CN105899006A - Processing method of multilayer heat dissipation printed board - Google Patents
Processing method of multilayer heat dissipation printed board Download PDFInfo
- Publication number
- CN105899006A CN105899006A CN201610512954.XA CN201610512954A CN105899006A CN 105899006 A CN105899006 A CN 105899006A CN 201610512954 A CN201610512954 A CN 201610512954A CN 105899006 A CN105899006 A CN 105899006A
- Authority
- CN
- China
- Prior art keywords
- pcb
- windowing
- printed board
- sheet
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention discloses a processing method of a multilayer heat dissipation printed board. The method comprises the following steps: manufacturing a PCB; forming a window in an aluminum sheet; oxidizing the aluminum sheet; forming a window in a bonding sheet; laminating; detecting. A heat dissipation substrate is directly adhered to the printed board; heat generated by an integrated circuit and components during working is dissipated to a cold board via a main heat dissipation manner of heat transfer; the heat dissipation printed board is in direct contact with a case; the heat is finally transferred to the outside via the case so as to achieve the heat dissipation effect. With the adoption of the heat dissipation of the printed board, the heat dissipation problem is solved, so that the size stability of the printed board is ensured; the problems of thermal expansion and cold shrinkage of different materials of components on the printed board are relieved; the reliability of a complete machine and an electronic device is improved; the service lives of the complete machine and the electronic device are prolonged.
Description
Technical field
The present invention relates to PCB field, the processing side of a kind of high-layer heat radiation printed board
Method.
Background technology
Along with PCB industry towards high density, in high precision, small-sized multilamellar SMT direction continuous
Development, the increase of packing density, the installing space of components and parts is greatly decreased, components and parts power
Improving, for the rising of high-density installation with CPU use frequency, little space is high-power can not
Produce more heat with avoiding assemble, cause components and parts electric property to decline and even damage.Separately
On the one hand printed board product just develops towards high density, high precision int direction, thus it requires big merit
The printed board assembly of rate has heat dispersion and the dimensional stability of excellence.
Summary of the invention
The technical problem that present invention mainly solves is to provide the heat radiation printed board of a kind of high-layer
Processing method.
The present invention solves that the technical scheme that above-mentioned technical problem uses is:
A kind of processing method of high-layer heat radiation printed board, described method step is as follows:
A. PCB: sawing sheet is made: according to the size of required PCB, copper-clad plate cut into accordingly
The PCB substrate of size；Internal layer dry film: take light-sensitive surface, sprays required circuit diagram photosensitive
On film, then the one side with circuit diagram is close in PCB substrate, after heating, is placed in light
Under according to, it is exposed processing, after exposure, PCB substrate is placed in etching solution, after etching
Pcb board carries out moving back film and processes, and obtains the pcb board of band internal layer circuit figure；The PCB after film will be moved back
Substrate carries out melanism and brown processes；Lamination: according to the number of plies of required PCB, take Copper Foil,
The PCB substrate of respective numbers and prepreg, then put into vacuum hotpressing machine by circuit board,
Carry out laminating operation；Boring: the PCB after lamination is carried out drilling operation, then carries out chemistry
Copper thick with the plating operation of heavy copper；Outer layer dry film: take the PCB after boring, then takes light-sensitive surface, sense
The part that photosphere is blocked is the circuit diagram of PCB outer layer, removes uncured film laggard after illumination
Row pattern plating copper operates, and then carries out tin plating operation, moves back film and be placed in alkaline etching liquid,
Etching retreats stannum, completes the operation of outer layer dry film, obtains complete PCB；
B. aluminium sheet is windowed: take aluminum 12, carries out pressing operation according to actual (real) thickness demand, obtains
Meet the aluminium sheet base material of thickness requirements, then the aluminium sheet base material obtained is cut, obtain shape
The aluminium sheet that shape, size are consistent with PCB；Then aluminium sheet is carried out fenestration procedure, during fenestration procedure,
The concrete window size of each position of windowing is: the position of windowing of surface-adhered type components and parts,
Window size big 1.0mm monolateral compared with character or pad；The position of windowing of direct insertion components and parts,
Window size big 0.3mm monolateral compared with line pad；The position of windowing of reflective spot, window size
Big 0.2mm monolateral compared with anti-pad；The position of windowing of non-metallic installing hole, window size is relatively
Hole monolateral big 0.05mm；Metallizing the position of windowing of acyclic installing hole, window size is relatively
Hole monolateral big 0.1mm；
C. aluminium plate oxidation: the aluminium sheet galvanization after windowing in step b, surface of aluminum plate aoxidizes
To horniness anode oxide film, the thickness of described anode oxide film is 50-200 μm；
D. adhesive sheet is windowed: take lazy flow adhesive sheet, suppresses according to actual (real) thickness demand
Operation, obtains meeting the adhesive sheet of thickness requirements, cuts the adhesive sheet obtained, obtain
The adhesive sheet that shape, size are consistent with PCB；Then adhesive sheet is carried out fenestration procedure, window
During operation, the concrete window size of each position of windowing is: each of adhesive sheet window position with
Aluminium sheet is consistent, and the window size of each position of bonding sheet is compared with the size of the position of windowing of aluminium sheet para-position
Monolateral big 3mil；
E. pressing: take the aluminium sheet after the oxidation obtained in step c, step d the most successively
In obtain window after adhesive sheet and step a in the PCB that obtains, be placed in pressing machine
Carry out stitching operation, obtain the PCB that dispels the heat；
F. detection: the heat radiation PCB obtained in step e is placed in reflow soldering machine, first
First under conditions of temperature is 150-180 DEG C, continue 120s, be then 217-245 DEG C in temperature
Under conditions of, continue 60s；Repeat the above steps at least 4 times, if heat radiation PCB is not all layered,
The most completely dispelled the heat PCB, if layering occurs in heat radiation PCB, is then defect ware.
