, and described heat is derived institute by described heat-conducting part
State outside housing.
Further, described fixed part is cylindrical, and described covering portion is curved.
Further, described heat absorbing member includes body and is convexly equipped in the covering portion of described body rim, described
The covering portion described fixed part of cladding, the heat that electronic component described in described bulk absorption produces by described heat
Amount passes to described covering portion, and described heat is transmitted described heat conduction by described fixed part by described covering portion
Portion, described heat-conducting part derives described heat outside described housing.
Further, described fixed part is cylindrical, and described covering portion is curved.
Further, described heat-conducting part is provided with heat radiation projection；
And/or, described heat-conducting part is provided with heat radiation groove.
Further, the outer surface of described housing is provided with for the operating surface of installation function button and for pacifying
Fill the installed surface of described expansion interface；Described operating surface is plane, and axial relative to described housing
Being obliquely installed, described installed surface is axially extending along described housing.
Further, described electronic component includes first circuit board, and described first circuit board is vertically arranged at
In described electric chamber, and axially arranged along described housing.
Further, described first circuit board includes following at least one: wireless fidelity module, voltage turn
Die change block, photoelectric conversion module, image processing module and image transmission module, described wireless fidelity module
For realizing Wireless Fidelity function, described voltage transformation module is used for realizing voltage conversion function, described light
Electricity modular converter is used for realizing photoelectric converting function, and described image processing module is used for image
Reason, described image transmission module is used for transmitting image.
Further, described electronic component also includes second circuit board, and described second circuit board is positioned at described
First circuit board towards the side of described operating surface, and in the face of described operating surface arrange；Described second circuit
Plate includes following at least one: power management module and The Cloud Terrace management module, described power management module is used
In realizing power management function, described The Cloud Terrace management module is used for realizing The Cloud Terrace management function.
Further, described electronic component also includes tertiary circuit plate, and described tertiary circuit plate corresponds to institute
State one end of first circuit board and be perpendicular to described first circuit board；Described tertiary circuit plate includes connection mode
Block, described link block is for realizing the interface linkage function of described hand-held device and cradle head device.
Further, described electronic component also includes the 4th circuit board, and described 4th circuit board is positioned at described
It between tertiary circuit plate and described first circuit board, and is parallel to the setting of described tertiary circuit plate；Described
Four circuit boards include following at least one: audio signal sample module and displacement sensing module, described audio frequency
Signal acquisition module is used for realizing audio signal sample function, and described location sensing modules is used for realizing described
The displacement sensing function of hand-held device.
Further, described heat absorbing member is to be parallel to the heat sink that described first circuit board is arranged.
Further, described heat absorbing member is arranged at described first circuit board towards the one of described second circuit board
Side.
Further, described hand-held device also includes being arranged at described first circuit board towards described second electricity
Bearing part on the surface of road plate, described bearing part is used for carrying described heat absorbing member.
Further, described hand-held device also includes being arranged between described bearing part and described heat absorbing member
Electromagnetic shielding plate, described heat absorbing member produces when absorbing the work of described first circuit board by described electromagnetic shielding plate
Raw heat.
Further, described cradle head device includes following at least one: pitch axis mechanism, roll axis mechanism
And translation shaft mechanism.
A kind of electronic installation, it is characterised in that include:
Housing, is provided with accommodating cavity；
Circuit board, is arranged in described accommodating cavity；
Heat absorbing member, is arranged in described accommodating cavity, and described heat absorbing member is fixing with described circuit board to be connected, and uses
In the described circuit board of carrying, and described heat absorbing member and described circuit board mutually insulated；
Expansion interface, is arranged on described housing, and for being mechanically connected with external interface and/or electrically connecting；
Wherein, described expansion interface is connected with described heat absorbing member, and can and described heat absorbing member between enter
Row heat conduction.
Further, described expansion interface at least local is exposed outside described housing；
Or, described heat absorbing member absorbs the heat that the electronic device on described circuit board produces, and passes to institute
State expansion interface, thus by the outside of heat spreader to described housing, with to the electronics on described circuit board
Device dispels the heat.
The present invention is by the expansion arranging on the housing and extend in described housing outside described housing
Exhibition interface, outside the described housing of the heat producing when the electronic component in described housing is worked derivation, thus
Described hand-held device, described hand-held The Cloud Terrace and described electronic installation is made to have preferable heat sinking function, and
Without being separately provided heat abstractor, beneficially Miniaturization Design.
Brief description
The schematic diagram of the The Cloud Terrace that Fig. 1 provides for embodiments of the present invention.
