CN212115484U - Camera shooting module - Google Patents

Abstract

The embodiment of the application discloses a camera module, relates to the field of image acquisition equipment, and can be used in the fields of artificial intelligence, face recognition, image recognition and the like. The specific implementation scheme is as follows: a heat conducting block is arranged between the main board and the auxiliary board, one end of the heat conducting block is jointed with the control chip on the main board, the other end of the heat conducting block is jointed with the auxiliary board, and the auxiliary board is jointed with the heat radiating surface on the shell; the heat generated by the control chip is firstly transferred to the auxiliary plate through the heat conducting block and then transferred to the shell through the heat dissipation surface; compared with the control chip directly contacting with the shell, the shell has larger area for receiving heat, and can avoid the local area of the shell from overheating.

Description

Camera shooting module

Technical Field

The application relates to the field of image acquisition equipment, in particular to a camera module.

Background

In artificial intelligence equipment, image acquisition tasks such as face recognition, behavior recognition and the like are usually performed through a camera module; the camera module generally comprises a shell and a mainboard, wherein the shell is enclosed into a mounting cavity, the mainboard is placed in the mounting cavity, and a control chip is arranged on the mainboard; because the control chip produces the heat easily at the during operation, the control chip often directly contacts with the inner wall of shell to directly transmit the heat that the control chip produced to the shell, and then realize the heat dissipation.

However, the control chip is in direct contact with the housing, so that the housing in contact with the control chip is easily overheated, resulting in overheating of a portion of the housing.

SUMMERY OF THE UTILITY MODEL

According to an aspect of the present application, there is provided a camera module, including: the shell is enclosed into an installation cavity with an installation opening at one end; the main board and the auxiliary board are accommodated in the mounting cavity, the main board and the auxiliary board are arranged in parallel at intervals, the mounting cavity is provided with a heat dissipation surface opposite to the mounting opening, and the auxiliary board is attached to the heat dissipation surface; and the heat conduction block is arranged between the main board and the auxiliary board, one end of the heat conduction block is jointed with the control chip on the main board, and the other end of the heat conduction block is jointed with the auxiliary board.

According to the technical scheme, heat generated by the control chip is firstly transferred to the auxiliary plate through the heat conducting block and then transferred to the shell through the heat dissipation surface; compared with the control chip directly contacting with the shell, the shell has larger area for receiving heat, and can avoid the local area of the shell from overheating. In addition, heat is transmitted to the auxiliary plate through the heat conducting block and then transmitted to the shell through the auxiliary plate, so that the heat transmission path is increased, part of heat can be released to the external environment in the transmission process, and overheating of a local area of the shell is further avoided.

In some embodiments, which may include the above-described embodiments, an area of an end of the heat conduction block joined to the control chip is smaller than an area of an end of the heat conduction block joined to the sub-plate.

In some embodiments, which may include the above embodiments, a first thermal conductive paste is disposed between the thermal conductive block and the control chip.

In some embodiments, which may include the above-described embodiments, a second heat conductive paste is disposed between the heat conductive block and the sub plate.

In some embodiments, which may include the above-described embodiments, the heat-conducting block is a metal block, and the sub-plate is a metal plate.

In some embodiments, which may include the above embodiments, the camera module further includes a bottom plate disposed in the mounting opening for closing the mounting opening.

In some embodiments, which may include the above-mentioned embodiments, a heat dissipation boss is disposed between the bottom plate and the main plate, one end of the heat dissipation boss is joined to a side surface of the main plate away from the secondary plate, and the other end of the heat dissipation boss is joined to the bottom plate.

In some embodiments, which may include the above embodiments, a third thermal conductive paste is disposed between the heat dissipation boss and the main board.

In some embodiments, which may include the above embodiments, the heat dissipating boss is of unitary construction with the base plate.

In some embodiments, which may include the above embodiments, the heat dissipation boss is a plurality of heat dissipation bosses, and the plurality of heat dissipation bosses are arranged at intervals.

