WO2017028274A1

WO2017028274A1 - Handheld device and cradle head and electronic device using same

Info

Publication number: WO2017028274A1
Application number: PCT/CN2015/087505
Authority: WO
Inventors: 孙荣健; 赵喜峰; 王勇
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2015-08-19
Filing date: 2015-08-19
Publication date: 2017-02-23
Also published as: JP2018533037A; CN105993208A; CN107660106B; JP6605710B2; CN105993208B; CN107660106A

Abstract

A handheld device (100), the handheld device (100) comprising a cover (110) and an electronic element provided within the cover (110). An expansion port (165) is provided on the cover (110) for connecting to the electronic device. The expansion port (165) is a heat-conducting port and extends from outside the cover to within the cover. The expansion port (165) can conduct heat generated by operation of the electronic element outside of the cover. Also disclosed is a handheld cradle head (1000) and an electronic device using the handheld device (100). The above handheld device (100) and handheld cradle head (1000) and electronic device using the handheld device (100) have a good heat dissipating function, and facilitate miniaturized design.

Description

Handheld device and handheld head and electronic device using the same

Technical field

The present invention relates to a handheld device, and a handheld head and electronic device using the handheld device.

Background technique

Typically, a handheld cloud platform includes a housing and a circuit board disposed within the housing. The circuit board is provided with a plurality of functional modules for implementing different functions, such as an image processing module, a power module, etc., which usually generate heat when working. Since the functional module is located in a sealed space formed by the casing, the heat generated by the functional module is often difficult to dissipate effectively and timely. If the heat is accumulated to a certain extent, the performance of the functional module will be affected, thereby affecting the overall performance of the pan/tilt.

In addition, although some handheld heads are configured to dissipate heat from the above functional modules, heat sinks, such as fans, are separately provided. However, the heat sink increases the volume of the handheld head, making the handheld head unfavorable for miniaturization.

Summary of the invention

In view of the above, it is necessary to provide a handheld device that has better heat dissipation and is advantageous for miniaturization design, and a handheld head and electronic device using the handheld device.

A handheld device includes a housing and an electronic component disposed in the housing, the housing being provided with an expansion interface for connecting an electronic device, the expansion interface being a heat conduction interface and extending from the outside of the housing to the In the housing, the expansion interface can derive heat generated when the electronic component operates from outside the housing.

Further, the inner cavity of the housing includes a battery chamber and a receiving cavity for accommodating the battery assembly.

Further, the accommodating cavity includes an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component is disposed in the electrical cavity, and heat generated in the electrical cavity is transmitted to the heat dissipation cavity through the heat dissipation cavity The expansion interface.

Further, a heat absorbing member is disposed in the heat dissipation cavity, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the expansion interface.

Further, the expansion interface includes a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passes through the housing and extends into the heat dissipation cavity, and the heat conducting portion abuts the housing The outer surface of the fixing portion is for fixing the heat conducting portion to the outer casing.

Further, the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion fixes the heat conducting portion through the mounting hole On the outer casing, the heat conducting portion abuts against an outer surface of the casing and shields a plurality of the heat dissipation holes.

Further, the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and abutting the outer edge of the plurality of the heat dissipation holes An inner surface of the housing, the body absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion The covering portion also transfers the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the housing.

Further, the fixing portion has a cylindrical shape, and the covering portion has an arc shape.

Further, the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covers the fixing portion, and the body absorbs heat generated by the electronic component and The heat is transferred to the cladding portion, and the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion guides the heat out of the housing.

Further, the heat conducting portion is provided with a heat dissipation protrusion;

Or/and, the heat conducting portion is provided with a heat dissipating groove.

Further, an outer surface of the housing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane and is inclined with respect to an axial direction of the housing The mounting surface extends in the axial direction of the housing.

Further, the electronic component includes a first circuit board that is vertically disposed within the electrical cavity and disposed along an axial direction of the housing.