Fig. 2 is the front view of the hand-held mechanism of the The Cloud Terrace shown in Fig. 1.
Fig. 3 is Fig. 2 along the partial sectional view in III-III direction.
Fig. 4 is the partial exploded view of the hand-held mechanism of the The Cloud Terrace shown in Fig. 1.
Fig. 5 is the partial assembly drawing of Fig. 4.
Main element symbol description
Hand-held The Cloud Terrace 1000
Hand-held device 100
Housing 110
Inner chamber 111
Battery cavities 112
Accommodating cavity 113
Electric chamber 114
Heat dissipation cavity 115
Operating surface 121
Shooting button 122
First installed surface 123
Second installed surface 125
Power button 126
Installing hole 128
Louvre 129
Connector 130
Circuit board the 152nd, the 154th, the 156th, 158
Heat absorbing member 162
Body 163
Covering portion 164
Expansion interface 165
Heat-conducting part 166
Fixed part 168
Bearing part 170
Electromagnetic shielding plate 180
Battery component 190
Cradle head device 200
Pitch axis mechanism 210
Roll axis mechanism 220
Translation shaft mechanism 230
Image capturing device 300
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
The every other embodiment being obtained under the premise of going out creative work, broadly falls into the scope of protection of the invention.
It should be noted that when assembly is referred to as " being fixed on " another assembly, it can be directly at another
On individual assembly or also can there is assembly placed in the middle.When an assembly is considered as " connection " another group
Part, it can be directly to another assembly or may be simultaneously present assembly placed in the middle.When a group
Part is considered as " being arranged at " another assembly, and it can be to be set directly on another assembly or can
Can there is assembly placed in the middle simultaneously.Term as used herein " vertical ", " level ", "left", "right"
And similar statement is for illustrative purposes only.
Unless otherwise defined, all of technology used herein and scientific terminology and the skill belonging to the present invention
The implication that the technical staff in art field is generally understood that is identical.Used in the description of the invention herein
Term be intended merely to describe specific embodiment purpose, it is not intended that in limit the present invention.Institute herein
The term that uses " and/or " include arbitrary and all of group of one or more related Listed Items
Close.
Below in conjunction with the accompanying drawings, some embodiments of the present invention are elaborated.In situation about not conflicting
Under, the feature in following embodiment and embodiment can be mutually combined.
Referring to Fig. 1, embodiments of the present invention provide a kind of hand-held The Cloud Terrace 1000.Described hand-held The Cloud Terrace
1000 include hand-held device 100 and the cradle head device being arranged on described hand-held device 100
200.Described cradle head device 200 can be two axle The Cloud Terraces, three axle The Cloud Terraces etc., in the present embodiment,
Illustrate as a example by three axle The Cloud Terraces.
In the present embodiment, described cradle head device 200 includes the 210th, the roll of pitch axis mechanism
Axis mechanism 220 and translation shaft mechanism 230.Wherein, described pitch axis mechanism 210
For carrying image capturing device 300, described image capturing device 300 can be photograph
Machine, image first-class.Described roll axis mechanism 220 and described pitch axis mechanism 210 and described
Translation shaft mechanism 230 is connected.Described translation shaft mechanism 230 and described hand-held device 100
It is connected.
Please refer to Fig. 1 to Fig. 5, the 130th, described hand-held device 100 includes housing the 110th, connector
Electronic component, radiating subassembly, bearing part the 170th, electromagnetic shielding plate 180 and battery component 190.Described company
Fitting 130 is arranged at the top of described housing 110, is used for connecting described translation shaft mechanism 230.Institute
State electronic component, described bearing part the 170th, described electromagnetic shielding plate 180 and described battery component 190 to set
In described housing 110.A described radiating subassembly part is positioned at described housing 110, and a part is positioned at institute
State outside housing 110.The heat producing when described radiating subassembly is for working described electronic component derives institute
State outside housing 110, with to described electronic element radiating.Described battery component 190 is used for as described hand-held cloud
Platform 1000 is powered.
In the present embodiment, described housing 110 is substantially in rectangular-shaped.The inner chamber 111 of described housing 110
One end be separated into battery cavities 112, other end is separated into accommodating cavity 113.Described accommodating cavity 113
Including electric chamber 114 and the heat dissipation cavity 115 being connected with described electric chamber 114.Described electronic component is arranged
In described electric chamber 114, described radiating subassembly is arranged in described heat dissipation cavity 115, described bearing part 170
And described electromagnetic shielding plate 180 is located between described electric chamber 114 and described heat dissipation cavity 115, described battery
Assembly 190 is arranged in described battery cavities 112.