In some embodiments that may include the above embodiments, a containing groove is provided on a side surface of the bottom plate facing the main plate, and a part of the electronic devices on a side surface of the main plate facing away from the secondary plate are contained in the containing groove.

In some embodiments that may include the above embodiments, the camera module further includes a connection column, one end of the connection column is provided with a stud, and a diameter of the connection column is greater than an outer diameter of the stud; the main board is provided with a first mounting hole, the bottom board is provided with a first threaded hole, and the stud penetrates through the first mounting hole and is matched with the first threaded hole.

In some embodiments that may include the above-mentioned embodiment, the camera module further includes a connecting bolt, a second mounting hole is provided on the sub-plate, a third mounting hole is provided on the heat dissipation surface, a second threaded hole is provided on the connecting column, and the connecting bolt is matched with the second threaded hole after passing through the third mounting hole and the second mounting hole.

In some embodiments that may include the above-mentioned embodiment, the main board is provided with a camera device, the sub board is provided with a first light hole facing the camera device, and the heat dissipation surface is provided with a second light hole facing the first light hole.

In some embodiments, which may include the above embodiments, the camera module further includes a transparent plate covering the housing to close the second light-transmitting hole.

In some embodiments, which may include the above embodiments, the heat dissipating surface is provided with an adjustment groove.

In some embodiments that may include the above embodiments, a light supplement device is disposed on a side of the sub-board away from the main board, and a light supplement hole that faces the light supplement device is disposed on the heat dissipation surface.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the application, nor is it intended to limit the scope of the application. Other features of the present application will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present application will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:

fig. 1 is an overall view of a camera module provided in an embodiment of the present application;

fig. 2 is a cross-sectional view of a camera module provided in an embodiment of the present application;

fig. 3 is an exploded view of a camera module according to an embodiment of the present disclosure;

fig. 4 is an exploded view of a camera module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a bottom plate in the camera module provided in the embodiment of the present application;

fig. 6 is a schematic connection diagram of a sub-board, a main board, and a bottom board in the camera module according to the embodiment of the present application.

Description of reference numerals:

10: a housing;

20: a main board;

30: a sub-board;

40: a base plate;

50: a heat conducting block;

60: a transparent plate;

101: installing a cavity;

102: a second light-transmitting hole;

103: a light compensating hole;

104: a third mounting hole;

105: an adjustment groove;

106: an opening;

107: a connecting plate;

108: connecting holes;

201: a control chip;

202: a camera device;

203: connecting columns;

204: a stud;

205: an interface device;

206: a first mounting hole;

207: a connecting bolt;

208: a second threaded hole;

301: a first light-transmitting hole;

302: a second mounting hole;

303: a natural light supplement device;

304: infrared light supplement equipment;

305: a detection device;

306: an indicator light;

401: a heat dissipation boss;

402: a containing groove;

403: a first threaded hole;

601: a first light-transmitting region;

602: a second light-transmitting region;

603: a third light-transmitting region;

604: a fourth light-transmitting region;

605: and a fifth light-transmitting region.

Detailed Description

The following description of the exemplary embodiments of the present application, taken in conjunction with the accompanying drawings, includes various details of the embodiments of the application for the understanding of the same, which are to be considered exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The embodiment of the application provides a camera module, can be used to aspects such as artificial intelligence field, face identification, image recognition to reach and avoid the overheated effect of shell local area.

Referring to fig. 1 and fig. 2, the camera module provided in this embodiment includes a housing 10, the housing 10 encloses a mounting cavity 101, and one end of the mounting cavity 101 has a mounting opening, so that other devices can be placed in the mounting cavity 101 through the mounting opening. The housing 10 may have a regular shape such as a rectangular parallelepiped shape or a cylindrical shape, for example, although the housing 10 may have another irregular shape, the shape of the housing 10 is not limited in this embodiment.

Further, in the present embodiment, the material of the housing 10 is not limited, and the material of the housing 10 may include, for example, a metal material such as copper, iron, and aluminum, or may also include a non-metal material such as plastic.

