CN107598505A - A kind of processing technology of circuit board heat dissipation cold plate - Google Patents
A kind of processing technology of circuit board heat dissipation cold plate Download PDFInfo
- Publication number
- CN107598505A CN107598505A CN201711047296.2A CN201711047296A CN107598505A CN 107598505 A CN107598505 A CN 107598505A CN 201711047296 A CN201711047296 A CN 201711047296A CN 107598505 A CN107598505 A CN 107598505A
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- Prior art keywords
- heat dissipation
- cold plate
- dissipation cold
- aluminium sheet
- circuit board
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of processing technology of circuit board heat dissipation cold plate, comprises the following steps：A, selection；B, clean；C, deburring；D, overlay film；E, clamping；F, process；G, polishing is examined；H, surface oxidation treatment.A kind of circuit board uses aluminium sheet as raw material with the processing technology of heat dissipation cold plate, the techniques such as cleaned, deburring, overlay film, clamping, processing, inspection polishing, surface oxidation treatment, the heat dissipation cold plate quality produced is more stable, the occurrence rate for the problems such as circle is lost in warpage, processing is greatly reduced, and it can once realize the processing of polylith heat dissipation cold plate, compared to traditional processing mode, its processing efficiency improves 8~10 times.
Description
Technical field
The present invention relates to art of printed circuit boards, more particularly to a kind of processing technology of circuit board heat dissipation cold plate.
Background technology
Heat dissipation cold plate is a kind of using plane thin aluminum sheet as material machine-shaping, is then bonded with circuit board, to electronic device
Carry out the product of heat loss through conduction.At present, after production heat dissipation cold plate carries out clamping using frock clamp in industry, the work in-process heart enters
Row bores miller skill, however, existing heat dissipation cold plate carries out clamping using vice, pressing plate etc. more, and is limited to machining center flat surface
Long-pending, it is difficult to accomplish being produced in batches to heat dissipation cold plate for high efficiency high-quality, there are needs and frequently change clamping position, add in it
Engineering sequence is cumbersome and the problem of warpage, deformation easily occurs in the heat dissipation cold plate of processing.
The content of the invention
It is an object of the invention in view of the above-mentioned problems, a kind of processing technology of circuit board heat dissipation cold plate is provided, with solution
Certainly existing heat dissipation cold plate is difficult to produce in batches, and processing efficiency is low, easily occurs the problem of warpage, deformation after processing.
The purpose of the present invention is to be achieved through the following technical solutions：
A kind of processing technology of circuit board heat dissipation cold plate, comprises the following steps：
A, selection：The aluminium sheet of respective thickness is selected as raw material by the thickness requirement of heat dissipation cold plate；
B, clean：Aluminium sheet is cleaned to remove the greasy dirt of surface of aluminum plate；
C, deburring：Remove the outer peripheral burr of aluminium sheet and overlap；
D, overlay film：Plastic film is pasted on a side end face of aluminium sheet, and ensures bubble-free between plastic film and aluminium sheet；
E, clamping：The side end face that aluminium sheet is covered with to plastic film is placed on vacuum absorbing platform, with negative-pressure adsorption；
F, process：Brill Milling Machining is carried out to aluminium sheet, and cuts off segmentation to form polylith heat dissipation cold plate, it is strict in process
The lower knife depth of control, avoids plastic film from occurring a large amount of damaged；
G, polishing is examined：The heat dissipation cold plate of machine-shaping to be tested, it is ensured that heat dissipation cold plate is of the required size, and
Ensure the hole machined on heat dissipation cold plate in place and hole is of the required size, and check the flatness of heat dissipation cold plate simultaneously；Inspection
After the completion of testing, polishing is carried out to heat dissipation cold plate surface up to bright, to remove surface oxide layer；
H, surface oxidation treatment：Hard anodizing processing is carried out to heat dissipation cold plate, its surface is formed oxide-film.
As a preferred embodiment of the present invention, the thickness of plastic film is 0.18mm~0.20mm in step d.
As a preferred embodiment of the present invention, the thickness of oxide-film is 30um~50um in step h.
As a preferred embodiment of the present invention, brill Milling Machining is carried out using carving machine in step f.