In the present embodiment, described housing 110 includes that operating surface 121 is adjacent with described operating surface 121
The first installed surface 123 and adjacent with described operating surface 121 and with described first installed surface 123 relative
Two installed surfaces 125.(shooting as shown in Figure 1 is pressed to be provided with multiple function button on described operating surface 121
Key 122 etc.).It is provided with expansion interface (expansion interface 165 as shown in Figure 1 on described first installed surface 123
Deng).It is provided with function button (power button 126 etc. as shown in Figure 2) on described second installed surface 125.
Described operating surface 121 is plane, and relative to the axially inclined setting of described housing 110.Described first
Axially extending along described housing 110 of installed surface 123 and described second installed surface 125.
In the present embodiment, described electronic component includes circuit board the 152nd, the 154th, the 156th, 158.Institute
State circuit board 152 to be vertically arranged in described electric chamber 114, and axially arranged along described housing 110.
Described circuit board 154 is positioned at the side towards described operating surface 121 for the described circuit board 152, and in the face of described
Operating surface 121 is arranged.Described circuit board 158 corresponds to one end of described circuit board 152 and is perpendicular to described
Circuit board 152.It is between described circuit board 158 and flat that described circuit board 156 is positioned at described circuit board 152
Row is in described circuit board 158.Described circuit board 152 by soft arranging wire with described can board the 154th, the 156th, 158
It is connected.
Described circuit board 152 includes following at least one: Wi-Fi (Wireless Fidelity, Wireless Fidelity)
Module, voltage transformation module, photoelectric conversion module, image processing module and image transmission module.Described
Wi-Fi module is used for realizing Wi-Fi function, and described voltage transformation module is used for realizing voltage conversion function,
Described photoelectric conversion module is used for realizing photoelectric converting function, and described image processing module is used for realizing image
Processing function, described image transmission module is used for realizing image transmission function.Described circuit board 154 includes
Following at least one: power management module and The Cloud Terrace management module.Described power management module is used for realizing
Power management function, described The Cloud Terrace management module is used for realizing The Cloud Terrace management function.Described circuit board 156
Including following at least one: audio signal sample module and displacement sensing module.Described audio signal sample
Module is used for realizing audio signal sample function, and described location sensing modules is used for realizing described hand-held dress
Put the displacement sensing function of 100.Described displacement sensing module includes gyroscope and compass.Described circuit
Plate 158 including but not limited to link block, described link block is used for realizing described hand-held device 100
Interface linkage function with described cradle head device 200.
Described radiating subassembly includes heat absorbing member 162 and for connecting the expansion interface 165 of electronic equipment.Described
Heat absorbing member 162 is arranged in described heat dissipation cavity 115, is parallel to described circuit board 152, and is positioned at described electricity
Road plate is towards the side of described circuit board 154.Described heat absorbing member 162 includes body 163 and is convexly equipped in described
The covering portion 164 of body 163 rim.Described expansion interface 165 is heat conducting interface, and it includes heat-conducting part 166
And extend fixed part 168 from described heat-conducting part 166.Described fixed part 168 passes through described first installed surface
The installing hole 128 of 123 simultaneously extends in described heat dissipation cavity 115.Described fixed part 168 and described installing hole
128 interference fit or threaded engagement, to be fixed on described heat-conducting part 166 on described housing 110.Described
It is additionally provided with close and around described installing hole 128 multiple louvres 129 on first installed surface 123.Institute
State heat-conducting part 166 and against the outer surface of described second installed surface 125 and cover multiple described louvre 129.
Described covering portion 164 is coated with described fixed part 168 and in the outer rim of multiple described louvres 129 against described
The inner surface of the second installed surface 125.In the present embodiment, described expansion interface 165 is used for and described electricity
The interface of subset is mechanically connected and/or electrical connection.
In the present embodiment, described heat absorbing member 162 is for being parallel to the heat radiation that described circuit board 152 is arranged
Plate.Described expansion interface 165 is a dish dentation expansion interface, and described dish dentation expansion interface is for by institute
State hand-held The Cloud Terrace 1000 and expand the connection electronic equipment such as mobile phone, flat board.Described fixed part 168 is substantially in circle
Column, described covering portion 164 is generally curved.