Further, the first circuit board includes at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, where the wireless fidelity module is configured to implement a wireless fidelity function. The voltage conversion module is configured to implement a voltage conversion function, the photoelectric conversion module is configured to implement a photoelectric conversion function, the image processing module is configured to process an image, and the image transmission module is configured to transmit an image.

Further, the electronic component further includes a second circuit board, the second circuit board is located at a side of the first circuit board facing the operation surface, and is disposed facing the operation surface; the second circuit The board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a PTZ management function.

Further, the electronic component further includes a third circuit board corresponding to one end of the first circuit board and perpendicular to the first circuit board; the third circuit board includes a connection module, The connection module is configured to implement an interface connection function between the handheld device and the pan-tilt device.

Further, the electronic component further includes a fourth circuit board, the fourth circuit board being located between the third circuit board and the first circuit board, and disposed parallel to the third circuit board; The fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sense of the handheld device. Test function.

Further, the heat absorbing member is a heat dissipation plate disposed parallel to the first circuit board.

Further, the heat absorbing member is disposed on a side of the first circuit board facing the second circuit board.

Further, the handheld device further includes a carrier disposed on a surface of the first circuit board facing the second circuit board, the carrier being configured to carry the heat sink.

Further, the handheld device further includes an electromagnetic shielding plate disposed between the carrier and the heat absorbing member, and the heat absorbing member absorbs the operation generated when the first circuit board is operated by the electromagnetic shielding plate Heat.

A handheld cloud platform includes a handheld device and a pan-tilt device disposed on the handheld device, the handheld device comprising a housing and electronic components disposed in the housing, the housing being provided with an electronic device for connecting An expansion interface of the device and a connector, the handheld device being connected to the pan/tilt device via the connector, the expansion interface being a heat conduction interface and extending from the outside of the housing into the housing, the expansion interface capable of The heat generated when the electronic component operates is led out of the housing.

Or/and, the heat conducting portion is provided with a heat dissipating groove.

Further, the pan/tilt device includes at least one of a pitch axis mechanism, a roll axis mechanism, and a translation axis mechanism.

An electronic device, comprising:

a housing having a receiving cavity;

a circuit board mounted in the accommodating cavity;

a heat absorbing member is mounted in the accommodating cavity, the heat absorbing member is fixedly connected to the circuit board for carrying the circuit board, and the heat absorbing member and the circuit board are insulated from each other;

An expansion interface mounted to the housing and for mechanical connection or/and electrical connection with an external interface;

Wherein, the expansion interface is connected to the heat absorbing member, and is capable of conducting heat between the heat absorbing member.

Further, the expansion interface at least partially exposes the outside of the housing;

Or the heat absorbing member absorbs heat generated by the electronic device on the circuit board and transmits the heat to the expansion interface to dissipate heat to the outside of the housing to perform electronic devices on the circuit board. Cooling.

The present invention extends the heat generated by the operation of the electronic components in the housing out of the housing by an expansion interface disposed on the housing and extending from the outside of the housing into the housing, thereby enabling the handheld The device, the handheld cloud platform and the electronic device have better heat dissipation functions, and do not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.

DRAWINGS

FIG. 1 is a schematic diagram of a pan/tilt provided by an embodiment of the present invention.

Fig. 2 is a front elevational view of the hand held mechanism of the pan/tilt head shown in Fig. 1.

Figure 3 is a partial cross-sectional view of Figure 2 taken along the line III-III.

4 is a partial exploded view of the hand-held mechanism of the pan/tilt head shown in FIG. 1.

Figure 5 is a partial assembled view of Figure 4.