Further, in described step b, use drilling and milling machine that aluminium sheet is carried out fenestration procedure；Institute
State in step d, use drilling and milling machine that adhesive sheet is carried out fenestration procedure.
The invention have the benefit that
The present invention is by direct bonding heat-radiating substrate in printed board, by integrated circuit and components and parts
During work, produced heat is dispelled the heat to cold drawing by the main heat sink mode of conduction of heat, and dissipates
Hot stamping making sheet directly contacts again cabinet, and heat is transmitted to extraneous to reach scattered eventually through casing
Thermal effect.Printed board heat radiation effect is used to solve heat dissipation problem, so that printed board dimensional stability
It is guaranteed, makes the problem of expanding with heat and contract with cold of the components and parts different material in printed board be eased,
Improve complete machine and the reliability of electronic equipment and service life.
Detailed description of the invention
Below the detailed description of the invention of the present invention is further elaborated.
A kind of processing method of high-layer heat radiation printed board, described method step is as follows:
A. PCB: sawing sheet is made: according to the size of required PCB, copper-clad plate cut into accordingly
The PCB substrate of size；Internal layer dry film: take light-sensitive surface, sprays required circuit diagram photosensitive
On film, then the one side with circuit diagram is close in PCB substrate, after heating, is placed in light
Under according to, it is exposed processing, after exposure, PCB substrate is placed in etching solution, after etching
Pcb board carries out moving back film and processes, and obtains the pcb board of band internal layer circuit figure；The PCB after film will be moved back
Substrate carries out melanism and brown processes；Lamination: according to the number of plies of required PCB, take Copper Foil,
The PCB substrate of respective numbers and prepreg, then put into vacuum hotpressing machine by circuit board,
Carry out laminating operation；Boring: the PCB after lamination is carried out drilling operation, then carries out chemistry
Copper thick with the plating operation of heavy copper；Outer layer dry film: take the PCB after boring, then takes light-sensitive surface, sense
The part that photosphere is blocked is the circuit diagram of PCB outer layer, removes uncured film laggard after illumination
Row pattern plating copper operates, and then carries out tin plating operation, moves back film and be placed in alkaline etching liquid,
Etching retreats stannum, completes the operation of outer layer dry film, obtains complete PCB；
B. aluminium sheet is windowed: take aluminum 12, carries out pressing operation according to actual (real) thickness demand, obtains
Meet the aluminium sheet base material of thickness requirements, then the aluminium sheet base material obtained is cut, obtain shape
The aluminium sheet that shape, size are consistent with PCB；Then aluminium sheet is carried out fenestration procedure, during fenestration procedure,
The concrete window size of each position of windowing is: the position of windowing of surface-adhered type components and parts,
Window size big 1.0mm monolateral compared with character or pad；The position of windowing of direct insertion components and parts,
Window size big 0.3mm monolateral compared with line pad；The position of windowing of reflective spot, window size
Big 0.2mm monolateral compared with anti-pad；The position of windowing of non-metallic installing hole, window size is relatively
Hole monolateral big 0.05mm；Metallizing the position of windowing of acyclic installing hole, window size is relatively
Hole monolateral big 0.1mm；
C. aluminium plate oxidation: the aluminium sheet galvanization after windowing in step b, surface of aluminum plate aoxidizes
To horniness anode oxide film, the thickness of described anode oxide film is 50-200 μm；
D. adhesive sheet is windowed: take lazy flow adhesive sheet, suppresses according to actual (real) thickness demand
Operation, obtains meeting the adhesive sheet of thickness requirements, cuts the adhesive sheet obtained, obtain
The adhesive sheet that shape, size are consistent with PCB；Then adhesive sheet is carried out fenestration procedure, window
During operation, the concrete window size of each position of windowing is: each of adhesive sheet window position with
Aluminium sheet is consistent, and the window size of each position of bonding sheet is compared with the size of the position of windowing of aluminium sheet para-position
Monolateral big 3mil；
E. pressing: take the aluminium sheet after the oxidation obtained in step c, step d the most successively
In obtain window after adhesive sheet and step a in the PCB that obtains, be placed in pressing machine
Carry out stitching operation, obtain the PCB that dispels the heat；
F. detection: the heat radiation PCB obtained in step e is placed in reflow soldering machine, first
First under conditions of temperature is 150-180 DEG C, continue 120s, be then 217-245 DEG C in temperature
Under conditions of, continue 60s；Repeat the above steps at least 4 times, if heat radiation PCB is not all layered,
The most completely dispelled the heat PCB, if layering occurs in heat radiation PCB, is then defect ware.