Described bearing part 170 is arranged at described circuit board 152 towards on the surface of described circuit board 154, uses
In the described electromagnetic shielding plate 180 of carrying and described heat absorbing member 162.Described electromagnetic shielding plate 180 is used for shielding
Electromagnetic wave and there is good thermal conductivity.Described electromagnetic shielding plate 180 is arranged at described bearing part 170 and institute
State between heat absorbing member 162, and relative two surface of described electromagnetic shielding plate 180 respectively with described suction
Warmware 162 and described bearing part 170 contact.Described heat absorbing member 162 is absorbed by described electromagnetic shielding plate 180
The heat producing when described circuit board 152 works.
When described hand-held The Cloud Terrace 1000 works, described circuit board the 152nd, the 154th, the 156th, the function on 158
Module works and produces heat.Described body 163 absorbs described circuit board by described electromagnetic shielding plate 180
152 heats producing, and the heat of absorption is passed to described covering portion 164.Described covering portion 164 will
Heat transmits described heat-conducting part 166 by described fixed part 168, and heat is also passed through by described covering portion 164
Multiple described louvres 129 pass to described heat-conducting part 166.Described heat is derived by described heat-conducting part 166
Outside described housing 110, thus realize to heat sinking function.In the present embodiment, arrange multiple described dissipate
Hot hole 129 is to strengthen the heat transfer between described covering portion 164 and described heat-conducting part 166.
It is appreciated that when being not provided with multiple described louvre 129 on described second installed surface 125, described
Heat-conducting part 166 is against the outer surface of described second installed surface 125, and described covering portion 164 is coated with described fixing
Portion 168 is against the inner surface of described second installed surface 125.Heat is passed through described solid by described covering portion 164
Determining portion 168 and transmitting described heat-conducting part 166, described heat is derived described housing 110 by described heat-conducting part 166
Outward.
It is appreciated that described electronic component also includes chip, resistance, electric capacity, inductance etc., described electronics
The quantity of the circuit board included by element can be one or more, for example, and two, three, six etc.
Deng.The quantity of the functional module included by each circuit board and functional module function to be realized are equal
Can adjust accordingly according to actual conditions.
It is appreciated that arrangement mode in described electric chamber 114 for multiple described circuit board, position relationship
And annexation all can be according to being that actual conditions adjust accordingly.
It is appreciated that the side of each circuit board can arrange a heat absorbing member 162, with to each
Individual heat dissipation for circuit board, therefore, the quantity of described heat absorbing member 162 can be one or more, described extension
The quantity of interface 165 also can be one or more.
It is appreciated that one that is protruding at least provided with heat radiation on described heat-conducting part 166 and that dispel the heat in groove,
Strengthen heat-conducting area with described heat-conducting part 166.
It is appreciated that described battery component 190 includes one or more rechargeable battery.
It is appreciated that on described housing 110 that the part corresponding to described battery cavities 112 is provided with multiple instruction
Lamp (not shown), described indicator lamp is for indicating the electricity of described battery component 190.
The present invention is by being arranged at described heat absorbing member 162 on described circuit board 152 to absorb described circuit
The heat of plate 152, and the heat being absorbed described heat absorbing member 162 by described expansion interface 165 derives institute
State outside housing, so that described hand-held The Cloud Terrace 1000 has preferable heat sinking function, and without individually setting
Put heat abstractor, beneficially Miniaturization Design.
Embodiment of above is only in order to illustrating technical scheme and unrestricted, although with reference to above real
The present invention has been described in detail by mode of executing, and it will be understood by those within the art that, can be right
Technical scheme is modified or equivalent should not depart from the spirit of technical solution of the present invention
And scope.
Claims (45)
1. a hand-held device, including housing and the electronic component being arranged in described housing, described shell
It is provided with the expansion interface for connecting electronic equipment and for connecting the connector of cradle head device on body,
It is characterized in that: described expansion interface is heat conducting interface and extends to outside described housing in described housing,
The heat producing when described electronic component can be worked by described expansion interface is derived outside described housing.
2. hand-held device as claimed in claim 1, it is characterised in that: the inner chamber of described housing includes electricity
Cell cavity and and accommodating cavity, described battery cavities is used for housing battery component.
3. hand-held device as claimed in claim 2, it is characterised in that: described accommodating cavity includes electric chamber
And the heat dissipation cavity being connected with described electric chamber, described electronic component is arranged in described electric chamber, described
The heat producing in electric chamber passes to described expansion interface by described heat dissipation cavity.
4. hand-held device as claimed in claim 3, it is characterised in that: it is provided with heat absorption in described heat dissipation cavity
Part, the heat that described heat absorbing member produces when absorbing the work of described electronic component, and described heat is passed to
Described expansion interface.
