CN105993208B - Hand-held device and the hand-held holder and electronic device using the hand-held device - Google Patents
Hand-held device and the hand-held holder and electronic device using the hand-held device Download PDFInfo
- Publication number
- CN105993208B CN105993208B CN201580003653.8A CN201580003653A CN105993208B CN 105993208 B CN105993208 B CN 105993208B CN 201580003653 A CN201580003653 A CN 201580003653A CN 105993208 B CN105993208 B CN 105993208B
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- China
- Prior art keywords
- heat
- hand
- housing
- circuit board
- held
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
- Accessories Of Cameras (AREA)
Abstract
A kind of hand-held device (100), the hand-held device (100) includes housing (110) and the electronic component being set in the housing (110), the expansion interface (165) for connecting electronic equipment is provided on the housing (110), the expansion interface (165) for heat conducting interface and is extended to from outside the housing in the housing, described in the heat derives that the expansion interface (165) generates when can the electronic component be worked outside housing.Also disclose the hand-held holder (1000) and electronic device using the hand-held device (100).The hand-held holder (1000) and electronic device of above-mentioned hand-held device (100) and the use hand-held device (100) have preferable heat sinking function and conducive to Miniaturization Design.
Description
Technical field
Hand-held holder and electronic device the present invention relates to a kind of hand-held device and using the hand-held device.
Background technology
Usually hand-held holder includes housing and the circuit board being set in the housing.It is provided on the circuit board multiple
The function module of different function, such as image processing module, power module etc. are used to implement, the function module is led at work
Heat can often be generated.It is located at due to the function module in the closed space of housing formation, the function module
The heat of generation be often difficult to effectively, timely disperse.If the thermal accumlation is to a certain extent, the function mould will be influenced
The performance of block, and then influence the overall performance of the holder.
In addition, though radiator, example has been separately provided in order to radiate to above-mentioned function module in some hand-held holders
Such as, fan etc..However, the radiator can increase the volume of hand-held holder so that hand-held holder is unfavorable for Miniaturization Design.
Invention content
In view of this, it is necessary to provide a kind of thermal diffusivity preferably and be conducive to hand-held device and the use of Miniaturization Design
The hand-held holder and electronic device of the hand-held device.
A kind of hand-held device including housing and the electronic component being set in the housing, is provided on the housing
For connecting the expansion interface of electronic equipment, the expansion interface is heat conducting interface, and the expansion interface is including heat-conducting part and certainly
The fixed part that the heat-conducting part extends, the fixed part pass through the housing and extend in the housing, the heat-conducting part
Against the outer surface of the housing, shell described in the heat derives that the expansion interface generates when can the electronic component be worked
In vitro.
Further, the inner cavity of the housing includes battery cavities and accommodating cavity, and the battery cavities are used to accommodate battery component.
Further, the accommodating cavity includes electrical chamber and the heat dissipation cavity being connected with the electrical chamber, the electronics member
Part is set to the electrical intracavitary, and the heat that the electrical intracavitary generates passes to the expansion interface by the heat dissipation cavity.
Further, heat absorbing member is equipped in the heat dissipation cavity, the heat absorbing member generates when absorbing the electronic component work
Heat, and by the heat transfer give the expansion interface.
Further, it is provided with mounting hole on the housing, the fixed part is by the mounting hole by the heat-conducting part
It fixes on the housing, the fixed part is interference fitted with the mounting hole or thread fitting.
Further, mounting hole and multiple heat emission holes are provided on the housing, multiple heat emission holes are close and surround
The mounting hole, the fixed part are fixed the heat-conducting part on the housing by the mounting hole, and the heat-conducting part supports
Outer surface by the housing simultaneously cover multiple heat emission holes.
Further, the heat absorbing member includes ontology and is convexly equipped in the covering portion of the ontology rim, the covering portion packet
Cover the fixed part and in multiple heat emission holes outer rim against the inner surface of the housing, electronics described in the bulk absorption
The heat of element generation simultaneously gives the heat transfer to the covering portion, and the heat is passed through the fixed part by the covering portion
The heat-conducting part is passed to, the heat is also passed to the heat-conducting part, institute by the covering portion by multiple heat emission holes
Stating heat-conducting part will be described in the heat derives outside housing.
Further, the fixed part is cylindrical, and the covering portion is arc-shaped.
Further, the heat absorbing member includes ontology and is convexly equipped in the covering portion of the ontology rim, the covering portion packet
The fixed part is covered, the heat that electronic component described in the bulk absorption generates simultaneously gives the heat transfer to the covering portion,
The heat is passed to the heat-conducting part by the covering portion by the fixed part, and the heat-conducting part is by the heat derives institute
It states outside housing.
Further, the fixed part is cylindrical, and the covering portion is arc-shaped.
Further, it is provided with heat bulge on the heat-conducting part；
And/or heat dissipation groove is provided on the heat-conducting part.
Further, the outer surface of the housing is equipped with for the operating surface of installation function button and for installing the expansion
Open up the mounting surface of interface；The operating surface is plane, and relative to the axially inclined setting of the housing, the mounting surface edge
The housing it is axially extending.
Further, the electronic component includes first circuit board, and the first circuit board is vertically arranged at described electrical
Intracavitary, and set along the axial direction of the housing.
Further, the first circuit board includes following at least one：Wireless fidelity module, voltage transformation module, light
Electric modular converter, image processing module and image transmission module, the wireless fidelity module are used to implement Wireless Fidelity function, institute
It states voltage transformation module and is used to implement voltage conversion function, the photoelectric conversion module is used to implement photoelectric converting function, described
For image processing module for handling image, described image transmission module is used for transmission image.