In step b, use drilling and milling machine that aluminium sheet is carried out fenestration procedure；In step d, use and bore
Milling machine carries out fenestration procedure to adhesive sheet.
The present invention is by direct bonding heat-radiating substrate in printed board, by integrated circuit and components and parts
During work, produced heat is dispelled the heat to cold drawing by the main heat sink mode of conduction of heat, and dissipates
Hot stamping making sheet directly contacts again cabinet, and heat is transmitted to extraneous to reach scattered eventually through casing
Thermal effect.Printed board heat radiation effect is used to solve heat dissipation problem, so that printed board dimensional stability
It is guaranteed, makes the problem of expanding with heat and contract with cold of the components and parts different material in printed board be eased,
Improve complete machine and the reliability of electronic equipment and service life.
Claims (2)
1. the processing method of a high-layer heat radiation printed board, it is characterised in that: described method walks
Rapid as follows:
A. PCB: sawing sheet is made: according to the size of required PCB, copper-clad plate cut into accordingly
The PCB substrate of size；Internal layer dry film: take light-sensitive surface, then by tight for the one side with circuit diagram
It is attached on the light-sensitive surface of PCB substrate, is placed under illumination, be exposed processing, will after exposure
PCB substrate is placed in etching solution, and the pcb board after etching carries out moving back film and processes, and obtains band internal layer
The pcb board of circuit diagram；PCB substrate after moving back film carries out brown process；Lamination: according to institute
Need the number of plies of PCB, take Copper Foil, the PCB substrate of respective numbers and prepreg, then will
Vacuum hotpressing machine put into by circuit board, carries out laminating operation；Boring: the PCB after lamination is carried out
Drilling operation, then carries out electroless copper plating copper thick with plating operation；Outer layer dry film: after power taking plating
PCB, then takes light-sensitive surface, and the part that photosensitive layer is blocked is the circuit diagram of PCB outer layer, light
Carry out pattern plating copper operation after removing uncured film after according to, then carry out tin plating operation, move back
Film is placed in alkaline etching liquid, and etching retreats stannum, completes outer graphics operation, through welding resistance
Coating, position coating surface process, molding and test to be welded obtain complete PCB；
B. aluminium sheet is windowed: take aluminum 12, carries out pressing operation according to actual (real) thickness demand, obtains
Meet the aluminium sheet base material of thickness requirements, then the aluminium sheet base material obtained is cut, obtain shape
The aluminium sheet that shape, size are consistent with PCB；Then aluminium sheet is carried out fenestration procedure, during fenestration procedure,
The concrete window size of each position of windowing is: the position of windowing of surface-adhered type components and parts,
Window size big 1.0mm monolateral compared with character or pad；The position of windowing of direct insertion components and parts,
Window size big 0.3mm monolateral compared with line pad；The position of windowing of reflective spot, window size
Big 0.2mm monolateral compared with anti-pad；The position of windowing of non-metallic installing hole, window size is relatively
Hole monolateral big 0.05mm；Metallizing the position of windowing of acyclic installing hole, window size is relatively
Hole monolateral big 0.1mm；
C. aluminium plate oxidation: the aluminium sheet galvanization after windowing in step b, surface of aluminum plate aoxidizes
To horniness anode oxide film, the thickness of described anode oxide film is 50-200 μm；
D. adhesive sheet is windowed: take lazy flow adhesive sheet, suppresses according to actual (real) thickness demand
Operation, obtains meeting the adhesive sheet of thickness requirements, cuts the adhesive sheet obtained, obtain
The adhesive sheet that shape, size are consistent with PCB；Then adhesive sheet is carried out fenestration procedure, window
During operation, the concrete window size of each position of windowing is: each of adhesive sheet window position with
Aluminium sheet is consistent, and the window size of each position of bonding sheet is compared with the size of the position of windowing of aluminium sheet para-position
Monolateral big 3mil；
E. pressing: take the aluminium sheet after the oxidation obtained in step c, step d the most successively
In obtain window after adhesive sheet and step a in the PCB that obtains, be placed in pressing machine
Carry out stitching operation, obtain the PCB that dispels the heat；
F. detection: the heat radiation PCB obtained in step e is placed in reflow soldering machine, first
First under conditions of temperature is 150-180 DEG C, continue 120s, be then 217-245 DEG C in temperature
Under conditions of, continue 60s；Repeat the above steps at least 4 times, if heat radiation PCB is not all layered,
The most completely dispelled the heat PCB, if layering occurs in heat radiation PCB, is then defect ware.