5. hand-held device as claimed in claim 4, it is characterised in that: described expansion interface includes heat conduction
Portion and extend fixed part from described heat-conducting part, described fixed part passes through described housing and extends to described dissipating
In hot chamber, described heat-conducting part is against the outer surface of described housing, and described fixed part is for by described heat-conducting part
Fix on the housing.
6. hand-held device as claimed in claim 5, it is characterised in that: it is provided with installation on described housing
Hole and multiple louvre, multiple described louvres near and around described installing hole, described fixed part passes through
Described installing hole by fixing for described heat-conducting part on the housing, described heat-conducting part is against outside described housing
Multiple described louvre is simultaneously covered in surface.
7. hand-held device as claimed in claim 6, it is characterised in that: described heat absorbing member include body and
Being convexly equipped in the covering portion of described body rim, the described fixed part of described covering portion cladding simultaneously described dissipates in multiple
The outer rim of hot hole against the inner surface of described housing, heat that electronic component described in described bulk absorption produces
And described heat is passed to described covering portion, described heat is passed by described covering portion by described fixed part
Pass described heat-conducting part, described covering portion also by described heat by multiple described louvres pass to described in lead
Hot portion, described heat-conducting part derives described heat outside described housing.
8. hand-held device as claimed in claim 7, it is characterised in that: described fixed part is cylindrical,
Described covering portion is curved.
9. hand-held device as claimed in claim 5, it is characterised in that: described heat absorbing member include body and
It is convexly equipped in the covering portion of described body rim, the described fixed part of described covering portion cladding, described bulk absorption
Described electronic component produce heat and described heat is passed to described covering portion, described covering portion is by institute
Stating heat and transmitting described heat-conducting part by described fixed part, described heat is derived described shell by described heat-conducting part
In vitro.
10. hand-held device as claimed in claim 9, it is characterised in that: described fixed part is cylindrical,
Described covering portion is curved.
11. hand-held devices as claimed in claim 5, it is characterised in that: it is provided with on described heat-conducting part
Heat radiation projection；
And/or, described heat-conducting part is provided with heat radiation groove.
12. hand-held devices as claimed in claim 4, it is characterised in that: the outer surface of described housing sets
Have for the operating surface of installation function button and for installing the installed surface of described expansion interface；Described operation
Face is plane, and relative to the axially inclined setting of described housing, described installed surface is along described housing
Axially extending.
13. hand-held devices as claimed in claim 12, it is characterised in that: described electronic component includes
One circuit board, described first circuit board is vertically arranged in described electric chamber, and axial along described housing
Arrange.
14. hand-held devices as claimed in claim 13, it is characterised in that: described first circuit board includes
Following at least one: wireless fidelity module, voltage transformation module, photoelectric conversion module, image procossing mould
Block and image transmission module, described wireless fidelity module is used for realizing Wireless Fidelity function, and described voltage turns
Die change block is used for realizing voltage conversion function, and described photoelectric conversion module is used for realizing photoelectric converting function,
Described image processing module is for processing to image, and described image transmission module is used for transmitting image.
15. hand-held devices as claimed in claim 14, it is characterised in that: described electronic component also includes
Second circuit board, described second circuit board is positioned at the side towards described operating surface for the described first circuit board,
And in the face of described operating surface is arranged；Described second circuit board includes following at least one: power management module
And The Cloud Terrace management module, described power management module is used for realizing power management function, and described The Cloud Terrace manages
Module is used for realizing The Cloud Terrace management function.
16. hand-held devices as claimed in claim 15, it is characterised in that: described electronic component also includes
Tertiary circuit plate, described tertiary circuit plate is corresponding to one end of described first circuit board and is perpendicular to described the
One circuit board；Described tertiary circuit plate includes link block, and described link block is used for realizing described hand-held
Device and the interface linkage function of cradle head device.
17. hand-held devices as claimed in claim 16, it is characterised in that: described electronic component also includes
4th circuit board, described 4th circuit board is positioned between described tertiary circuit plate and described first circuit board,
And it is parallel to the setting of described tertiary circuit plate；Described 4th circuit board includes following at least one: audio frequency is believed
Number acquisition module and displacement sensing module, described audio signal sample module is used for realizing audio signal sample
Function, described location sensing modules is for realizing the displacement sensing function of described hand-held device.
18. hand-held devices as claimed in claim 13, it is characterised in that: described heat absorbing member is for being parallel to
The heat sink that described first circuit board is arranged.
19. hand-held devices as claimed in claim 15, it is characterised in that: described heat absorbing member is arranged at institute
State the side towards described second circuit board for the first circuit board.