Further, the electronic component further includes second circuit board, and the second circuit board is located at first circuit
Plate is set towards the side of the operating surface, and in face of the operating surface；The second circuit board includes following at least one：Electricity
Source control module and holder management module, the power management module are used to implement power management function, and the holder manages mould
Block is used to implement holder management function.
Further, the electronic component further includes tertiary circuit plate, and the tertiary circuit plate corresponds to the described first electricity
One end of road plate and perpendicular to the first circuit board；The tertiary circuit plate includes link block, and the link block is used for
Realize the interface linkage function of the hand-held device and cradle head device.
Further, the electronic component further includes the 4th circuit board, and the 4th circuit board is located at the tertiary circuit
Between plate and the first circuit board, and it is parallel to the tertiary circuit plate setting；4th circuit board is included as follows at least
It is a kind of：Audio signal sample module and displacement sensing module, the audio signal sample module are used to implement audio signal sample
Function, the displacement sensing module are used to implement the displacement sensing function of the hand-held device.
Further, the heat absorbing member is the heat sink for being parallel to the first circuit board setting.
Further, the heat absorbing member is set to the first circuit board towards the side of the second circuit board.
Further, the hand-held device further includes the table for being set to the first circuit board towards the second circuit board
Load-bearing part on face, the load-bearing part are used to carry the heat absorbing member.
Further, the hand-held device further includes the electromagnetic shielding being set between the load-bearing part and the heat absorbing member
Plate, the heat absorbing member absorb the heat generated when the first circuit board works by the electromagnetic shielding plate.
A kind of hand-held holder, including hand-held device and the cradle head device being set on the hand-held device, the hand-held dress
It puts including housing and the electronic component being set in the housing, the expansion for connecting electronic equipment is provided on the housing
Exhibition interface and connector, the hand-held device are connected by the connector with the cradle head device, and the expansion interface is
Heat conducting interface, the expansion interface include heat-conducting part and the fixed part extended from the heat-conducting part, and the fixed part passes through institute
It states housing and extends in the housing, the heat-conducting part can be by institute against the outer surface of the housing, the expansion interface
It states described in the heat derives generated during electronic component work outside housing.
Further, the inner cavity of the housing includes battery cavities and accommodating cavity, and the battery cavities are used to accommodate battery component.
Further, the accommodating cavity includes electrical chamber and the heat dissipation cavity being connected with the electrical chamber, the electronics member
Part is set to the electrical intracavitary, and the heat that the electrical intracavitary generates passes to the expansion interface by the heat dissipation cavity.
Further, heat absorbing member is equipped in the heat dissipation cavity, the heat absorbing member generates when absorbing the electronic component work
Heat, and by the heat transfer give the expansion interface.
Further, it is provided with mounting hole on the housing, the fixed part is by the mounting hole by the heat-conducting part
It fixes on the housing, the fixed part is interference fitted with the mounting hole or thread fitting.
Further, mounting hole and multiple heat emission holes are provided on the housing, multiple heat emission holes are close and surround
The mounting hole, the fixed part are fixed the heat-conducting part on the housing by the mounting hole, and the heat-conducting part supports
Outer surface by the housing simultaneously cover multiple heat emission holes.
Further, the heat absorbing member includes ontology and is convexly equipped in the covering portion of the ontology rim, the covering portion packet
Cover the fixed part and in multiple heat emission holes outer rim against the inner surface of the housing, electronics described in the bulk absorption
The heat of element generation simultaneously gives the heat transfer to the covering portion, and the heat is passed through the fixed part by the covering portion
The heat-conducting part is passed to, the heat is also passed to the heat-conducting part, institute by the covering portion by multiple heat emission holes
Stating heat-conducting part will be described in the heat derives outside housing.
Further, the fixed part is cylindrical, and the covering portion is arc-shaped.
Further, the heat absorbing member includes ontology and is convexly equipped in the covering portion of the ontology rim, the covering portion packet
The fixed part is covered, the heat that electronic component described in the bulk absorption generates simultaneously gives the heat transfer to the covering portion,
The heat is passed to the heat-conducting part by the covering portion by the fixed part, and the heat-conducting part is by the heat derives institute
It states outside housing.
Further, the fixed part is cylindrical, and the covering portion is arc-shaped.
Further, it is provided with heat bulge on the heat-conducting part；
And/or heat dissipation groove is provided on the heat-conducting part.
Further, the outer surface of the housing is equipped with for the operating surface of installation function button and for installing the expansion
Open up the mounting surface of interface；The operating surface is plane, and relative to the axially inclined setting of the housing, the mounting surface edge
The housing it is axially extending.
Further, the electronic component includes first circuit board, and the first circuit board is vertically arranged at described electrical
Intracavitary, and set along the axial direction of the housing.
Further, the first circuit board includes following at least one：Wireless fidelity module, voltage transformation module, light
Electric modular converter, image processing module and image transmission module, the wireless fidelity module are used to implement Wireless Fidelity function, institute
It states voltage transformation module and is used to implement voltage conversion function, the photoelectric conversion module is used to implement photoelectric converting function, described
For image processing module for handling image, described image transmission module is used for transmission image.
Further, the electronic component further includes second circuit board, and the second circuit board is located at first circuit
Plate is set towards the side of the operating surface, and in face of the operating surface；The second circuit board includes following at least one：Electricity
Source control module and holder management module, the power management module are used to implement power management function, and the holder manages mould
Block is used to implement holder management function.