In an implementation manner that the housing 10 is made of a metal material, an oxide film may be formed on an outer wall of the housing 10, and the oxide film may protect the metal inside to prevent the metal inside from being corroded; in addition, compared with the case where paint is applied to the outer wall of the case 10, the heat exchange speed between the oxide film formed of metal oxide and the external air is fast, so that the heat on the case 10 can be rapidly transferred to the external air, thereby improving the heat dissipation effect of the case 10.

Illustratively, the oxide film may be formed by an electrochemical method, but of course, the case 10 may be treated by a solution containing an oxidizing agent to form the oxide film; the present embodiment does not limit the formation method of the oxide film.

In other implementations, a frosted structure may be formed on the outer wall of the housing 10 to increase the contact area between the housing 10 and the external air, so as to increase the heat transfer rate between the housing 10 and the external air.

Referring to fig. 2 to 4, the camera module provided in this embodiment further includes a main board 20 and a sub-board 30, the main board 20 and the sub-board 30 are both disposed in the mounting cavity 101, and the main board 20 and the sub-board 30 are disposed in parallel and at an interval; the mounting cavity 101 has a heat dissipating surface at the end extending inward from the mounting opening, the heat dissipating surface is opposite to the mounting opening, the main board 20 and the sub board 30 are disposed between the heat dissipating surface and the mounting opening, the sub board 30 is disposed close to the heat dissipating surface, and the sub board 30 is attached to the heat dissipating surface.

In the above implementation manner, the main board 20 may be a circuit board (e.g., a PCB), the control chip 201, the camera 202 and other electronic devices are disposed on the main board 20, a circuit is disposed on the main board 20, the control chip 201, the camera 202 and the electronic devices are all electrically connected to the circuit, and the camera 202 and the electronic devices can be controlled to operate by the control chip 201.

The control chip 201 may be disposed on a side of the main board 20 facing the sub-board 30, the heat conduction block 50 is disposed between the main board 20 and the sub-board 30, one end of the heat conduction block 50 is connected to the control chip 201, and the other end of the heat conduction block 50 is connected to a side of the sub-board 30 facing the main board 20. Therefore, the heat generated by the control chip 201 can be transferred to the sub-board 30 through the heat conducting block 50, and the heat transferred to the sub-board 30 can be transferred to the housing 10 through the heat dissipating surface due to the attachment of the sub-board 30 and the heat dissipating surface, so as to realize heat dissipation.

In the camera module provided by the embodiment of the application, the heat conduction block 50 is arranged between the main board 20 and the auxiliary board 30, one end of the heat conduction block 50 is connected with the control chip 201 on the main board 20, the other end of the heat conduction block 50 is connected with the auxiliary board 30, and the auxiliary board 30 is attached to the heat dissipation surface on the shell; the heat generated by the control chip 201 is firstly transferred to the sub-board 30 through the heat conducting block 50, and then transferred to the shell 10 through the heat dissipation surface; compared with the case 10 in which the control chip 201 is directly in contact with the case 10, the case 10 has a larger area to receive heat, and thus local areas of the case 10 can be prevented from being overheated. In addition, heat is firstly transferred to the auxiliary plate 30 through the heat conducting block 50 and then transferred to the shell 10 through the auxiliary plate 30, so that the transfer path of the heat is increased, part of the heat is released to the external environment in the transfer process, and overheating of a local area of the shell 10 is further avoided.

In this embodiment, with continued reference to fig. 4, a connecting plate 107 may be disposed on an outer wall of the housing 10 near the mounting opening, and a connecting hole 108 may be disposed on the connecting plate 107 to facilitate the fixing of the housing 10.

With continued reference to fig. 3, in an implementation in which the motherboard 20 is a circuit board, an interface device 205 may be disposed on the motherboard 20, and correspondingly, an opening 106 facing the interface device 205 is disposed on the housing 10, so that an external device may be electrically connected to the motherboard 20 through the interface device 205. The interface device 205 may be a USB interface, a debug interface, a power interface, or the like.

