CN105988303A - 一种掩模版传输装置及传输方法 - Google Patents

一种掩模版传输装置及传输方法 Download PDF

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CN105988303A
CN105988303A CN201510087602.XA CN201510087602A CN105988303A CN 105988303 A CN105988303 A CN 105988303A CN 201510087602 A CN201510087602 A CN 201510087602A CN 105988303 A CN105988303 A CN 105988303A
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prealignment
platform
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CN105988303B (zh
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姜晓玉
王长刚
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to PCT/CN2016/074407 priority patent/WO2016134654A1/zh
Priority to KR1020177027074A priority patent/KR102043821B1/ko
Priority to US15/554,184 priority patent/US10095132B2/en
Priority to EP16754763.7A priority patent/EP3264178B1/en
Priority to JP2017544920A priority patent/JP6401872B2/ja
Priority to SG11201706928WA priority patent/SG11201706928WA/en
Priority to TW105105839A priority patent/TWI608307B/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741Handling masks outside exposure position, e.g. reticle libraries
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece
    • G03F9/7011Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • General Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
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  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
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Abstract

本发明公开一种掩模版传输装置,包括掩模版、掩模台以及机械手,所述机械手用于支撑和传输掩模版并将所述掩模版交接到掩模台上,其特征在于,还包括:第一组标记和第二组标记,位于所述掩模版上;预对准部件,与所述掩模台连接,用于在掩模版交接过程中探测所述第一组标记以进行第一次预对准,以及探测所述第二组标记以进行第二次预对准;控制单元,用于根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版和掩模台相撞,以及根据第二次预对准结果调整掩模版和掩模台的相对位置,使得掩模版和掩模台的相对位置在设定范围之内。与现有技术相比较,本发明避免了机械手将掩模版交接到掩模台时使掩模版的薄膜框架与掩模台的承版结构发生碰撞,保护了掩模版,提高了交接精度。

Description

一种掩模版传输装置及传输方法
技术领域
本发明涉及一种集成电路装备制造领域,尤其涉及一种保护掩模版的预对准方法。
背景技术
光刻设备是一种将掩模图案曝光成像到硅片或玻璃基板上的设备。掩模传输系统负责物料在曝光成像单元掩模台和物料接口(版盒)之间的传送,是光刻设备的重要组成部分。
掩模传输系统主要完成的功能如下:负责将未曝光的掩模版从版盒传输到掩模台上,将完成曝光的掩模版从掩模台上传输回版盒中,保证上到掩模台的掩模标记在对准系统的捕获范围内。
掩模传输系统的工作流程:版库升至版盒交接位时,版盒门打开,机械手从版盒内取出掩模版传输到预对准,先做预对准,调整好掩模台与机械手上掩模版的相对位置,然后将掩模版交接到掩模台上。
现有结构中,掩模台上的承版台的间距与掩模版的薄膜框架的距离较接近,将机械手带版进行预对准时,有部分掩模版已位于掩模台承版台之间。当机械手与掩模台间夹角过大,掩模版的薄膜框架就会与掩模台上的承版台发生碰撞,使薄膜框架受到破坏,掩模版图像因此受到污染,该掩模版即报废。
发明内容
为了克服现有技术中存在的缺陷,本发明公开一种掩模版传输装置,包括掩模版、掩模台以及机械手,所述机械手用于支撑和传输掩模版并将所述掩模版交接到掩模台上,其特征在于,还包括:第一组标记和第二组标记,位于所述掩模版上;预对准部件,与所述掩模台连接,用于在掩模版交接过程中探测所述第一组标记以进行第一次预对准,以及探测所述第二组标记以进行第二次预对准;控制单元,用于根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版和掩模台相撞,以及根据第二次预对准结果调整掩模版和掩模台的相对位置,使得掩模版和掩模台的相对位置在设定范围之内。
较优地,所述掩模版上设有薄膜框架,所述掩模台包括承版台,控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版的薄膜框架和掩模台的承版台相撞。
较优地,所述第一组标记和第二组标记位于所述掩模版的四个顶点。
本发明还公开了一种掩模版传输方法,采用上述的掩模版传输装置,其特征在于,包括以下步骤:
步骤一、所述机械手支撑和传输所述掩模版向所述掩模台交接;
步骤二、所述掩模版的第一组标记被所述预对准部件探测以进行第一次预对准;
步骤三、控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版和掩模台相撞;
步骤四、随着掩模版交接的继续,所述第二组标记被所述预对准部件探测以进行第二次预对准;
步骤五、控制单元根据第二次预对准结果调整掩模版和掩模台的相对位置,使得掩模版和掩模台的相对位置在设定范围之内。
较优地,所述掩模版上设有薄膜框架,所述掩模台包括承版台,所述步骤三中控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版的薄膜框架和掩模台的承版台相撞。
较优地,所述第一组标记和第二组标记位于所述掩模版的四个顶点。
与现有技术相比较,本发明避免了机械手将掩模版交接到掩模台时使掩模版的薄膜框架与掩模台的承版结构发生碰撞,既保护了掩模版,又提高了交接精度。
附图说明
关于本发明的优点与精神可以通过以下的发明详述及所附图式得到进一步的了解。
图1A和图1B是掩模传输设备主视图和俯视图;
图2是掩模台与掩模版示意图;
图3是掩模版预对准示意图;
图4是本发明掩模版结构示意图;
图5A和图5B是本发明掩模版预对准流程示意图。
具体实施方式
下面结合附图详细说明本发明的具体实施例。
图1是掩模传输设备结构示意图。如图1A和1B所示,掩模传输包括版库1、机械手2及预对准部件3等部件。版库1上放置多层版盒,可在垂向运动组件11的带动下,将任意层版盒运动到机械手2的取/放版位。机械手2可以在水平向沿X、Y、Rz方向做运动,亦可以做垂向运动,机械手2通过版叉21支撑和传输掩模版。掩模台4包括承版台41,承版台41用于承载掩模版。预对准部件3安装固定在掩模台4底座上。
该掩模传输设备的工作流程如下:机械手2将掩模版从版库1取出,传输到与掩模台4交接位,机械手2将掩模版运动到预对准部件3下进行预对准,然后根据预对准微调掩模台4角度,使机械手2成功将掩模版交接到掩模台4上;待掩模版用完后,机械手2负责将掩模版从掩模台4取下,传输到版库1的空版盒中。
通常,掩模版的下方或者掩模版的上下方设有薄膜框架51,如图2所示,机械手2持掩模版5做预对准时,掩模版5已有部分进入到掩模台的承版台41中。而现有掩模台的承版台41和掩模版的薄膜框架51的间距非常小,例如,承版台4的宽度为102mm,掩模版的薄膜框架51的宽度为98mm,因此在掩模版5向掩模台进行交接的过程中,掩模版下方的薄膜框架51极易与掩模台的承版台41相撞。特别是当机械手的版叉21与掩模台4的角度过大,在机械手2还没有将掩模版4的标记53传输到预对准部件3之下时,掩模版的薄膜框架51很可能已与掩模台的承版台41发生碰撞,当薄膜框架51遭到破坏后,掩模版5上的图像就会受到污染,造成掩模版5报废。
可选地,在掩模版5进行预对准时,如图3所示,需将掩模版5的标记53传输到预对准部件3的光源31与预对准部件的板卡32之间,若光源31光束通过预对准标记53,被预对准部件的板卡32接收到,表示预对准成功;若标记53不在光源31与板卡32之间,则板卡32无法接收到光源光束,则预对准不成功。
为避免薄膜框架51与掩模台4发生碰撞,本发明采用的技术方案如图4所示,掩模版5上做有两组标记52、53,可选地,两组标记52、53分别位于掩模版5的四个顶点,当机械手的版叉21承载掩模版5运动到与掩模台4进行交接的交接位时,掩模版上的两组标记,一组靠近掩模台,一组靠近机械手,本实施例中标记52位于靠近掩模台4的位置,标记53在远离掩模台4的位置,也就是说标记52的一端先靠近掩模台4。掩模版预对准流程如图5A和图5B所示,先通过掩模版5的运动,将掩模版5的标记52运动到预对准部件3下进行第一次预对准,然后控制单元通过预对准得到的偏差调整掩模台4的位置,避免掩模版5与掩模台4发生碰撞,具体地,避免掩模版5的薄膜框架51与掩模台4的承版台41发生碰撞,然后将掩模版5继续运动,直至掩模版5的标记53到达预对准位,也即预对准部件3的下方,再对标记53进行预对准,控制单元根据预对准结果微调掩模台4的位置,从而使得掩模版和掩模台的相对位置在设定范围之内,最终机械手2将掩模版5成功交接到掩模台4上。通过上述两次预对准,可以避免机械手将掩模版5交接到掩模台4时,掩模版的薄膜框架51与掩模台的承版台41发生碰撞的情况,既可以保护掩模版5,又可以提高交接精度。
本说明书中所述的只是本发明的较佳具体实施例,以上实施例仅用以说明本发明的技术方案而非对本发明的限制。凡本领域技术人员依本发明的构思通过逻辑分析、推理或者有限的实验可以得到的技术方案,皆应在本发明的范围之内。