20. hand-held devices as claimed in claim 15, it is characterised in that: described hand-held device also includes
It is arranged at described first circuit board towards the bearing part on the surface of described second circuit board, described bearing part
For carrying described heat absorbing member.
21. hand-held devices as claimed in claim 20, it is characterised in that: described hand-held device also includes
Being arranged at the electromagnetic shielding plate between described bearing part and described heat absorbing member, described heat absorbing member passes through described electricity
The heat that magnetic shield panel produces when absorbing the work of described first circuit board.
22. 1 kinds of hand-held The Cloud Terraces, including hand-held device and the cradle head device being arranged on described hand-held device,
Described hand-held device includes housing and the electronic component being arranged in described housing, and described housing is arranged
Having the expansion interface for connecting electronic equipment and connector, described hand-held device passes through described connector
It is connected with described cradle head device, it is characterised in that: described expansion interface is heat conducting interface from described housing
Extend to outward in described housing, the heat producing when described electronic component can be worked by described expansion interface
Derive outside described housing.
23. hand-held The Cloud Terraces as claimed in claim 22, it is characterised in that: the inner chamber of described housing includes
Battery cavities and and accommodating cavity, described battery cavities is used for housing battery component.
24. hand-held The Cloud Terraces as claimed in claim 23, it is characterised in that: described accommodating cavity includes electrically
Chamber and the heat dissipation cavity being connected with described electric chamber, described electronic component is arranged in described electric chamber, institute
The heat producing in stating electric chamber passes to described expansion interface by described heat dissipation cavity.
25. hand-held The Cloud Terraces as claimed in claim 24, it is characterised in that: it is provided with suction in described heat dissipation cavity
Warmware, the heat that described heat absorbing member produces when absorbing the work of described electronic component, and described heat is transmitted
To described expansion interface.
26. hand-held The Cloud Terraces as claimed in claim 25, it is characterised in that: described expansion interface includes leading
Hot portion and extend fixed part from described heat-conducting part, described fixed part passes through described housing and extends to described
In heat dissipation cavity, described heat-conducting part is against the outer surface of described housing, and described fixed part is for by described heat conduction
Portion is fixing on the housing.
27. hand-held The Cloud Terraces as claimed in claim 26, it is characterised in that: it is provided with peace on described housing
Dress hole and multiple louvre, multiple described louvres near and around described installing hole, described fixed part leads to
Crossing described installing hole to fix on the housing described heat-conducting part, described heat-conducting part is against described housing
Outer surface simultaneously covers multiple described louvre.
28. hand-held The Cloud Terraces as claimed in claim 27, it is characterised in that: described heat absorbing member includes body
And it is convexly equipped in the covering portion of described body rim, the described fixed part of described covering portion cladding in multiple described
The outer rim of louvre against the inner surface of described housing, heat that electronic component described in described bulk absorption produces
Described heat is simultaneously passed to described covering portion by amount, and described heat is passed through described fixed part by described covering portion
Transmitting described heat-conducting part, described heat is also passed to described by described covering portion by multiple described louvres
Heat-conducting part, described heat-conducting part derives described heat outside described housing.
29. hand-held The Cloud Terraces as claimed in claim 28, it is characterised in that: described fixed part is cylindrical,
Described covering portion is curved.
30. hand-held The Cloud Terraces as claimed in claim 26, it is characterised in that: described heat absorbing member includes body
And it is convexly equipped in the covering portion of described body rim, the described fixed part of described covering portion cladding, described body is inhaled
Receiving the heat of described electronic component generation and described heat passing to described covering portion, described covering portion will
Described heat is derived described by the described heat-conducting part of described fixed part transmission, described heat-conducting part by described heat
Outside housing.
31. hand-held The Cloud Terraces as claimed in claim 30, it is characterised in that: described fixed part is cylindrical,
Described covering portion is curved.
32. hand-held The Cloud Terraces as claimed in claim 26, it is characterised in that: it is provided with on described heat-conducting part
Heat radiation projection；
And/or, described heat-conducting part is provided with heat radiation groove.
33. hand-held The Cloud Terraces as claimed in claim 25, it is characterised in that: the outer surface of described housing sets
Have for the operating surface of installation function button and for installing the installed surface of described expansion interface；Described operation
Face is plane, and relative to the axially inclined setting of described housing, described installed surface is along described housing
Axially extending.
34. hand-held The Cloud Terraces as claimed in claim 33, it is characterised in that: described electronic component includes
One circuit board, described first circuit board is vertically arranged in described electric chamber, and axial along described housing
Arrange.