The processing method of high-layer the most according to claim 2 heat radiation printed board, its feature
It is: in described step b, uses drilling and milling machine that aluminium sheet is carried out fenestration procedure；Described step d
In, use drilling and milling machine that adhesive sheet is carried out fenestration procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512954.XA CN105899006A (en) | 2016-06-30 | 2016-06-30 | Processing method of multilayer heat dissipation printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512954.XA CN105899006A (en) | 2016-06-30 | 2016-06-30 | Processing method of multilayer heat dissipation printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105899006A true CN105899006A (en) | 2016-08-24 |
Family
ID=56718576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610512954.XA Pending CN105899006A (en) | 2016-06-30 | 2016-06-30 | Processing method of multilayer heat dissipation printed board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105899006A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598505A (en) * | 2017-10-31 | 2018-01-19 | 无锡市五十五度科技有限公司 | A kind of processing technology of circuit board heat dissipation cold plate |
| CN110572967A (en) * | 2019-10-09 | 2019-12-13 | 河源沃图电子科技有限公司 | Production method of circuit board for severe environment |
| CN113423186A (en) * | 2021-06-23 | 2021-09-21 | 浙江德加电子科技有限公司 | Processing technology of high-heat-conductivity aluminum substrate |
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|---|---|---|---|---|
| JP2705689B2 (en) * | 1996-04-12 | 1998-01-28 | 三菱マテリアル株式会社 | Method of manufacturing lightweight substrate for semiconductor device |
| CN102612261A (en) * | 2011-11-20 | 2012-07-25 | 葛豫卿 | High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board |
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN103025063A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board machining process capable of preventing oil overflowing |
| CN103547066A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Heat-dissipating aluminum-based circuit board |
| CN105530757A (en) * | 2014-09-29 | 2016-04-27 | 深圳崇达多层线路板有限公司 | Aluminum-based flexible circuit board manufacturing method |
-
2016
- 2016-06-30 CN CN201610512954.XA patent/CN105899006A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2705689B2 (en) * | 1996-04-12 | 1998-01-28 | 三菱マテリアル株式会社 | Method of manufacturing lightweight substrate for semiconductor device |
| CN102612261A (en) * | 2011-11-20 | 2012-07-25 | 葛豫卿 | High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board |
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN103547066A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Heat-dissipating aluminum-based circuit board |
| CN103025063A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board machining process capable of preventing oil overflowing |
| CN105530757A (en) * | 2014-09-29 | 2016-04-27 | 深圳崇达多层线路板有限公司 | Aluminum-based flexible circuit board manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107598505A (en) * | 2017-10-31 | 2018-01-19 | 无锡市五十五度科技有限公司 | A kind of processing technology of circuit board heat dissipation cold plate |
| CN107598505B (en) * | 2017-10-31 | 2019-07-05 | 无锡市五十五度科技有限公司 | A kind of processing technology of circuit board heat dissipation cold plate |
| CN110572967A (en) * | 2019-10-09 | 2019-12-13 | 河源沃图电子科技有限公司 | Production method of circuit board for severe environment |
| CN113423186A (en) * | 2021-06-23 | 2021-09-21 | 浙江德加电子科技有限公司 | Processing technology of high-heat-conductivity aluminum substrate |
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Application publication date: 20160824 |
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