In this embodiment, the heat conduction block 50 may directly contact the control chip 201 and the sub-plate 30, so that heat is transferred to the sub-plate 30 through the heat conduction block 50. Further, a first heat conductive paste (not shown) may be provided between the heat conductive block 50 and the control chip 201, that is, the heat conductive block 50 is in contact with the control chip 201 through the first heat conductive paste; the control chip 201 transfers heat to the heat-conducting block 50 through the first heat-conducting glue, so that the speed of transferring heat to the heat-conducting block 50 is increased, and the heat dissipation rate is increased. The first heat conducting glue can be heat conducting silica gel.

In other implementations, a second heat conductive silicone gel (not shown) is disposed between the heat conductive block 50 and the sub-plate 30, that is, the heat conductive block 50 is in contact with the sub-plate 30 through the second heat conductive silicone gel; therefore, heat in the heat conduction block 50 is transferred to the auxiliary plate 30 through the second heat conduction glue, the speed of heat transfer to the auxiliary plate 30 is increased, and the heat dissipation rate is further increased. The second heat conducting glue can be heat conducting silica gel. Of course, the heat-conducting block 50 may be integrated with the sub-plate 30, and thus the heat-conducting block 50 may be arranged to increase the heat transfer rate from the sub-plate 30 to the sub-plate.

In some embodiments, one end of the heat conducting block 50 is in contact with the control chip 201 through the first heat conducting adhesive, and the other end of the heat conducting block 50 is in contact with the sub-plate 30 through the second heat conducting adhesive, so that the heat transfer speed can be further increased, and the heat dissipation rate can be further increased.

In this embodiment, the heat conduction block 50 may have a regular shape such as a cylindrical shape or a prismatic shape, but the heat conduction block 50 may have another irregular shape.

The heat conducting block 50 needs to cover the control chip 201, so that most of the heat generated by the control chip 201 is transferred into the heat conducting block 50; that is, the control chip 201 has an outer side surface for contacting the heat conduction block 50, and the end surface of the heat conduction block 50 bonded to the control chip 201 covers the outer side surface. For example, the end surface of the heat conduction block 50, which is joined to the control chip 201, may completely coincide with the outer side surface; or the projection of the outer side surface on the main board 20 is positioned in the projection of the end surface of the heat conduction block 50, which is jointed with the control chip 201, on the main board 20.

In the above implementation, the area of the end of the heat conduction block 50 joined to the control chip 201 is smaller than the area of the end of the heat conduction block 50 joined to the sub-plate 30; with such an arrangement, the contact area between the heat conduction block 50 and the sub-plate 30 can be increased, and the heat transfer speed between the heat conduction block 50 and the sub-plate 30 is further increased, so that the heat dissipation rate is increased. Illustratively, the heat-conducting block 50 may have a circular truncated cone shape or a truncated pyramid shape.

In this embodiment, the heat conduction block 50 may be a metal block, and for example, the material of the heat conduction block 50 may include copper, iron, aluminum, and the like. Further, the sub-plate 30 may be a metal plate, and the material of the sub-plate 30 may include copper, iron, aluminum, and the like. With this arrangement, the heat-conducting block 50 and the sub-plate 30 are made of metal, so that the heat transfer rate of heat between the heat-conducting block 50 and the sub-plate 30 is increased, and the heat dissipation rate is increased.

With reference to fig. 2 and fig. 3, the camera module according to the present embodiment further includes a bottom plate 40, and the bottom plate 40 is disposed in the installation opening to seal the installation opening. So set up, bottom plate 40 can shutoff installation mouth to realize the sealed to installation cavity 101.