Further, the electronic component further includes tertiary circuit plate, and the tertiary circuit plate corresponds to the described first electricity
One end of road plate and perpendicular to the first circuit board；The tertiary circuit plate includes link block, and the link block is used for
Realize the interface linkage function of the hand-held device and cradle head device.
Further, the electronic component further includes the 4th circuit board, and the 4th circuit board is located at the tertiary circuit
Between plate and the first circuit board, and it is parallel to the tertiary circuit plate setting；4th circuit board is included as follows at least
It is a kind of：Audio signal sample module and displacement sensing module, the audio signal sample module are used to implement audio signal sample
Function, the displacement sensing module are used to implement the displacement sensing function of the hand-held device.
Further, the heat absorbing member is the heat sink for being parallel to the first circuit board setting.
Further, the heat absorbing member is set to the first circuit board towards the side of the second circuit board.
Further, the hand-held device further includes the table for being set to the first circuit board towards the second circuit board
Load-bearing part on face, the load-bearing part are used to carry the heat absorbing member.
Further, the hand-held device further includes the electromagnetic shielding being set between the load-bearing part and the heat absorbing member
Plate, the heat absorbing member absorb the heat generated when the first circuit board works by the electromagnetic shielding plate.
Further, the cradle head device includes following at least one：Pitching axis mechanism, roll axis mechanism and translation shaft
Mechanism.
A kind of electronic device, which is characterized in that including：
Housing, equipped with accommodating cavity；
Circuit board, in the accommodating cavity；
Heat absorbing member, in the accommodating cavity, the heat absorbing member is fixedly connected with the circuit board, described for carrying
Circuit board, and the heat absorbing member and the circuit board mutually insulated；
Expansion interface, mounted on the housing, and for being mechanically connected and/or being electrically connected, the expansion with external interface
Exhibition interface is heat conducting interface, and the expansion interface includes heat-conducting part and the fixed part extended from the heat-conducting part, the fixation
Portion passes through and the housing and extends in the housing, and the heat-conducting part is against the outer surface of the housing, the expansion interface
Described in the heat derives generated when can the electronic component be worked outside housing；
Wherein, the expansion interface is connect with the heat absorbing member, and heat conduction can be carried out between the heat absorbing member.
Further, outside the expansion interface at least exposed housing in part；
Alternatively, the heat absorbing member absorbs the heat that the electronic device on the circuit board generates, pass to the extension and connect
Mouthful, thus by heat spreader to the outside of the housing, to radiate to the electronic device on the circuit board.
The present invention extends to the expansion interface in the housing by setting on the housing and from outside the housing, will
Described in the heat derives that electronic component in the housing generates when working outside housing, so as to make the hand-held device, the hand
Holding holder and the electronic device has preferable heat sinking function, and radiator need not be separately provided, and is set conducive to miniaturization
Meter.
Description of the drawings
Fig. 1 is the schematic diagram of holder that embodiments of the present invention provide.
Fig. 2 is the front view of the hand-held mechanism of holder shown in FIG. 1.
Fig. 3 is partial sectional views of the Fig. 2 along III-III directions.
Fig. 4 is the partial exploded view of the hand-held mechanism of holder shown in FIG. 1.
Fig. 5 is the partial assembly drawing of Fig. 4.
Main element symbol description
Hand-held holder 1000
Hand-held device 100
Housing 110
Inner cavity 111
Battery cavities 112
Accommodating cavity 113
Electrical chamber 114
Heat dissipation cavity 115
Operating surface 121
Shooting button 122
First mounting surface 123
Second mounting surface 125
Power button 126
Mounting hole 128
Heat emission hole 129
Connector 130
Circuit board 152,154,156,158
Heat absorbing member 162
Ontology 163
Covering portion 164
Expansion interface 165
Heat-conducting part 166
Fixed part 168
Load-bearing part 170
Electromagnetic shielding plate 180
Battery component 190
Cradle head device 200
Pitching axis mechanism 210
Roll axis mechanism 220
Translate axis mechanism 230
Image capturing device 300
Following specific embodiment will be further illustrated the present invention with reference to above-mentioned attached drawing.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
It should be noted that when component is referred to as " being fixed on " another component, it can be directly on another component
Or there may also be components placed in the middle.When a component is considered as " connection " another component, it can be directly connected to
To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being set to " another component, it
Can be set up directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more phases
The arbitrary and all combination of the Listed Items of pass.
Below in conjunction with the accompanying drawings, it elaborates to some embodiments of the present invention.In the absence of conflict, it is following
Feature in embodiment and embodiment can be combined with each other.
Referring to Fig. 1, embodiments of the present invention provide a kind of hand-held holder 1000.The hand-held holder 1000 includes hand
Hold device 100 and the cradle head device 200 being set on the hand-held device 100.The cradle head device 200 can be two axis clouds
Platform, three axis holders etc. in the present embodiment, are illustrated by taking three axis holders as an example.
In the present embodiment, the cradle head device 200 includes pitching axis mechanism 210, roll axis mechanism 220, Yi Jiping
Swing and tilt mechanism 230.Wherein, the pitching axis mechanism 210 is used to carry image capturing device 300, described image filming apparatus 300
Can be camera, camera etc..The roll axis mechanism 220 and the pitching axis mechanism 210 and the translation axis mechanism 230
It is connected.The translation axis mechanism 230 is connected with the hand-held device 100.