Main component symbol description

Handheld PTZ 1000

Handheld device 100

Housing 110

Inner cavity 111

Battery cavity 112

Housing cavity 113

Electrical cavity 114

Heat sink 115

Operating surface 121

Shooting button 122

First mounting surface 123

Second mounting surface 125

Power button 126

Mounting hole 128

Cooling hole 129

Connector 130

Circuit board

152, 154, 156, 158

Heat absorbing parts 162

Ontology 163

Covering part 164

Expansion interface 165

Heat transfer part 166

Fixed part 168

Carrier 170

Electromagnetic shielding plate 180

Battery pack 190

PTZ device 200

Pitch axis mechanism 210

Roller mechanism 220

Translational shaft mechanism 230

Image capturing device 300

The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or the component can be present. When a component is considered to "connect" another component, it can be directly connected to another component or possibly a central component. When a component is considered to be "set to" another component, it can be placed directly on another component or possibly with a centered component. The terms "vertical," "horizontal," "left," "right," and the like, as used herein, are for illustrative purposes only.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

Referring to FIG. 1, an embodiment of the present invention provides a handheld cloud platform 1000. The handheld cloud platform 1000 includes a handheld device 100 and a pan-tilt device 200 disposed on the handheld device 100. The pan/tilt head device 200 may be a two-axis pan/tilt head or a three-axis pan/tilt head. In the present embodiment, a three-axis pan/tilt head will be described as an example.

In the present embodiment, the pan/tilt head device 200 includes a pitch axis mechanism 210, a roll axis mechanism 220, and a translation axis mechanism 230. The pitch axis mechanism 210 is configured to carry an image capturing device 300, and the image capturing device 300 may be a camera, a camera, or the like. The roll axis mechanism 220 is coupled to the pitch axis mechanism 210 and the translation axis mechanism 230. The translational axis mechanism 230 is coupled to the handheld device 100.

Referring to FIG. 1 to FIG. 5 simultaneously, the handheld device 100 includes a housing 110, a connector 130, electronic components, a heat dissipation component, a carrier 170, an electromagnetic shielding panel 180, and a battery assembly 190. The connecting member 130 is disposed at the top of the housing 110 for connecting the translational shaft mechanism 230. The electronic component, the carrier 170, the electromagnetic shielding plate 180, and the battery assembly 190 are disposed in the housing 110. The heat dissipating component is partially located in the housing 110 and a portion is located outside the housing 110. The heat dissipating component is configured to derive heat generated when the electronic component operates from the outside of the housing 110 to dissipate heat from the electronic component. The battery assembly 190 is used to power the handheld cloud platform 1000.

In the present embodiment, the housing 110 has a substantially rectangular parallelepiped shape. One end of the inner cavity 111 of the housing 110 is partitioned into a battery chamber 112, and the other end is partitioned into a receiving cavity 113. The accommodating cavity 113 includes an electrical cavity 114 and a heat dissipation cavity 115 communicating with the electrical cavity 114. The electronic component is disposed in the electrical cavity 114, the heat dissipation component is disposed in the heat dissipation cavity 115, and the carrier 170 and the electromagnetic shielding plate 180 are disposed in the electrical cavity 114 and the heat dissipation cavity Between 115, the battery assembly 190 is disposed within the battery cavity 112.

In the present embodiment, the housing 110 includes an operation surface 121 , a first mounting surface 123 adjacent to the operation surface 121 , and a surface adjacent to the operation surface 121 and opposite to the first mounting surface 123 . Second mounting surface 125. The operation surface 121 is provided with a plurality of function buttons (such as the shooting button 122 shown in FIG. 1). An expansion interface (such as the expansion interface 165 shown in FIG. 1) is disposed on the first mounting surface 123. The second mounting surface 125 is provided with function buttons (such as the power button 126 shown in FIG. 2). The operation surface 121 is a flat surface and is disposed obliquely with respect to an axial direction of the housing 110. The first mounting surface 123 and the second mounting surface 125 extend in the axial direction of the housing 110.

In the present embodiment, the electronic component includes

circuit boards

152, 154, 156, 158. The circuit board 152 is vertically disposed within the electrical cavity 114 and disposed along an axial direction of the housing 110. The circuit board 154 is located on a side of the circuit board 152 facing the operation surface 121 and is disposed facing the operation surface 121. The circuit board 158 corresponds to one end of the circuit board 152 and is perpendicular to the circuit board 152. The circuit board 156 is located between the circuit board 152 and the circuit board 158 and is parallel to the circuit board 158. The circuit board 152 is connected to the

energy card

154, 156, 158 by a flexible cable.

