CN105895777A - LED integrated light source packaging method and LED integrated light source - Google Patents
LED integrated light source packaging method and LED integrated light source Download PDFInfo
- Publication number
- CN105895777A CN105895777A CN201410673416.XA CN201410673416A CN105895777A CN 105895777 A CN105895777 A CN 105895777A CN 201410673416 A CN201410673416 A CN 201410673416A CN 105895777 A CN105895777 A CN 105895777A
- Authority
- CN
- China
- Prior art keywords
- positive
- blue chip
- blue light
- led
- led integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of LED packaging, and discloses an LED integrated light source packaging method. The packaging method comprises the specific steps that blue light chips are fixed on an aluminum substrate according to a parallel-series connection mode of a required circuit, wherein positive and negative electrodes of the blue light chips correspond to positive and negative electrodes of the aluminum substrate respectively; the positive and negative electrodes of the blue light chips are connected with the positive and negative electrodes of the aluminum substrate by gold wires; the blue light chips are covered and protected by transparent silica gel; and a transparent ceramic fluorescent sheet covers the blue light chips packaged with the transparent silica gel so as to complete packaging. According to the invention, the transparent ceramic fluorescent sheet is utilized to stimulate the blue light chips to emit white light, which is different from a traditional method in which fluorescent powder is utilized to generate white light. The LED integrated light source manufactured according to the method provided by the invention has good effects in heat conduction, color drift stability and luminous efficiency, and the application range and the use convenience of an LED are improved.
Description
Technical field
The invention belongs to LED encapsulation technology field, relate to one and utilize crystalline ceramics flourescent sheet to excite blue light core
Sheet sends the LED integrated optical source method for packing of white light, and utilizes the LED integrated optical source that the method produces.
Background technology
More and more extensive now with LED white applications, in the industry cycle LED encapsulation technology research is also got over by everybody
Come the most, but at present encapsulation technology heat conduction, color drift stability, light efficiency the most all exist some defects or
Person does not reaches use requirement, and outlet is American-European, Japanese, Korea S faces white light patent fort, studies for this
More advanced LED encapsulation technology, does not use the white light encapsulation technology of fluorescent material.
Summary of the invention
Present invention aims to the deficiency of existing LED encapsulation technology, it is provided that one utilizes crystalline ceramics glimmering
Mating plate excites blue chip to send LED integrated optical source method for packing and the LED integrated optical source of white light.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of LED integrated optical source method for packing, this method for packing includes step in detail below:
(1), blue chip is consolidated on aluminium base according to the also series system of required circuit, blue chip
Both positive and negative polarity is corresponding with aluminium base both positive and negative polarity；
(2), respectively blue chip both positive and negative polarity is connected with aluminium base both positive and negative polarity with gold thread；
(3), by transparent silica gel, blue chip is packaged；
(4), crystalline ceramics flourescent sheet covering has on the blue chip of transparent silica gel in envelope, completes encapsulation.
Present invention also offers a kind of LED integrated optical source, glimmering including aluminium base, blue chip, crystalline ceramics
Mating plate, described aluminium base has both positive and negative polarity, and described blue chip both positive and negative polarity is by gold thread respectively with aluminium base just
Negative pole connects, and described blue chip is provided with crystalline ceramics flourescent sheet.
Beneficial effects of the present invention: the present invention utilizes crystalline ceramics flourescent sheet to excite blue chip to send white light,
Being different from traditional method utilizes fluorescent material to produce white light.The LED that the method provided by the present invention is made is integrated
Light source has effect well at heat conduction, color drift stability, light efficiency, improves range of application and the use of LED
Convenient performance.
Accompanying drawing explanation
For the ease of it will be appreciated by those skilled in the art that the present invention is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the present invention；
Fig. 2 is crystalline ceramics flourescent sheet schematic diagram of the present invention.
In figure: 1, gold thread, 2, aluminium base, 3, blue chip, 4, crystalline ceramics flourescent sheet.
Detailed description of the invention
Embodiment 1
As depicted in figs. 1 and 2, a kind of LED integrated optical source, including aluminium base 2, blue chip 3, transparent
Ceramic fluorescent sheet 4, aluminium base 2 has both positive and negative polarity.Three blue chip groups are arranged in parallel, each blue chip
Group is in series by ten blue chips 3, blue chip 3 both positive and negative polarity by gold thread 1 respectively with aluminium base 2
Both positive and negative polarity connects, and blue chip 3 is provided with crystalline ceramics flourescent sheet 4.