Please refer to Fig. 1 to Fig. 5, the hand-held device 100 includes housing 110, connector 130, electronic component, heat dissipation
Component, load-bearing part 170, electromagnetic shielding plate 180 and battery component 190.The connector 130 is set to the top of the housing 110
Portion, for connecting the translation axis mechanism 230.The electronic component, the load-bearing part 170, the electromagnetic shielding plate 180 and institute
Battery component 190 is stated in the housing 110.The radiating subassembly part is located in the housing 110, and a part is located at
Outside the housing 110.The radiating subassembly is used for housing 110 described in the heat derives generated when the electronic component is worked
Outside, with to the electronic element radiating.The battery component 190 is used to power for the hand-held holder 1000.
In the present embodiment, the housing 110 is substantially in a rectangular parallelepiped shape.One end quilt of the inner cavity 111 of the housing 110
It is divided into battery cavities 112, other end is separated into accommodating cavity 113.The accommodating cavity 113 include electrical chamber 114 and with it is described
The heat dissipation cavity 115 that electrical chamber 114 is connected.The electronic component is set in the electrical chamber 114, the radiating subassembly setting
In in the heat dissipation cavity 115, the load-bearing part 170 and the electromagnetic shielding plate 180 are set on the electrical chamber 114 and the heat dissipation
Between chamber 115, the battery component 190 is set in the battery cavities 112.
In the present embodiment, the housing 110 includes operating surface 121, the adjacent with the operating surface 121 first installation
Face 123 and the second adjacent with the operating surface 121 and opposite with first mounting surface 123 mounting surface 125.The operating surface
Multiple function buttons (shooting button 122 as shown in Figure 1 etc.) are provided on 121.Expansion is provided on first mounting surface 123
Open up interface (expansion interface 165 as shown in Figure 1 etc.).Function button is provided on second mounting surface 125 (as shown in Figure 2
Power button 126 etc.).The operating surface 121 is plane, and relative to the axially inclined setting of the housing 110.It is described
First mounting surface 123 and second mounting surface 125 are along the axially extending of the housing 110.
In the present embodiment, the electronic component includes circuit board 152,154,156,158.The circuit board 152 is perpendicular
It is directly set in the electrical chamber 114, and is set along the axial direction of the housing 110.The circuit board 154 is located at the circuit board
152 towards the side of the operating surface 121, and is set in face of the operating surface 121.The circuit board 158 corresponds to the electricity
One end of road plate 152 and perpendicular to the circuit board 152.The circuit board 156 is located at the circuit board 152 in the circuit board
Between 158, and it is parallel to the circuit board 158.The circuit board 152 passes through soft arranging wire and the energy board 154,156,158
It is connected.
The circuit board 152 includes following at least one：Wi-Fi (Wireless Fidelity, Wireless Fidelity) module,
Voltage transformation module, photoelectric conversion module, image processing module and image transmission module.The Wi-Fi module is used to implement Wi-
Fi functions, the voltage transformation module are used to implement voltage conversion function, and the photoelectric conversion module is used to implement opto-electronic conversion
Function, described image processing module are used to implement image processing function, and described image transmission module is used to implement image transmitting work(
Energy.The circuit board 154 includes following at least one：Power management module and holder management module.The power management module
Power management function is used to implement, the holder management module is used to implement holder management function.The circuit board 156 is included such as
Lower at least one：Audio signal sample module and displacement sensing module.The audio signal sample module is used to implement audio letter
Number acquisition function, the displacement sensing module is used to implement the displacement sensing function of the hand-held device 100.The displacement sensing
Module includes gyroscope and compass.The circuit board 158 includes but not limited to link block, and the link block is used to implement
The interface linkage function of the hand-held device 100 and the cradle head device 200.
The radiating subassembly includes heat absorbing member 162 and the expansion interface 165 for connecting electronic equipment.The heat absorbing member
162 are set in the heat dissipation cavity 115, are parallel to the circuit board 152, and are located at the circuit board towards the circuit board
154 side.The heat absorbing member 162 includes ontology 163 and is convexly equipped in the covering portion 164 of 163 rim of ontology.The extension
Interface 165 is heat conducting interface, extends fixed part 168 including heat-conducting part 166 and from the heat-conducting part 166.The fixed part
168 pass through the mounting hole 128 of first mounting surface 123 and extend in the heat dissipation cavity 115.The fixed part 168 and institute
It states mounting hole 128 to be interference fitted or thread fitting, the heat-conducting part 166 is fixed on the housing 110.First peace
Multiple heat emission holes 129 close to and around the mounting hole 128 are additionally provided on dress face 123.The heat-conducting part 166 is against described
Simultaneously cover multiple heat emission holes 129 in the outer surface of second mounting surface 125.The covering portion 164 coats the fixed part 168 simultaneously
In multiple heat emission holes 129 outer rim against second mounting surface 125 inner surface.In the present embodiment, the expansion
Exhibition interface 165 is used to be mechanically connected and/or be electrically connected with the interface of the electronic equipment.
In the present embodiment, the heat absorbing member 162 is to be parallel to the heat sink that the circuit board 152 is set.The expansion
Exhibition interface 165 is a disk dentation expansion interface, and the disk dentation expansion interface is used to the hand-held holder 1000 expanding connection
The electronic equipments such as mobile phone, tablet.The fixed part 168 is substantially cylindrical, and the covering portion 164 is generally curved.