The circuit board 152 includes at least one of the following: a Wi-Fi (Wireless Fidelity) module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module. The Wi-Fi module is configured to implement a Wi-Fi function, the voltage conversion module is configured to implement a voltage conversion function, the photoelectric conversion module is configured to implement a photoelectric conversion function, and the image processing module is configured to implement an image processing function. The image transmission module is configured to implement an image transmission function. The circuit board 154 includes at least one of the following: a power management module and a pan/tilt management module. The power management module is configured to implement a power management function, and the cloud platform management module is configured to implement a cloud platform management function. The circuit board 156 includes at least one of the following: an audio signal acquisition module and a displacement sensing module. The audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sensing function of the handheld device 100. The displacement sensing module includes a gyroscope and a compass. The circuit board 158 includes, but is not limited to, a connection module for implementing an interface connection function between the handheld device 100 and the pan/tilt device 200.

The heat dissipating component includes a heat absorbing member 162 and an expansion interface 165 for connecting the electronic device. The heat absorbing member 162 is disposed in the heat dissipation cavity 115, parallel to the circuit board 152, and located on a side of the circuit board facing the circuit board 154. The heat absorbing member 162 includes a body 163 and a covering portion 164 protruding from a rim of the body 163. The expansion interface 165 is a heat conduction interface, and includes a heat conduction portion 166 and a fixing portion 168 extending from the heat conduction portion 166 . The fixing portion 168 passes through the mounting hole 128 of the first mounting surface 123 and extends into the heat dissipation cavity 115. The fixing portion 168 is in an interference fit or threaded engagement with the mounting hole 128 to fix the heat conducting portion 166 to the housing 110. The first mounting surface 123 is further provided with a plurality of heat dissipation holes 129 adjacent to and surrounding the mounting holes 128. The heat conducting portion 166 abuts against an outer surface of the second mounting surface 125 and shields the plurality of the heat dissipation holes 129 . The covering portion 164 covers the fixing portion 168 and abuts against an inner surface of the second mounting surface 125 at an outer edge of the plurality of heat dissipation holes 129 . In this embodiment, the expansion interface 165 is used for mechanical connection or/and electrical connection with an interface of the electronic device.

In the embodiment, the heat absorbing member 162 is a heat dissipation plate disposed parallel to the circuit board 152. The expansion interface 165 is a disk-shaped expansion interface, and the disk-tooth expansion interface is used to expand the handheld cloud platform 1000 to connect electronic devices such as mobile phones and tablets. The fixing portion 168 is substantially cylindrical, and the covering portion 164 is substantially arcuate.

The carrier 170 is disposed on a surface of the circuit board 152 facing the circuit board 154 for carrying the electromagnetic shielding plate 180 and the heat absorbing member 162. The electromagnetic shielding plate 180 is used to shield electromagnetic waves and has good thermal conductivity. The electromagnetic shielding plate 180 is disposed between the carrier 170 and the heat absorbing member 162 , and the opposite surfaces of the electromagnetic shielding plate 180 and the heat absorbing member 162 and the carrier 170 respectively contact. The heat absorbing member 162 absorbs heat generated by the operation of the circuit board 152 through the electromagnetic shielding plate 180.

When the handheld pan/tilt 1000 is in operation, the functional modules on the

circuit boards

152, 154, 156, 158 operate and generate heat. The body 163 absorbs heat generated by the circuit board 152 through the electromagnetic shielding plate 180, and transmits the absorbed heat to the covering portion 164. The covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168 , and the covering portion 164 also transfers heat to the heat conducting portion 166 through the plurality of the heat dissipation holes 129 . The heat conducting portion 166 conducts the heat out of the housing 110 to achieve a heat dissipation function. In the present embodiment, a plurality of the heat dissipation holes 129 are provided to enhance heat transfer between the cladding portion 164 and the heat transfer portion 166.

It can be understood that when the plurality of the heat dissipation holes 129 are not disposed on the second mounting surface 125, the heat conducting portion 166 abuts against the outer surface of the second mounting surface 125, and the covering portion 164 covers the covering portion. The fixing portion 168 abuts against the inner surface of the second mounting surface 125. The covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168, and the heat conducting portion 166 conducts the heat out of the housing 110.