In the above implementation manner, a heat dissipation boss 401 is disposed between the bottom plate 40 and the main board 20, one end of the heat dissipation boss 401 is engaged with the side surface of the main board 20 away from the sub-board 30, and the other end of the heat dissipation boss 401 is engaged with the bottom plate 40. With the arrangement, heat from the motherboard 20 can be transferred to the bottom plate 40 through the heat dissipation boss 401, and then transferred to the external environment through the bottom plate 40, so that the heat dissipation effect is improved. In addition, the heat generated by the control chip 201 can be further transmitted to the external environment through the motherboard 20, the heat dissipation boss 401 and the bottom plate 40, and compared with the case 10 directly contacting the control chip 201, the local area of the case 10 can be further prevented from being overheated.

In implementations where the motherboard 20 includes a circuit board, the heat dissipating bosses 401 may directly engage the circuit board. The side of the main board 20 facing away from the sub-board 30 may be provided with an electronic device, and the heat dissipation boss 401 may be engaged with the electronic device with a larger heat generation amount. It is of course also possible to provide the circuit board with a projection on the side facing away from the sub-board 30, with which the heat dissipation boss 401 engages.

Further, a third heat-conducting adhesive (not shown) is arranged between the heat dissipation boss 401 and the main board 20, so that the heat transfer speed between the heat dissipation boss 401 and the main board 20 can be increased, heat can be rapidly transferred to the heat dissipation boss 401, and then the heat can be released to the external environment through the bottom plate 40, and the heat dissipation rate is increased. The third heat-conducting glue can be heat-conducting silica gel.

In some embodiments, the heat dissipating protrusion 401 may also contact the bottom plate 40 through the heat conductive silicone, so as to increase the heat transfer speed between the heat dissipating protrusion 401 and the bottom plate 40.

As shown in fig. 5, in other implementations, the heat dissipating boss 401 may be integrated with the bottom plate 40, so that the heat transferred to the heat dissipating boss 401 may directly enter the bottom plate 40, thereby increasing the heat transfer speed between the heat dissipating boss 401 and the bottom plate 40.

In this embodiment, the number of the heat dissipation bosses 401 may be multiple, and the multiple heat dissipation bosses 401 are arranged at intervals. So set up, a plurality of heat dissipation bosss 401 can be simultaneously with the heat transfer of mainboard 20 to bottom plate 40 to improve the speed that the heat was transferred to bottom plate 40 by mainboard 20, and then improve heat dissipation rate.

The base plate 40 may be a metal plate, and exemplary base plate 40 materials may include copper, iron, aluminum, and the like; the metal base plate 40 can improve the heat transfer rate and thus the heat dissipation effect. Of course, the bottom plate 40 may be mainly made of a non-metal material such as plastic. The heat dissipating boss 401 may be made of copper, iron, aluminum, or the like.

With continued reference to fig. 2, in some embodiments, the heat dissipating surface is provided with an adjustment groove 105, and the contact area between the sub-plate 30 and the housing 10 can be adjusted by the adjustment groove 105 to adjust the speed at which heat is transferred from the sub-plate 30 to the housing 10.

With continued reference to fig. 2, fig. 3 and fig. 5, a portion of the electronic devices located on the main board 20 may be disposed on a side of the main board 20 away from the secondary board 30, correspondingly, a containing groove 402 may be disposed on a side of the bottom board 40 toward the main board 20, and a portion of the electronic devices on the side of the main board 20 away from the secondary board 30 is contained in the containing groove 402; that is, an end of the electronic device facing away from the main board 20 is accommodated in the accommodating groove 402. So set up, partial electron device holding can reduce the shared installation cavity 101's of electron device space in storage tank 402, can dwindle the volume of installation cavity 101, and then dwindle the volume of shell 10, is convenient for realize making a video recording the miniaturization of module.

It should be noted that the electronic devices accommodated in the accommodating groove 402 may be capacitors, resistors, inductors, and the like. The present embodiment does not limit the electronic device.

Furthermore, the accommodating groove 402 may be provided in plural, and the plural accommodating grooves 402 are arranged at intervals, so that different electronic devices can be accommodated in different accommodating grooves 402.