The load-bearing part 170 is set to the circuit board 152 towards on the surface of the circuit board 154, for carrying
State electromagnetic shielding plate 180 and the heat absorbing member 162.The electromagnetic shielding plate 180 is used to shield electromagnetic wave and be led with good
It is hot.The electromagnetic shielding plate 180 is set between the load-bearing part 170 and the heat absorbing member 162, and the electromagnetic shielding
Opposite two surface of plate 180 contacts respectively with the heat absorbing member 162 and the load-bearing part 170.The heat absorbing member 162 passes through
The electromagnetic shielding plate 180 absorbs the heat generated when the circuit board 152 works.
When the hand-held holder 1000 works, the function module work on the circuit board 152,154,156,158 is simultaneously
Generate heat.The ontology 163 absorbs the heat of the generation of circuit board 152 by the electromagnetic shielding plate 180, and will absorb
Heat transfer give the covering portion 164.Heat is transmitted the heat-conducting part by the covering portion 164 by the fixed part 168
166, heat is also passed to the heat-conducting part 166 by the covering portion 164 by multiple heat emission holes 129.The heat-conducting part
166 by described in the heat derives outside housing 110, so as to fulfill to heat sinking function.In the present embodiment, it sets multiple described
Heat emission hole 129 is in order to which the heat enhanced between the covering portion 164 and the heat-conducting part 166 is transmitted.
It is appreciated that when being not provided with multiple heat emission holes 129 on second mounting surface 125, the heat-conducting part 166
Against the outer surface of second mounting surface 125, the covering portion 164 coats the fixed part 168 against the described second installation
The inner surface in face 125.Heat is transmitted the heat-conducting part 166, the heat conduction by the covering portion 164 by the fixed part 168
It portion 166 will be described in the heat derives outside housing 110.
It is appreciated that the electronic component further includes chip, resistance, capacitance, inductance etc., included by the electronic component
The quantity of circuit board can be one or more, for example, two, three, six etc..Function included by each circuit board
The function to be realized of quantity and function module of module can be adjusted accordingly according to actual conditions.
It is appreciated that arrangement mode, position relationship and connection relation of multiple circuit boards in the electrical chamber 114
It can be according to being that actual conditions adjust accordingly.
It is appreciated that the side of each circuit board can set a heat absorbing member 162, to be dissipated to each circuit board
Heat, therefore, the quantity of the heat absorbing member 162 can be one or more, and the quantity of the expansion interface 165 may be one
It is or multiple.
It is appreciated that it is led on the heat-conducting part 166 at least provided with one kind in heat bulge and heat dissipation groove with described
Hot portion 166 enhances heat-conducting area.
It is appreciated that the battery component 190 includes one or more rechargeable batteries.
(scheme not it is appreciated that being provided with multiple indicator lights corresponding to the part of the battery cavities 112 on the housing 110
Show), the indicator light is used to indicate the electricity of the battery component 190.
The present invention absorbs the heat of the circuit board 152 by the way that the heat absorbing member 162 is set on the circuit board 152
Amount, and described in the heat derives absorbed the heat absorbing member 162 by the expansion interface 165 outside housing, so as to make the hand
Holder 1000 is held with preferable heat sinking function, and radiator need not be separately provided, conducive to Miniaturization Design.
Embodiment of above is merely illustrative of the technical solution of the present invention and unrestricted, although with reference to embodiment of above pair
The present invention is described in detail, it will be understood by those of ordinary skill in the art that, technical scheme of the present invention can be carried out
Modification or equivalent replacement should not all be detached from the spirit and scope of technical solution of the present invention.
Claims (45)
1. a kind of hand-held device including housing and the electronic component being set in the housing, is set useful on the housing
Expansion interface in connection electronic equipment and connector for connecting cradle head device, it is characterised in that：The expansion interface
For heat conducting interface, the expansion interface includes heat-conducting part and the fixed part extended from the heat-conducting part, the fixed part pass through
The housing is simultaneously extended in the housing, and the heat-conducting part can be incited somebody to action against the outer surface of the housing, the expansion interface
Described in the heat derives generated during the electronic component work outside housing.
2. hand-held device as described in claim 1, it is characterised in that：The inner cavity of the housing includes battery cavities and accommodating cavity,
The battery cavities are used to accommodate battery component.
3. hand-held device as claimed in claim 2, it is characterised in that：The accommodating cavity include electrical chamber and with the electrical chamber
The heat dissipation cavity being connected, the electronic component are set to the electrical intracavitary, and the heat that the electrical intracavitary generates passes through described
Heat dissipation cavity passes to the expansion interface.
4. hand-held device as claimed in claim 3, it is characterised in that：Heat absorbing member, the heat absorbing member are equipped in the heat dissipation cavity
The heat generated during the electronic component work is absorbed, and gives the heat transfer to the expansion interface.
5. hand-held device as claimed in claim 4, it is characterised in that：Mounting hole, the fixed part are provided on the housing
The heat-conducting part is fixed on the housing by the mounting hole, the fixed part is interference fitted with the mounting hole or spiral shell
Line coordinates.
6. hand-held device as claimed in claim 5, it is characterised in that：Mounting hole and multiple heat dissipations are provided on the housing
Hole, multiple heat emission holes are close and around the mounting hole, and the fixed part is consolidated the heat-conducting part by the mounting hole
Determine on the housing, the heat-conducting part is against the outer surface of the housing and covers multiple heat emission holes.