35. hand-held The Cloud Terraces as claimed in claim 34, it is characterised in that: described first circuit board includes
Following at least one: wireless fidelity module, voltage transformation module, photoelectric conversion module, image procossing mould
Block and image transmission module, described wireless fidelity module is used for realizing Wireless Fidelity function, and described voltage turns
Die change block is used for realizing voltage conversion function, and described photoelectric conversion module is used for realizing photoelectric converting function,
Described image processing module is for processing to image, and described image transmission module is used for transmitting image.
36. hand-held The Cloud Terraces as claimed in claim 35, it is characterised in that: described electronic component also includes
Second circuit board, described second circuit board is positioned at the side towards described operating surface for the described first circuit board,
And in the face of described operating surface is arranged；Described second circuit board includes following at least one: power management module
And The Cloud Terrace management module, described power management module is used for realizing power management function, and described The Cloud Terrace manages
Module is used for realizing The Cloud Terrace management function.
37. hand-held The Cloud Terraces as claimed in claim 36, it is characterised in that: described electronic component also includes
Tertiary circuit plate, described tertiary circuit plate is corresponding to one end of described first circuit board and is perpendicular to described the
One circuit board；Described tertiary circuit plate includes link block, and described link block is used for realizing described hand-held
Device and the interface linkage function of cradle head device.
38. hand-held The Cloud Terraces as claimed in claim 37, it is characterised in that: described electronic component also includes
4th circuit board, described 4th circuit board is positioned between described tertiary circuit plate and described first circuit board,
And it is parallel to the setting of described tertiary circuit plate；Described 4th circuit board includes following at least one: audio frequency is believed
Number acquisition module and displacement sensing module, described audio signal sample module is used for realizing audio signal sample
Function, described location sensing modules is for realizing the displacement sensing function of described hand-held device.
39. hand-held The Cloud Terraces as claimed in claim 34, it is characterised in that: described heat absorbing member is for being parallel to
The heat sink that described first circuit board is arranged.
40. hand-held The Cloud Terraces as claimed in claim 36, it is characterised in that: described heat absorbing member is arranged at institute
State the side towards described second circuit board for the first circuit board.
41. hand-held The Cloud Terraces as claimed in claim 36, it is characterised in that: described hand-held device also includes
It is arranged at described first circuit board towards the bearing part on the surface of described second circuit board, described bearing part
For carrying described heat absorbing member.
42. hand-held The Cloud Terraces as claimed in claim 41, it is characterised in that: described hand-held device also includes
Being arranged at the electromagnetic shielding plate between described bearing part and described heat absorbing member, described heat absorbing member passes through described electricity
The heat that magnetic shield panel produces when absorbing the work of described first circuit board.
43. hand-held The Cloud Terraces as claimed in claim 22, it is characterised in that: described cradle head device include as
Lower at least one: pitch axis mechanism, roll axis mechanism and translation shaft mechanism.
44. 1 kinds of electronic installations, it is characterised in that include:
Housing, is provided with accommodating cavity；
Circuit board, is arranged in described accommodating cavity；
Heat absorbing member, is arranged in described accommodating cavity, and described heat absorbing member is fixing with described circuit board to be connected, and uses
In the described circuit board of carrying, and described heat absorbing member and described circuit board mutually insulated；
Expansion interface, is arranged on described housing, and for being mechanically connected with external interface and/or electrically connecting；
Wherein, described expansion interface is connected with described heat absorbing member, and can and described heat absorbing member between enter
Row heat conduction.