It can be understood that the electronic component further includes a chip, a resistor, a capacitor, an inductor, etc., and the number of circuit boards included in the electronic component may be one or more, for example, two, three, six, and the like. The number of function modules included in each board and the functions to be implemented by the function modules can be adjusted accordingly.

It can be understood that the arrangement manner, the positional relationship and the connection relationship of the plurality of the circuit boards in the electrical cavity 114 can be adjusted accordingly according to actual conditions.

It can be understood that a heat absorbing member 162 can be disposed beside each of the circuit boards to dissipate heat from each of the circuit boards. Therefore, the number of the heat absorbing members 162 can be one or more, and the number of the expansion interfaces 165 can be It can also be one or more.

It can be understood that the heat conducting portion 166 is provided with at least one of a heat dissipation protrusion and a heat dissipation groove, and the heat conduction portion 166 enhances the heat conduction area.

It will be appreciated that the battery assembly 190 includes one or more rechargeable batteries.

It can be understood that a portion of the housing 110 corresponding to the battery chamber 112 is provided with a plurality of indicator lights (not shown) for indicating the amount of power of the battery assembly 190.

The present invention provides the heat sink 162 on the circuit board 152 to absorb the heat of the circuit board 152, and the heat absorbed by the heat sink 162 is led out of the housing through the expansion interface 165. Therefore, the handheld cloud platform 1000 has a better heat dissipation function, and does not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.

The above embodiments are only intended to illustrate the technical solutions of the present invention and are not intended to be limiting, and the present invention will be described in detail with reference to the above embodiments. Those skilled in the art should understand that the technical solutions of the present invention may be modified or equivalently replaced. The spirit and scope of the technical solutions of the present invention should be deviated.

Claims

A handheld device includes a housing and an electronic component disposed in the housing, the housing being provided with an expansion interface for connecting an electronic device and a connector for connecting the pan-tilt device, wherein: The expansion interface is a thermally conductive interface and extends from outside the housing into the housing, the expansion interface being capable of directing heat generated by operation of the electronic component out of the housing.
The handheld device of claim 1 wherein the interior of the housing includes a battery chamber and a receiving chamber for receiving the battery assembly.
The handheld device of claim 2, wherein the accommodating cavity comprises an electrical cavity and a heat dissipation cavity in communication with the electrical cavity, the electronic component being disposed in the electrical cavity, the electrical cavity Heat generated within is transferred to the expansion interface through the heat dissipation cavity.
The hand-held device according to claim 3, wherein the heat dissipation chamber is provided with a heat absorbing member, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the extension port.
The handheld device according to claim 4, wherein the expansion interface comprises a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passing through the housing and extending into the heat dissipation cavity The heat conducting portion abuts against an outer surface of the housing, and the fixing portion is for fixing the heat conducting portion to the outer casing.
The handheld device according to claim 5, wherein the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion passes the The mounting hole fixes the heat conducting portion on the outer casing, and the heat conducting portion abuts against an outer surface of the casing and shields the plurality of the heat dissipation holes.
The hand-held device according to claim 6, wherein the heat absorbing member comprises a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and being plurality of An outer edge of the heat dissipation hole abuts against an inner surface of the casing, the body absorbs heat generated by the electronic component and transfers the heat to the cladding portion, the cladding portion heats the heat The heat conducting portion is transmitted through the fixing portion, and the covering portion transmits the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the casing.
The hand-held device according to claim 7, wherein the fixing portion has a cylindrical shape, and the covering portion has an arc shape.
The hand-held device according to claim 5, wherein the heat absorbing member comprises a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion, the body Absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion, the heat conducting portion deriving the heat Outside the housing.
The hand-held device according to claim 9, wherein said fixing portion has a cylindrical shape, and said covering portion has an arc shape.
The handheld device according to claim 5, wherein the heat conducting portion is provided with a heat dissipating protrusion;