7. hand-held device as claimed in claim 6, it is characterised in that：The heat absorbing member includes ontology and is convexly equipped in the ontology
The covering portion of rim, the covering portion coat the fixed part and in multiple heat emission holes outer rim against in the housing
Surface, the heat of electronic component generation described in the bulk absorption simultaneously give the heat transfer to the covering portion, the cladding
The heat is passed to the heat-conducting part by portion by the fixed part, and the covering portion also passes through the heat multiple described
Heat emission hole passes to the heat-conducting part, and the heat-conducting part will be described in the heat derives outside housing.
8. hand-held device as claimed in claim 7, it is characterised in that：The fixed part is cylindrical, and the covering portion is in arc
Shape.
9. hand-held device as claimed in claim 5, it is characterised in that：The heat absorbing member includes ontology and is convexly equipped in the ontology
The covering portion of rim, the covering portion coat the fixed part, and the heat that electronic component described in the bulk absorption generates simultaneously will
The heat transfer gives the covering portion, and the heat is passed to the heat-conducting part by the covering portion by the fixed part,
The heat-conducting part will be described in the heat derives outside housing.
10. hand-held device as claimed in claim 9, it is characterised in that：The fixed part is cylindrical, and the covering portion is in arc
Shape.
11. hand-held device as claimed in claim 5, it is characterised in that：Heat bulge is provided on the heat-conducting part；
And/or heat dissipation groove is provided on the heat-conducting part.
12. hand-held device as claimed in claim 4, it is characterised in that：The outer surface of the housing is equipped with for installation function
The operating surface of button and the mounting surface for installing the expansion interface；The operating surface is plane, and relative to the shell
The axially inclined setting of body, the mounting surface are axially extending along the housing.
13. hand-held device as claimed in claim 12, it is characterised in that：The electronic component includes first circuit board, described
First circuit board is vertically arranged at the electrical intracavitary, and is set along the axial direction of the housing.
14. hand-held device as claimed in claim 13, it is characterised in that：The first circuit board includes following at least one：
Wireless fidelity module, voltage transformation module, photoelectric conversion module, image processing module and image transmission module, the wireless guarantor
True module is used to implement Wireless Fidelity function, and the voltage transformation module is used to implement voltage conversion function, the opto-electronic conversion
Module is used to implement photoelectric converting function, and described image processing module is for handling image, described image transmission module
It is used for transmission image.
15. hand-held device as claimed in claim 14, it is characterised in that：The electronic component further includes second circuit board, institute
It states second circuit board and is located at the first circuit board towards the side of the operating surface, and set in face of the operating surface；It is described
Second circuit board includes following at least one：Power management module and holder management module, the power management module is for real
Existing power management function, the holder management module are used to implement holder management function.
16. hand-held device as claimed in claim 15, it is characterised in that：The electronic component further includes tertiary circuit plate, institute
Tertiary circuit plate is stated corresponding to one end of the first circuit board and perpendicular to the first circuit board；The tertiary circuit plate packet
Link block is included, the link block is used to implement the interface linkage function of the hand-held device and cradle head device.
17. hand-held device as claimed in claim 16, it is characterised in that：The electronic component further includes the 4th circuit board, institute
The 4th circuit board is stated between the tertiary circuit plate and the first circuit board, and is parallel to the tertiary circuit plate and sets
It puts；4th circuit board includes following at least one：Audio signal sample module and displacement sensing module, the audio signal
Acquisition module is used to implement audio signal sample function, and the displacement sensing module is used to implement the displacement sense of the hand-held device
Brake.
18. hand-held device as claimed in claim 13, it is characterised in that：The heat absorbing member is is parallel to the first circuit board
The heat sink of setting.
19. hand-held device as claimed in claim 15, it is characterised in that：The heat absorbing member is set to the first circuit board court
To the side of the second circuit board.
20. hand-held device as claimed in claim 15, it is characterised in that：The hand-held device, which further includes, is set to described first
Towards the load-bearing part on the surface of the second circuit board, the load-bearing part is used to carry the heat absorbing member circuit board.
21. hand-held device as claimed in claim 20, it is characterised in that：The hand-held device, which further includes, is set to the carrying
Electromagnetic shielding plate between part and the heat absorbing member, the heat absorbing member absorb the first circuit board by the electromagnetic shielding plate
The heat generated during work.
22. a kind of hand-held holder, including hand-held device and the cradle head device being set on the hand-held device, the hand-held device
Including housing and the electronic component being set in the housing, the extension for connecting electronic equipment is provided on the housing
Interface and connector, the hand-held device are connected by the connector with the cradle head device, it is characterised in that：The expansion
Exhibition interface is heat conducting interface, and the expansion interface includes heat-conducting part and the fixed part extended from the heat-conducting part, the fixation
Portion passes through and the housing and extends in the housing, and the heat-conducting part is against the outer surface of the housing, the expansion interface
Described in the heat derives generated when can the electronic component be worked outside housing.
23. hand-held holder as claimed in claim 22, it is characterised in that：The inner cavity of the housing includes battery cavities and houses
Chamber, the battery cavities are used to accommodate battery component.
24. hand-held holder as claimed in claim 23, it is characterised in that：The accommodating cavity include electrical chamber and with it is described electrical
The heat dissipation cavity that chamber is connected, the electronic component are set to the electrical intracavitary, and the heat that the electrical intracavitary generates passes through institute
It states heat dissipation cavity and passes to the expansion interface.
25. hand-held holder as claimed in claim 24, it is characterised in that：Heat absorbing member, the heat absorption are equipped in the heat dissipation cavity
Part absorbs the heat generated during the electronic component work, and gives the heat transfer to the expansion interface.