45. electronic installations as claimed in claim 44, it is characterised in that: described expansion interface at least office
Portion exposes outside described housing；
Or, described heat absorbing member absorbs the heat that the electronic device on described circuit board produces, and passes to institute
State expansion interface, thus by the outside of heat spreader to described housing, with to the electronics on described circuit board
Device dispels the heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938994.5A CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/087505 WO2017028274A1 (en) | 2015-08-19 | 2015-08-19 | Handheld device and cradle head and electronic device using same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938994.5A Division CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105993208A true CN105993208A (en) | 2016-10-05 |
| CN105993208B CN105993208B (en) | 2018-06-12 |
Family
ID=57040923
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580003653.8A Expired - Fee Related CN105993208B (en) | 2015-08-19 | 2015-08-19 | Hand-held device and the hand-held holder and electronic device using the hand-held device |
| CN201710938994.5A Expired - Fee Related CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938994.5A Expired - Fee Related CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6605710B2 (en) |
| CN (2) | CN105993208B (en) |
| WO (1) | WO2017028274A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109154414A (en) * | 2016-12-28 | 2019-01-04 | 深圳市大疆灵眸科技有限公司 | Holder holds bar assembly and is installed with the holder that the holder holds bar assembly |
| CN109983400A (en) * | 2017-09-29 | 2019-07-05 | 深圳市大疆灵眸科技有限公司 | Camera body and camera structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6557939B1 (en) * | 2018-05-21 | 2019-08-14 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Holding system and imaging system |
| CN112074112B (en) * | 2020-08-13 | 2021-10-19 | 华为技术有限公司 | Electronic equipment and extension assembly |
| CN112303423B (en) * | 2020-10-15 | 2022-10-25 | 天目爱视（北京）科技有限公司 | Intelligent three-dimensional information acquisition equipment stable in rotation |
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| CN104812222A (en) * | 2015-05-15 | 2015-07-29 | 深圳市大疆创新科技有限公司 | Heat dissipation structure and electronic device comprising same |
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| US7321491B2 (en) * | 2006-03-15 | 2008-01-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink for a portable computer |
| US8477499B2 (en) * | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US8113863B2 (en) * | 2009-08-25 | 2012-02-14 | Tyco Electronics Corporation | Socket connector having a thermally conductive insert |
| JP5565117B2 (en) * | 2010-06-07 | 2014-08-06 | 株式会社リコー | Imaging device |
| JP2013214605A (en) * | 2012-04-02 | 2013-10-17 | Sharp Corp | Portable terminal apparatus |
| CN203040094U (en) * | 2012-12-28 | 2013-07-03 | 惠州Tcl移动通信有限公司 | Heat radiating structure of portable broadband wireless device |
| KR102066482B1 (en) * | 2013-07-16 | 2020-01-15 | 삼성전자주식회사 | Fiber reinforced plastic material and electronic device including the same |
| US20150071627A1 (en) * | 2013-09-12 | 2015-03-12 | Chi Khai Hoang | Automated Stabilizing Apparatus |
| CN203950109U (en) * | 2014-03-14 | 2014-11-19 | 广州虹天航空科技有限公司 | Capture apparatus stabilizator |
| CN204227000U (en) * | 2014-11-10 | 2015-03-25 | 李强 | Self-shooting bar |
| CN204420520U (en) * | 2015-01-27 | 2015-06-24 | 马鞍山市赛迪智能科技有限公司 | A kind of hand-held from The Cloud Terrace of surely taking pictures |
| CN204929513U (en) * | 2015-08-19 | 2015-12-30 | 深圳市大疆创新科技有限公司 | Hand -held device and use handheld cloud platform of this hand -held device |
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2015
- 2015-08-19 CN CN201580003653.8A patent/CN105993208B/en not_active Expired - Fee Related
- 2015-08-19 CN CN201710938994.5A patent/CN107660106B/en not_active Expired - Fee Related
- 2015-08-19 WO PCT/CN2015/087505 patent/WO2017028274A1/en active Application Filing
- 2015-08-19 JP JP2018508764A patent/JP6605710B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104812222A (en) * | 2015-05-15 | 2015-07-29 | 深圳市大疆创新科技有限公司 | Heat dissipation structure and electronic device comprising same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109154414A (en) * | 2016-12-28 | 2019-01-04 | 深圳市大疆灵眸科技有限公司 | Holder holds bar assembly and is installed with the holder that the holder holds bar assembly |
| CN109983400A (en) * | 2017-09-29 | 2019-07-05 | 深圳市大疆灵眸科技有限公司 | Camera body and camera structure |
| CN109983400B (en) * | 2017-09-29 | 2022-04-22 | 深圳市大疆灵眸科技有限公司 | Camera body and camera structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018533037A (en) | 2018-11-08 |
| WO2017028274A1 (en) | 2017-02-23 |
| CN107660106B (en) | 2020-08-04 |
| JP6605710B2 (en) | 2019-11-13 |
| CN105993208B (en) | 2018-06-12 |
| CN107660106A (en) | 2018-02-02 |
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Effective date of registration: 20170401 Address after: 518057 Guangdong city of Shenzhen province Nanshan District Guangdong streets south four Road No. 18 building in the West SKYWORTH semiconductor design 12 Applicant after: SZ DJI OSMO TECHNOLOGY Co.,Ltd. Address before: 518057 Guangdong province Shenzhen city Nanshan District high tech Zone South Hing a No. 9 Hongkong, Shenzhen building 6 floor Applicant before: SZ DJI TECHNOLOGY Co.,Ltd. |
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