With continued reference to fig. 2 and 3, the camera module provided in this embodiment further includes a connection column 203, a stud 204 is disposed at one end of the connection column 203, and the diameter of the connection column 203 is greater than the diameter of the stud 204; correspondingly, the main plate 20 is provided with a first mounting hole 206, the bottom plate 40 is provided with a first threaded hole 403, and the stud 204 passes through the first mounting hole 206 and then is matched with the first threaded hole 403. With the arrangement, the connection between the main board 20 and the bottom board 40 is realized through the connecting posts 203 and the studs 204, and the structure is simple and the installation is convenient.

The connecting column 203 and the stud 204 may be made of metal materials such as copper and aluminum, and the connecting column 203 and the stud 204 may also be made of non-metal materials such as plastic; the present embodiment is not limited thereto as long as the connection between the main board 20 and the bottom board 40 can be achieved.

Furthermore, the camera module further comprises a connecting bolt 207, a second threaded hole 208 is formed in the connecting column 203, a second mounting hole 302 is formed in the auxiliary plate 30, and a third mounting hole 104 penetrating through the heat dissipation surface is formed in the shell; the connecting bolt 207 passes through the third mounting hole 104 and the second mounting hole 302 in sequence and then is matched with the second threaded hole 208. The connecting column 203 and the auxiliary plate 30 can be fixed on the shell 10 through the connecting bolt 207; since the connecting column 203 and the stud 204 already fix the bottom plate 40 and the main plate 20 together, the connection between the bottom plate 40, the main plate 20, the sub-plate 30 and the housing can be realized by the connecting bolt 207, the connecting column 203 and the stud 204; simple structure and convenient connection.

In the above implementation, the connecting column 203 and the connecting bolt 207 may be both plural; correspondingly, a plurality of first threaded holes 403 are formed in the bottom plate 40, a plurality of first mounting holes 206 are formed in the main plate 20, a plurality of second mounting holes 302 are formed in the sub-plate 30, and a plurality of third mounting holes 104 are formed in the housing 10; the stud 204 on each connecting column 203 passes through a first mounting hole 206 and is matched with a first threaded hole 403 opposite to the first mounting hole 206; each connecting bolt 207 passes through the third mounting hole 104 and the second mounting hole 302 opposite to the third mounting hole 104 in sequence and then is matched with the second threaded hole 208 on one connecting column 203. The plurality of connection posts 203 and connection bolts 207 may improve the connection strength between the base plate 40, the main plate 20, the sub-plate 30, and the housing 10.

With continued reference to fig. 2 and fig. 3, in the camera module provided in this embodiment, the main board 20 is provided with the camera 202, and the camera 202 may be disposed on a side of the main board 20 facing the sub-board 30, that is, the camera 202 and the control chip 201 are located on the same side of the main board 20; the camera 202 is used to acquire an external image to realize face recognition or behavior recognition. Further, the number of the image capturing devices 202 may be multiple, and the plurality of image capturing devices 202 are arranged at intervals, and the corresponding plurality of image capturing devices 202 may simultaneously capture images of the outside world.

In order to receive external light, a first light hole 301 facing the image pickup device 202 is formed in the sub-plate 30, a second light hole 102 penetrating the heat radiation surface is formed in the housing 10, and the second light hole 102 faces the first light hole 301. So set up, camera device 202 can receive external light through second light trap 102 and first light trap 301 to realize image acquisition.

In the implementation mode that is in the same place through spliced pole 203 and connecting bolt 207 are fixed between bottom plate 40, mainboard 20, subplate 30 and shell 10, reasonable length that sets up spliced pole 203 can make camera device 202 deviate from the one end of mainboard 20 and stretch into in the second light trap 102 to mainboard 20 and shell 10 hinder the light entering, and then improve the image quality that camera device 202 obtained.

In this embodiment, the camera module further includes a transparent plate 60, and the transparent plate 60 covers the housing 10 to close the second light hole 102. So set up, can realize the closure to second light trap 102, and then avoid impurity such as external dust to enter into the casing by second light trap 102.

