CN105979710B - 复合金属箔及其制造方法以及印刷布线板 - Google Patents

复合金属箔及其制造方法以及印刷布线板 Download PDF

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Publication number
CN105979710B
CN105979710B CN201610137357.3A CN201610137357A CN105979710B CN 105979710 B CN105979710 B CN 105979710B CN 201610137357 A CN201610137357 A CN 201610137357A CN 105979710 B CN105979710 B CN 105979710B
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China
Prior art keywords
layer
metallic material
composite metallic
carrier
transfer printing
Prior art date
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CN201610137357.3A
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English (en)
Chinese (zh)
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CN105979710A (zh
Inventor
大城行弘
白井佑季
稻守忠广
打越正巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Oike and Co Ltd
Original Assignee
Fukuda Metal Foil and Powder Co Ltd
Oike and Co Ltd
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Publication date
Application filed by Fukuda Metal Foil and Powder Co Ltd, Oike and Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Publication of CN105979710A publication Critical patent/CN105979710A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201610137357.3A 2015-03-11 2016-03-10 复合金属箔及其制造方法以及印刷布线板 Active CN105979710B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015048328A JP5859155B1 (ja) 2015-03-11 2015-03-11 複合金属箔及びその製造方法並びにプリント配線板
JP2015-048328 2015-03-11

Publications (2)

Publication Number Publication Date
CN105979710A CN105979710A (zh) 2016-09-28
CN105979710B true CN105979710B (zh) 2018-12-28

Family

ID=55301036

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CN201610137357.3A Active CN105979710B (zh) 2015-03-11 2016-03-10 复合金属箔及其制造方法以及印刷布线板

Country Status (3)

Country Link
JP (1) JP5859155B1 (ja)
CN (1) CN105979710B (ja)
TW (1) TWI660837B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017149811A1 (ja) 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
CN112969580A (zh) 2018-11-20 2021-06-15 三井金属矿业株式会社 带载体的金属箔、以及使用其的毫米波天线基板的制造方法
KR20210042141A (ko) * 2018-11-20 2021-04-16 미쓰이금속광업주식회사 적층체
CN111286736A (zh) * 2018-12-10 2020-06-16 广州方邦电子股份有限公司 一种带载体的金属箔的制备方法
CN111295055A (zh) * 2018-12-10 2020-06-16 广州方邦电子股份有限公司 一种复合金属箔的制备方法
CN110798986A (zh) * 2018-12-10 2020-02-14 广州方邦电子股份有限公司 一种带载体的金属箔
JP6786090B2 (ja) * 2019-03-11 2020-11-18 ザ グッドシステム コーポレーション 放熱板材
CN110650588A (zh) * 2019-08-01 2020-01-03 诚亿电子（嘉兴）有限公司 免更换铜箔的叠板机铜箔叠板方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101137A (ja) * 2003-09-24 2005-04-14 Hitachi Chem Co Ltd 回路形成用支持基板と、半導体素子搭載用パッケージ基板及びその製造方法
CN101827495A (zh) * 2009-03-04 2010-09-08 福田金属箔粉工业株式会社 复合金属箔及其制造方法以及印刷布线板
CN102233699A (zh) * 2010-04-29 2011-11-09 南亚塑胶工业股份有限公司 以超低棱线铜箔为载体的极薄铜箔及其制造方法
CN102555333A (zh) * 2010-11-04 2012-07-11 福田金属箔粉工业株式会社 复合金属箔、其制造方法以及印刷布线板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010012750A (ja) * 2008-07-07 2010-01-21 Nitto Denko Corp 配線回路基板用基材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101137A (ja) * 2003-09-24 2005-04-14 Hitachi Chem Co Ltd 回路形成用支持基板と、半導体素子搭載用パッケージ基板及びその製造方法
CN101827495A (zh) * 2009-03-04 2010-09-08 福田金属箔粉工业株式会社 复合金属箔及其制造方法以及印刷布线板
CN102233699A (zh) * 2010-04-29 2011-11-09 南亚塑胶工业股份有限公司 以超低棱线铜箔为载体的极薄铜箔及其制造方法
CN102555333A (zh) * 2010-11-04 2012-07-11 福田金属箔粉工业株式会社 复合金属箔、其制造方法以及印刷布线板

Also Published As

Publication number Publication date
JP2016168687A (ja) 2016-09-23
TWI660837B (zh) 2019-06-01
TW201636207A (zh) 2016-10-16
JP5859155B1 (ja) 2016-02-10
CN105979710A (zh) 2016-09-28

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