Or/and, the heat conducting portion is provided with a heat dissipating groove.
The hand-held device according to claim 4, wherein an outer surface of the casing is provided with an operation surface for mounting a function key and a mounting surface for mounting the expansion interface; the operation surface is a plane, and The mounting surface extends in the axial direction of the housing with respect to an axially inclined arrangement of the housing.
A handheld device according to claim 12, wherein said electronic component comprises a first circuit board, said first circuit board being vertically disposed within said electrical cavity and disposed along an axial direction of said housing .
The handheld device according to claim 13, wherein the first circuit board comprises at least one of a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, the wireless device. The fidelity module is configured to implement a wireless fidelity function, the voltage conversion module is configured to implement a voltage conversion function, the photoelectric conversion module is configured to implement a photoelectric conversion function, and the image processing module is configured to process an image, the image The transmission module is used to transfer images.
The handheld device according to claim 14, wherein said electronic component further comprises a second circuit board, said second circuit board being located on a side of said first circuit board facing said operation surface, and facing The second circuit board includes at least one of the following: a power management module and a PTZ management module, wherein the power management module is configured to implement a power management function, and the PTZ management module is configured to implement the PTZ Management function.
A handheld device according to claim 15 wherein said electronic component further comprises a third circuit board, said third circuit board corresponding to one end of said first circuit board and perpendicular to said first circuit board The third circuit board includes a connection module, and the connection module is configured to implement an interface connection function between the handheld device and the pan/tilt device.
A handheld device according to claim 16, wherein said electronic component further comprises a fourth circuit board, said fourth circuit board being located between said third circuit board and said first circuit board, and parallel The fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing The module is for implementing a displacement sensing function of the handheld device.
A hand-held device according to claim 13 wherein said heat absorbing member is a heat sink disposed parallel to said first circuit board.
A hand-held device according to claim 15, wherein said heat absorbing member is disposed on a side of said first circuit board facing said second circuit board.
The handheld device of claim 15 wherein said hand-held device further comprises a carrier disposed on a surface of said first circuit board facing said second circuit board, said carrier for carrying Said heat sink.
A hand-held device according to claim 20, wherein said hand-held device further comprises an electromagnetic shielding plate disposed between said carrier and said heat absorbing member, said heat absorbing member passing said electromagnetic shielding plate Absorbing heat generated when the first circuit board is in operation.
A handheld cloud platform includes a handheld device and a pan-tilt device disposed on the handheld device, the handheld device comprising a housing and electronic components disposed in the housing, the housing being provided with an electronic device for connecting An expansion interface of the device and a connecting component, wherein the handheld device is connected to the pan/tilt device through the connecting member, wherein the expansion interface is a heat conducting interface and extends from the outside of the housing into the housing. The expansion interface can derive heat generated when the electronic component operates from outside the housing.
The handheld pan/tilt head according to claim 22, wherein the inner cavity of the casing comprises a battery chamber and a accommodating cavity, and the battery cavity is for accommodating the battery assembly.
The handheld pan/tilt head according to claim 23, wherein the accommodating cavity comprises an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component being disposed in the electrical cavity, the electrical Heat generated within the cavity is transferred to the expansion interface through the heat dissipation cavity.
The handheld pan/tilt head according to claim 24, wherein the heat dissipating cavity is provided with a heat absorbing member, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the heat sink. Said extension interface.
The handheld pan/tilt head according to claim 25, wherein the expansion interface comprises a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passing through the housing and extending to the heat dissipation chamber The heat conducting portion abuts against an outer surface of the housing, and the fixing portion is for fixing the heat conducting portion to the outer casing.
The handheld pan/tilt head according to claim 26, wherein the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion passes through The mounting hole fixes the heat conducting portion on the outer casing, and the heat conducting portion abuts against an outer surface of the casing and shields the plurality of the heat dissipation holes.
The handheld pan/tilt head according to claim 27, wherein the heat absorbing member comprises a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and An outer edge of the heat dissipation hole abuts against an inner surface of the housing, the body absorbs heat generated by the electronic component and transfers the heat to the cladding portion, the cladding portion The heat is transmitted through the fixing portion, and the covering portion transmits the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the casing.
The handheld pan/tilt head according to claim 28, wherein the fixing portion has a cylindrical shape, and the covering portion has an arc shape.
The handheld pan/tilt head according to claim 26, wherein the heat absorbing member comprises a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion, The body absorbs heat generated by the electronic component and transfers the heat to the cladding portion, the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion heats the heat Export the outside of the housing.
The handheld pan/tilt head according to claim 30, wherein the fixing portion has a cylindrical shape, and the covering portion has an arc shape.
The handheld pan/tilt head according to claim 26, wherein the heat conducting portion is provided with a heat dissipating protrusion;