26. hand-held holder as claimed in claim 25, it is characterised in that：Mounting hole, the fixation are provided on the housing
Portion is fixed the heat-conducting part on the housing by the mounting hole, the fixed part and the mounting hole be interference fitted or
Thread fitting.
27. hand-held holder as claimed in claim 26, it is characterised in that：Mounting hole and multiple heat dissipations are provided on the housing
Hole, multiple heat emission holes are close and around the mounting hole, and the fixed part is consolidated the heat-conducting part by the mounting hole
Determine on the housing, the heat-conducting part is against the outer surface of the housing and covers multiple heat emission holes.
28. hand-held holder as claimed in claim 27, it is characterised in that：The heat absorbing member includes ontology and is convexly equipped in described
The covering portion of body rim, the covering portion coat the fixed part and in multiple heat emission holes outer rim against the housing
Inner surface, the heat of electronic component generation described in the bulk absorption simultaneously give the heat transfer to the covering portion, the packet
It covers portion and the heat is passed into the heat-conducting part by the fixed part, the heat is also passed through multiple institutes by the covering portion
It states heat emission hole and passes to the heat-conducting part, the heat-conducting part will be described in the heat derives outside housing.
29. hand-held holder as claimed in claim 28, it is characterised in that：The fixed part is cylindrical, and the covering portion is in
Arc.
30. hand-held holder as claimed in claim 26, it is characterised in that：The heat absorbing member includes ontology and is convexly equipped in described
The covering portion of body rim, the covering portion coat the fixed part, and the heat that electronic component described in the bulk absorption generates is simultaneously
By the heat transfer to the covering portion, the heat is passed to the heat conduction by the covering portion by the fixed part
Portion, the heat-conducting part will be described in the heat derives outside housing.
31. holder is held as claimed in claim 30, it is characterised in that：The fixed part is cylindrical, and the covering portion is in
Arc.
32. holder is held as claimed in claim 26, it is characterised in that：Heat bulge is provided on the heat-conducting part；
And/or heat dissipation groove is provided on the heat-conducting part.
33. hand-held holder as claimed in claim 25, it is characterised in that：The outer surface of the housing is equipped with for installation function
The operating surface of button and the mounting surface for installing the expansion interface；The operating surface is plane, and relative to the shell
The axially inclined setting of body, the mounting surface are axially extending along the housing.
34. hand-held holder as claimed in claim 33, it is characterised in that：The electronic component includes first circuit board, described
First circuit board is vertically arranged at the electrical intracavitary, and is set along the axial direction of the housing.
35. holder is held as claimed in claim 34, it is characterised in that：The first circuit board includes following at least one：
Wireless fidelity module, voltage transformation module, photoelectric conversion module, image processing module and image transmission module, the wireless guarantor
True module is used to implement Wireless Fidelity function, and the voltage transformation module is used to implement voltage conversion function, the opto-electronic conversion
Module is used to implement photoelectric converting function, and described image processing module is for handling image, described image transmission module
It is used for transmission image.
36. hand-held holder as claimed in claim 35, it is characterised in that：The electronic component further includes second circuit board, institute
It states second circuit board and is located at the first circuit board towards the side of the operating surface, and set in face of the operating surface；It is described
Second circuit board includes following at least one：Power management module and holder management module, the power management module is for real
Existing power management function, the holder management module are used to implement holder management function.
37. hand-held holder as claimed in claim 36, it is characterised in that：The electronic component further includes tertiary circuit plate, institute
Tertiary circuit plate is stated corresponding to one end of the first circuit board and perpendicular to the first circuit board；The tertiary circuit plate packet
Link block is included, the link block is used to implement the interface linkage function of the hand-held device and cradle head device.
38. hand-held holder as claimed in claim 37, it is characterised in that：The electronic component further includes the 4th circuit board, institute
The 4th circuit board is stated between the tertiary circuit plate and the first circuit board, and is parallel to the tertiary circuit plate and sets
It puts；4th circuit board includes following at least one：Audio signal sample module and displacement sensing module, the audio signal
Acquisition module is used to implement audio signal sample function, and the displacement sensing module is used to implement the displacement sense of the hand-held device
Brake.
39. hand-held holder as claimed in claim 34, it is characterised in that：The heat absorbing member is is parallel to the first circuit board
The heat sink of setting.
40. hand-held holder as claimed in claim 36, it is characterised in that：The heat absorbing member is set to the first circuit board court
To the side of the second circuit board.
41. hand-held holder as claimed in claim 36, it is characterised in that：The hand-held device, which further includes, is set to described first
Towards the load-bearing part on the surface of the second circuit board, the load-bearing part is used to carry the heat absorbing member circuit board.
42. hand-held holder as claimed in claim 41, it is characterised in that：The hand-held device, which further includes, is set to the carrying
Electromagnetic shielding plate between part and the heat absorbing member, the heat absorbing member absorb the first circuit board by the electromagnetic shielding plate
The heat generated during work.
43. hand-held holder as claimed in claim 22, it is characterised in that：The cradle head device includes following at least one：It bows
Face upward axis mechanism, roll axis mechanism and translation axis mechanism.