The transparent plate 60 may be made of transparent materials such as glass and organic glass (PMMA).

In the above implementation, the transparent plate 60 may be connected to the housing 10 by an adhesive. Further, a groove may be provided on the housing 10, the second light-transmitting hole 102 is provided at the bottom of the groove, and the transparent plate 60 is provided in the groove. With this arrangement, the transparent plate 60 is accommodated in the groove of the housing 10, so that the camera module can be further miniaturized.

In the implementation mode that the bottom plate 40, the main plate 20, the sub-plate 30 and the housing 10 are fixed together through the connecting column 203 and the connecting bolt 207, the third mounting hole 104 on the housing 10 may be disposed at the bottom of the groove, the third mounting hole 104 may include a first section and a second section along the circumferential direction, the first section is disposed near the sub-plate 30, and the diameter of the first section is smaller than that of the second section, and the nut of the connecting bolt 207 may be accommodated in the second section, so as to prevent the connecting bolt 207 from affecting the bottom of the groove where the transparent plate 60 covers the groove.

Referring to fig. 6, in some embodiments, the diameter of the third mounting hole 104 on the housing 10 is larger than the diameter of the nut of the connecting bolt 207, at this time, the bottom plate 40 and the main plate 20 are fixed together by the connecting column 203 and the stud 204, and the main plate 20 and the secondary plate 30 are fixed together by the connecting column 203 and the connecting bolt 207; that is, the bottom plate 40, the main plate 20 and the sub-plate 30 are assembled into a single module through the connecting bolt 207, the connecting column 203 and the stud 204, and in the assembling process of the camera module, the bottom plate 40, the main plate 20 and the sub-plate 30 can be assembled into a module outside the housing 10, and then the module is assembled into the housing 10, so that the assembling of the camera module is facilitated; in addition, the image capturing function can be realized by the module assembled by the bottom board 40, the main board 20 and the sub-board 30, so that the module can be tested after being assembled, and debugging after testing is facilitated.

With reference to fig. 2 and fig. 3, in this embodiment, a light supplement device is disposed on a side surface of the sub-board 30 away from the main board 20, and a light supplement hole 103 facing the light supplement device is disposed on the heat dissipation surface; when the camera device 202 acquires an external image, the light supplement device can provide light supplement through the light supplement hole 103; thereby improving the quality of the image acquired by the image capture device 202.

Illustratively, the light supplement device may include a natural light supplement device 303 and a detection device 305, and the detection device 305 may detect external light, so that when the external light is insufficient, the natural light supplement device 303 emits white light, and the image capturing apparatus 202 may obtain a relatively clear image. The natural light supplement device 303 may be a light emitting diode, a bulb, or the like capable of emitting white light; the detection device 305 may include a photo-resistor or other device capable of detecting ambient light.

Further, the light supplement device may further include an infrared light supplement device 304, and the infrared light supplement device 304 may emit infrared light at night to meet the requirement of night shooting. The infrared light supplement device 304 may be a diode capable of emitting infrared light or other devices capable of emitting infrared light.

An indicating lamp 306 can be further arranged on the auxiliary plate 30, and the indicating lamp 306 can emit light when the camera module works so as to prompt that the camera module is in a working state.

In some embodiments, in order to achieve the electrical connection between the natural light supplement device 303, the detection device 305, the infrared light supplement device 304, and the indicator 306 and the main board 20, a first plug connector may be disposed on a side of the main board 20 facing the sub board 30, and the first plug connector is electrically connected to a circuit on the main board 20; correspondingly, a second plug connector is arranged on the side surface of the auxiliary board 30 facing the main board 20, and the second plug connector is electrically connected with the natural light supplementary lighting device 303, the detection device 305, the infrared light supplementary lighting device 304 and the indicator light 306; the first connector and the second connector are matched, so that the natural light supplementary lighting device 303, the detection device 305, the infrared light supplementary lighting device 304 and the indicator light 306 are electrically connected with the main board 20.