Claims (6)

1.一种掩模版传输装置,包括掩模版、掩模台以及机械手,所述机械手用于支撑和传输掩模版并将所述掩模版交接到掩模台上,其特征在于,还包括:
第一组标记和第二组标记,位于所述掩模版上;
预对准部件,与所述掩模台连接,用于在掩模版交接过程中探测所述第一组标记以进行第一次预对准,以及探测所述第二组标记以进行第二次预对准;
控制单元,用于根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版和掩模台相撞,以及根据第二次预对准结果调整掩模版和掩模台的相对位置,使得掩模版和掩模台的相对位置在设定范围之内。
2.如权利要求1所述的掩模版传输装置,其特征在于,所述掩模版上设有薄膜框架,所述掩模台包括承版台,控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版的薄膜框架和掩模台的承版台相撞。
3.如权利要求1所述的掩模版传输装置,其特征在于,所述第一组标记和第二组标记位于所述掩模版的四个顶点。
4.一种掩模版传输方法,采用如权利要求1所述的掩模版传输装置,其特征在于,包括以下步骤:
步骤一、所述机械手支撑和传输所述掩模版向所述掩模台交接;
步骤二、所述掩模版的第一组标记被所述预对准部件探测以进行第一次预对准;
步骤三、控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版和掩模台相撞;
步骤四、随着掩模版交接的继续,所述第二组标记被所述预对准部件探测以进行第二次预对准;
步骤五、控制单元根据第二次预对准结果调整掩模版和掩模台的相对位置,使得掩模版和掩模台的相对位置在设定范围之内。
5.如权利要求4所述的掩模版传输方法,其特征在于,所述掩模版上设有薄膜框架,所述掩模台包括承版台,所述步骤三中控制单元根据第一次预对准结果调整掩模版和掩模台的相对位置,避免掩模版的薄膜框架和掩模台的承版台相撞。
6.如权利要求4所述的掩模版传输方法,其特征在于,所述第一组标记和第二组标记位于所述掩模版的四个顶点。
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