Beneficial effects of the present invention are that a kind of circuit board uses aluminium sheet as former material with the processing technology of heat dissipation cold plate
The technique such as material, cleaned, deburring, overlay film, clamping, processing, inspection polishing, surface oxidation treatment, the heat dissipation cold plate produced
Quality is more stable, and the present invention uses vacuum absorbing platform clamping monoblock aluminium sheet, has a distinct increment, keeps away in processing reliability
Exempt from heat dissipation cold plate and occur situations such as warpage, hole machined mistake circle and processing lines are not in place because of clamping problem, at the same time, adopt
Clamping is carried out with vacuum absorbing platform, can once realize the processing of polylith heat dissipation cold plate, compared to traditional processing mode, its
Processing efficiency improves 8~10 times, in addition, the use of plastic film, can further lift process reliability.
Embodiment
Technical scheme is further illustrated below by embodiment.It is understood that this place
The embodiment of description is used only for explaining the present invention, rather than limitation of the invention.
In the present embodiment, a kind of processing technology of circuit board heat dissipation cold plate, comprise the following steps：
A, selection：The aluminium sheet of respective thickness is selected as raw material by the thickness requirement of heat dissipation cold plate；
B, clean：Aluminium sheet is cleaned to remove the greasy dirt of surface of aluminum plate；
C, deburring：Remove the outer peripheral burr of aluminium sheet and overlap；
D, overlay film：Plastic film is pasted on a side end face of aluminium sheet, and ensures bubble-free between plastic film and aluminium sheet, it is described
The thickness of plastic film is 0.19mm；
E, clamping：The side end face that aluminium sheet is covered with to plastic film is placed on vacuum absorbing platform, with negative pressure (-
0.08Mpa) adsorb；
F, process：Brill Milling Machining is carried out to aluminium sheet using carving machine, and cuts off segmentation to form polylith heat dissipation cold plate, is processed
During the strict lower knife depth of control, avoid plastic film from occurring a large amount of damaged；
G, polishing is examined：The heat dissipation cold plate of machine-shaping to be tested, it is ensured that heat dissipation cold plate is of the required size, and
Ensure the hole machined on heat dissipation cold plate in place and hole is of the required size, and check the flatness of heat dissipation cold plate simultaneously；Inspection
After the completion of testing, polishing is carried out to heat dissipation cold plate surface up to bright, to remove surface oxide layer；
H, surface oxidation treatment：Hard anodizing processing is carried out to heat dissipation cold plate, its surface is formed oxide-film, oxidation
The thickness of film is 40um.
Although it is noted that in the present embodiment, the thickness of plastic film is 0.19mm, the invention is not restricted to this,
The thickness of plastic film can also be for 0.18mm or 0.20mm or positioned at any value between the two, and the present embodiment is to combine cost
And the preferred scheme after adsorption effect.
Although it is noted that in the present embodiment, the thickness of oxide-film is 40um, the invention is not restricted to this, oxygen
The thickness for changing film can also be for 30um or 50um or positioned at any value between the two, and the present embodiment is to combine cost and insulation
Preferred scheme after performance, anti-wear performance, corrosion resistance, heat dispersion.
Although it is noted that in the present embodiment, plastic film only is pasted on a side end face of aluminium sheet, it is of the invention
Not limited to this, plastic film also can be pasted on the both sides end face of aluminium sheet, and then the reliability of postorder processing can be improved.
The heat dissipation cold plate quality that a kind of above-mentioned circuit board is produced with the processing technology of heat dissipation cold plate is more stable, warpage,
The occurrence rate that the problems such as circle is lost in processing is greatly reduced, and compared to using conventional brace work in-process, face processes at heart, the present invention
Whole aluminium sheet is processed after being adsorbed by vacuum absorbing platform, and clamped one time can complete whole processing, can once realize
The processing of polylith heat dissipation cold plate, compared to traditional processing mode, its processing efficiency improves 8~10 times, in processing efficiency
There is great lifting.
Above example is to elaborate the general principle and characteristic of the present invention, and the present invention is not limited by above-described embodiment,
Without departing from the spirit and scope of the present invention, the present invention also has various change and change, and these changes and modifications all fall
Enter in scope of the claimed invention.The claimed scope of the invention is defined by the following claims.