In an implementation manner that a natural light supplement device 303, a detection device 305, an infrared light supplement device 304, and an indicator light 306 are arranged on the sub-board 30; the transparent plate 60 has a first transparent area 601 facing the natural light supplement device 303, a second transparent area 602 facing the detection device 305, a third transparent area 603 facing the infrared light supplement device 304, a fourth transparent area 604 facing the indicator 306, and a fifth transparent area 605 facing the image capturing apparatus 202. Illustratively, the transparent plate 60 may be screen printed or etched to identify the light transmitting regions.

The above-described embodiments should not be construed as limiting the scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (17)

1. The utility model provides a module of making a video recording which characterized in that includes:

the shell is enclosed into an installation cavity with an installation opening at one end;

the main board and the auxiliary board are accommodated in the mounting cavity, the main board and the auxiliary board are arranged in parallel at intervals, the mounting cavity is provided with a heat dissipation surface opposite to the mounting opening, and the auxiliary board is attached to the heat dissipation surface;

and the heat conduction block is arranged between the main board and the auxiliary board, one end of the heat conduction block is jointed with the control chip on the main board, and the other end of the heat conduction block is jointed with the auxiliary board.

2. The camera module of claim 1, wherein an area of an end of the heat-conducting block joined to the control chip is smaller than an area of an end of the heat-conducting block joined to the sub-plate.

3. The camera module of claim 1, wherein a first thermally conductive adhesive is disposed between the thermally conductive block and the control chip.

4. The camera module of claim 1, wherein a second thermally conductive paste is disposed between the thermally conductive block and the sub-plate.

5. The camera module of claim 1, wherein the heat-conducting block is a metal block and the sub-plate is a metal plate.

6. The camera module of any of claims 1-5, further comprising a base plate disposed within the mounting opening for closing the mounting opening.

7. The camera module according to claim 6, wherein a heat dissipation boss is disposed between the base plate and the main plate, one end of the heat dissipation boss is engaged with a side surface of the main plate away from the sub-plate, and the other end of the heat dissipation boss is engaged with the base plate.

8. The camera module of claim 7, wherein a third thermally conductive adhesive is disposed between the heat dissipation boss and the main board.

9. The camera module of claim 7, wherein the heat-dissipating boss is integral with the base plate.

10. The camera module of claim 7, wherein the heat dissipation boss is provided in plurality, and the plurality of heat dissipation bosses are arranged at intervals.

11. The camera module according to claim 6, wherein a receiving groove is formed on a side surface of the bottom plate facing the main plate, and a portion of the electronic devices on a side surface of the main plate facing away from the sub-plate are received in the receiving groove.

12. The camera module of claim 6, further comprising a connecting post, wherein a stud is disposed at one end of the connecting post, and the connecting post has a diameter larger than the outer diameter of the stud; the main board is provided with a first mounting hole, the bottom board is provided with a first threaded hole, and the stud penetrates through the first mounting hole and is matched with the first threaded hole.

13. The camera module according to claim 12, further comprising a connecting bolt, wherein the sub-plate is provided with a second mounting hole, the heat dissipating surface is provided with a third mounting hole, the connecting column is provided with a second threaded hole, and the connecting bolt passes through the third mounting hole and the second mounting hole and then is engaged with the second threaded hole.

14. The camera module according to any one of claims 1-5, wherein the main board is provided with a camera, the sub board is provided with a first light hole facing the camera, and the heat dissipation surface is provided with a second light hole facing the first light hole.

15. The camera module of claim 14, further comprising a transparent plate overlying the housing to close the second light aperture.

16. The camera module of any one of claims 1-5, wherein the heat dissipation surface is provided with an adjustment groove.

17. The camera module according to any one of claims 1 to 5, wherein a light supplement device is disposed on a side of the sub-board facing away from the main board, and a light supplement hole facing the light supplement device is disposed on the heat dissipation surface.

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