44. a kind of electronic device, which is characterized in that including：
Housing, equipped with accommodating cavity；
Circuit board, in the accommodating cavity；
Heat absorbing member, in the accommodating cavity, the heat absorbing member is fixedly connected with the circuit board, for carrying the circuit
Plate, and the heat absorbing member and the circuit board mutually insulated；
Expansion interface, installation on the housing, and are used to be mechanically connected and/or be electrically connected, the extension with external interface
Interface is heat conducting interface, and the expansion interface includes heat-conducting part and the fixed part extended from the heat-conducting part, the fixed part
It across the housing and extends in the housing, the heat-conducting part is against the outer surface of the housing, the expansion interface energy
Described in the heat derives generated when enough electronic component is worked outside housing；
Wherein, the expansion interface is connect with the heat absorbing member, and heat conduction can be carried out between the heat absorbing member.
45. electronic device as claimed in claim 44, it is characterised in that：The expansion interface at least exposed housing in part
Outside；
Alternatively, the heat absorbing member absorbs the heat that the electronic device on the circuit board generates, the expansion interface is passed to, from
And by heat spreader to the outside of the housing, to radiate to the electronic device on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938994.5A CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/087505 WO2017028274A1 (en) | 2015-08-19 | 2015-08-19 | Handheld device and cradle head and electronic device using same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938994.5A Division CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105993208A CN105993208A (en) | 2016-10-05 |
| CN105993208B true CN105993208B (en) | 2018-06-12 |
Family
ID=57040923
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580003653.8A Expired - Fee Related CN105993208B (en) | 2015-08-19 | 2015-08-19 | Hand-held device and the hand-held holder and electronic device using the hand-held device |
| CN201710938994.5A Expired - Fee Related CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938994.5A Expired - Fee Related CN107660106B (en) | 2015-08-19 | 2015-08-19 | Handheld device, handheld cradle head using same and electronic device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6605710B2 (en) |
| CN (2) | CN105993208B (en) |
| WO (1) | WO2017028274A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206555683U (en) * | 2016-12-28 | 2017-10-13 | 深圳市大疆灵眸科技有限公司 | The hand-held bar assembly of head and the head for being equiped with the hand-held bar assembly of the head |
| CN207198528U (en) * | 2017-09-29 | 2018-04-06 | 深圳市大疆灵眸科技有限公司 | A kind of camera body and camera structure |
| JP6557939B1 (en) * | 2018-05-21 | 2019-08-14 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | Holding system and imaging system |
| CN112074112B (en) * | 2020-08-13 | 2021-10-19 | 华为技术有限公司 | Electronic equipment and extension assembly |
| CN112303423B (en) * | 2020-10-15 | 2022-10-25 | 天目爱视（北京）科技有限公司 | Intelligent three-dimensional information acquisition equipment stable in rotation |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321491B2 (en) * | 2006-03-15 | 2008-01-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink for a portable computer |
| US8477499B2 (en) * | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US8113863B2 (en) * | 2009-08-25 | 2012-02-14 | Tyco Electronics Corporation | Socket connector having a thermally conductive insert |
| JP5565117B2 (en) * | 2010-06-07 | 2014-08-06 | 株式会社リコー | Imaging device |
| JP2013214605A (en) * | 2012-04-02 | 2013-10-17 | Sharp Corp | Portable terminal apparatus |
| CN203040094U (en) * | 2012-12-28 | 2013-07-03 | 惠州Tcl移动通信有限公司 | Heat radiating structure of portable broadband wireless device |
| KR102066482B1 (en) * | 2013-07-16 | 2020-01-15 | 삼성전자주식회사 | Fiber reinforced plastic material and electronic device including the same |
| US20150071627A1 (en) * | 2013-09-12 | 2015-03-12 | Chi Khai Hoang | Automated Stabilizing Apparatus |
| CN203950109U (en) * | 2014-03-14 | 2014-11-19 | 广州虹天航空科技有限公司 | Capture apparatus stabilizator |
| CN204227000U (en) * | 2014-11-10 | 2015-03-25 | 李强 | Self-shooting bar |
| CN204420520U (en) * | 2015-01-27 | 2015-06-24 | 马鞍山市赛迪智能科技有限公司 | A kind of hand-held from The Cloud Terrace of surely taking pictures |
| CN104812222B (en) * | 2015-05-15 | 2017-08-25 | 深圳市大疆灵眸科技有限公司 | Radiator structure and the electronic installation with the radiator structure |
| CN204929513U (en) * | 2015-08-19 | 2015-12-30 | 深圳市大疆创新科技有限公司 | Hand -held device and use handheld cloud platform of this hand -held device |
-
2015
- 2015-08-19 CN CN201580003653.8A patent/CN105993208B/en not_active Expired - Fee Related
- 2015-08-19 CN CN201710938994.5A patent/CN107660106B/en not_active Expired - Fee Related
- 2015-08-19 WO PCT/CN2015/087505 patent/WO2017028274A1/en active Application Filing
- 2015-08-19 JP JP2018508764A patent/JP6605710B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018533037A (en) | 2018-11-08 |
| WO2017028274A1 (en) | 2017-02-23 |
| CN105993208A (en) | 2016-10-05 |
| CN107660106B (en) | 2020-08-04 |
| JP6605710B2 (en) | 2019-11-13 |
| CN107660106A (en) | 2018-02-02 |
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Legal Events
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170401 Address after: 518057 Guangdong city of Shenzhen province Nanshan District Guangdong streets south four Road No. 18 building in the West SKYWORTH semiconductor design 12 Applicant after: SZ DJI OSMO TECHNOLOGY Co.,Ltd. Address before: 518057 Guangdong province Shenzhen city Nanshan District high tech Zone South Hing a No. 9 Hongkong, Shenzhen building 6 floor Applicant before: SZ DJI TECHNOLOGY Co.,Ltd. |
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Granted publication date: 20180612 |