Claims (4)
- A kind of 1. processing technology of circuit board heat dissipation cold plate, it is characterised in that：Comprise the following steps：A, selection：The aluminium sheet of respective thickness is selected as raw material by the thickness requirement of heat dissipation cold plate；B, clean：Aluminium sheet is cleaned to remove the greasy dirt of surface of aluminum plate；C, deburring：Remove the outer peripheral burr of aluminium sheet and overlap；D, overlay film：Plastic film is pasted on a side end face of aluminium sheet, and ensures bubble-free between plastic film and aluminium sheet；E, clamping：The side end face that aluminium sheet is covered with to plastic film is placed on vacuum absorbing platform, with negative-pressure adsorption；F, process：Brill Milling Machining is carried out to aluminium sheet, and cuts off segmentation to form polylith heat dissipation cold plate, is strictly controlled in process Lower knife depth, plastic film is avoided to occur a large amount of damaged；G, polishing is examined：The heat dissipation cold plate of machine-shaping is tested, it is ensured that heat dissipation cold plate is of the required size, and ensures Hole machined on heat dissipation cold plate is in place and hole is of the required size, and checks the flatness of heat dissipation cold plate simultaneously；Inspect Cheng Hou, polishing is carried out to heat dissipation cold plate surface up to bright, to remove surface oxide layer；H, surface oxidation treatment：Hard anodizing processing is carried out to heat dissipation cold plate, its surface is formed oxide-film.
- A kind of 2. processing technology of circuit board heat dissipation cold plate according to claim 1, it is characterised in that：Moulded in step d The thickness of glued membrane is 0.18mm~0.20mm.
- A kind of 3. processing technology of circuit board heat dissipation cold plate according to claim 1, it is characterised in that：Oxygen in step h The thickness for changing film is 30um~50um.
- A kind of 4. processing technology of circuit board heat dissipation cold plate according to claim 1, it is characterised in that：Adopted in step f Brill Milling Machining is carried out with carving machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047296.2A CN107598505B (en) | 2017-10-31 | 2017-10-31 | A kind of processing technology of circuit board heat dissipation cold plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711047296.2A CN107598505B (en) | 2017-10-31 | 2017-10-31 | A kind of processing technology of circuit board heat dissipation cold plate |
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| CN107598505A true CN107598505A (en) | 2018-01-19 |
| CN107598505B CN107598505B (en) | 2019-07-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110879083A (en) * | 2019-12-17 | 2020-03-13 | 无锡市五十五度科技有限公司 | Cold plate inspection method |
| CN110913594A (en) * | 2019-12-17 | 2020-03-24 | 无锡市五十五度科技有限公司 | Method for connecting heat dissipation plate and welded printed board |
| CN111081162A (en) * | 2020-01-07 | 2020-04-28 | 深圳市丽晶光电科技股份有限公司 | Process for solving flatness of display screen module |
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|---|---|---|---|---|
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
| CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
| EP2662656A1 (en) * | 2012-05-07 | 2013-11-13 | Janusz Wójcik | Method of construction of a radiator |
| CN105899006A (en) * | 2016-06-30 | 2016-08-24 | 广德宝达精密电路有限公司 | Processing method of multilayer heat dissipation printed board |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN107159971A (en) * | 2017-06-19 | 2017-09-15 | 济南微尔激光设备有限公司 | A kind of aluminium sheet cutting machine |
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2017
- 2017-10-31 CN CN201711047296.2A patent/CN107598505B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
| CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
| EP2662656A1 (en) * | 2012-05-07 | 2013-11-13 | Janusz Wójcik | Method of construction of a radiator |
| CN105899006A (en) * | 2016-06-30 | 2016-08-24 | 广德宝达精密电路有限公司 | Processing method of multilayer heat dissipation printed board |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN107159971A (en) * | 2017-06-19 | 2017-09-15 | 济南微尔激光设备有限公司 | A kind of aluminium sheet cutting machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110879083A (en) * | 2019-12-17 | 2020-03-13 | 无锡市五十五度科技有限公司 | Cold plate inspection method |
| CN110913594A (en) * | 2019-12-17 | 2020-03-24 | 无锡市五十五度科技有限公司 | Method for connecting heat dissipation plate and welded printed board |
| CN111081162A (en) * | 2020-01-07 | 2020-04-28 | 深圳市丽晶光电科技股份有限公司 | Process for solving flatness of display screen module |
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| Publication number | Publication date |
|---|---|
| CN107598505B (en) | 2019-07-05 |
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