Or/and, the heat conducting portion is provided with a heat dissipating groove.
The handheld pan/tilt head according to claim 25, wherein an outer surface of the casing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane. And disposed obliquely with respect to an axial direction of the housing, the mounting surface extends in an axial direction of the housing.
A handheld pan/tilt head according to claim 33, wherein said electronic component comprises a first circuit board, said first circuit board being vertically disposed within said electrical cavity and along an axial direction of said housing Settings.
The handheld pan/tilt head according to claim 34, wherein the first circuit board comprises at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, The wireless fidelity module is configured to implement a wireless fidelity function, the voltage conversion module is configured to implement a voltage conversion function, the photoelectric conversion module is configured to implement a photoelectric conversion function, and the image processing module is configured to process an image, The image transmission module is used to transmit images.
A handheld pan/tilt head according to claim 35, wherein said electronic component further comprises a second circuit board, said second circuit board being located on a side of said first circuit board facing said operation surface, and The second circuit board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a cloud. Desk management function.
A handheld pan/tilt head according to claim 36, wherein said electronic component further comprises a third circuit board, said third circuit board corresponding to one end of said first circuit board and perpendicular to said first circuit The third circuit board includes a connection module, and the connection module is configured to implement an interface connection function between the handheld device and the pan/tilt device.
A handheld pan/tilt head according to claim 37, wherein said electronic component further comprises a fourth circuit board, said fourth circuit board being located between said third circuit board and said first circuit board, and Parallel to the third circuit board; the fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, the audio signal acquisition module is configured to implement an audio signal collection function, and the position sense The measurement module is used to implement the displacement sensing function of the handheld device.
A handheld pan/tilt head according to claim 34, wherein said heat absorbing member is a heat radiating plate disposed parallel to said first circuit board.
A handheld pan/tilt head according to claim 36, wherein said heat absorbing member is disposed on a side of said first circuit board facing said second circuit board.
A handheld pan/tilt head according to claim 36, wherein said hand-held device further comprises a carrier disposed on a surface of said first circuit board facing said second circuit board, said carrier for carrying The heat absorbing member.
A handheld pan/tilt head according to claim 41, wherein said hand-held device further comprises an electromagnetic shielding plate disposed between said carrier member and said heat absorbing member, said heat absorbing member passing said electromagnetic shielding The board absorbs heat generated when the first circuit board is in operation.
A handheld pan/tilt head according to claim 22, wherein said pan/tilt head comprises at least one of: a pitch axis mechanism, a roll axis mechanism, and a translation axis mechanism.
An electronic device, comprising:

a housing having a receiving cavity;

a circuit board mounted in the accommodating cavity;

a heat absorbing member is mounted in the accommodating cavity, the heat absorbing member is fixedly connected to the circuit board for carrying the circuit board, and the heat absorbing member and the circuit board are insulated from each other;

An expansion interface mounted to the housing and for mechanical connection or/and electrical connection with an external interface;

Wherein, the expansion interface is connected to the heat absorbing member, and is capable of conducting heat between the heat absorbing member.
The electronic device according to claim 44, wherein the expansion interface at least partially exposes the outside of the housing;

Or the heat absorbing member absorbs heat generated by the electronic device on the circuit board and transmits the heat to the expansion interface to dissipate heat to the outside of the housing to perform electronic devices on the circuit board. Cooling.