The invention provides a kind of LED integrated optical source method for packing, including step in detail below:
As depicted in figs. 1 and 2, three blue chip groups being arranged in parallel, each blue chip group is by ten
Blue chip 3 is in series, and three blue chip groups are solid on aluminium base 2, blue chip 3 both positive and negative polarity with
Aluminium base 2 both positive and negative polarity is corresponding；With gold thread 1 respectively blue chip 3 both positive and negative polarity and aluminium base 2 both positive and negative polarity
It is connected；Again by transparent silica gel blue chip 3 covering protection；Finally crystalline ceramics flourescent sheet 4 is covered
Envelope has on the blue chip 3 of transparent silica gel, completes encapsulation.
By the method for the invention compared with traditional method, following Tables 1 and 2:
By upper table 1, tradition LED fluorescent powder produces 60W integrated optical source test data, and light efficiency is basic
At 100-110lm/W, and ceramic phosphor of the present invention produces 60W integrated optical source test data, and light efficiency is basic
At 140-150lm/W.The present invention utilizes crystalline ceramics flourescent sheet 4 to excite blue chip 3 to send white light, different
Utilize fluorescent material to produce white light in traditional method.The LED Integrated Light that the method provided by the present invention is made
Source has effect well at heat conduction, color drift stability, light efficiency.
Above content is only citing made for the present invention and explanation, affiliated those skilled in the art
Described specific embodiment is made various amendment or supplements or use similar mode to substitute, as long as
Without departing from inventing or surmounting scope defined in the claims, protection scope of the present invention all should be belonged to.
Claims (2)
1. a LED integrated optical source method for packing, it is characterised in that this method for packing includes walking in detail below
Rapid:
(1), blue chip is consolidated on aluminium base according to the also series system of required circuit, blue chip
Both positive and negative polarity is corresponding with aluminium base both positive and negative polarity；
(2), respectively blue chip both positive and negative polarity is connected with aluminium base both positive and negative polarity with gold thread；
(3), by transparent silica gel blue chip covering protection；
(4), crystalline ceramics flourescent sheet covering has on the blue chip of transparent silica gel in envelope, completes encapsulation.
2. a LED integrated optical source, including aluminium base, blue chip, crystalline ceramics flourescent sheet, described aluminum
Substrate has both positive and negative polarity, it is characterised in that described blue chip both positive and negative polarity is by gold thread respectively with aluminium base just
Negative pole connects, and described blue chip is provided with crystalline ceramics flourescent sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410673416.XA CN105895777A (en) | 2014-11-21 | 2014-11-21 | LED integrated light source packaging method and LED integrated light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410673416.XA CN105895777A (en) | 2014-11-21 | 2014-11-21 | LED integrated light source packaging method and LED integrated light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895777A true CN105895777A (en) | 2016-08-24 |
Family
ID=56698490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410673416.XA Pending CN105895777A (en) | 2014-11-21 | 2014-11-21 | LED integrated light source packaging method and LED integrated light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105895777A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070241661A1 (en) * | 2006-04-12 | 2007-10-18 | Yin Chua B | High light output lamps having a phosphor embedded glass/ceramic layer |
| CN101697367A (en) * | 2009-09-30 | 2010-04-21 | 烁光特晶科技有限公司 | Method for preparing LED by using transparent ceramics |
| CN201766096U (en) * | 2010-07-20 | 2011-03-16 | 中国科学院上海硅酸盐研究所 | Packaging structure of white-light LED |
| CN202049951U (en) * | 2010-12-14 | 2011-11-23 | 黄金鹿 | Transparent fluorescent ceramic integrated high-power LED light source |
| CN202797057U (en) * | 2012-03-22 | 2013-03-13 | 曹永革 | Double-transparent-face ceramic white-light LED packaging structure |
| CN202855796U (en) * | 2012-03-22 | 2013-04-03 | 曹永革 | Transparent ceramic white light LED packaging structure |
-
2014
- 2014-11-21 CN CN201410673416.XA patent/CN105895777A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070241661A1 (en) * | 2006-04-12 | 2007-10-18 | Yin Chua B | High light output lamps having a phosphor embedded glass/ceramic layer |
| CN101697367A (en) * | 2009-09-30 | 2010-04-21 | 烁光特晶科技有限公司 | Method for preparing LED by using transparent ceramics |
| CN201766096U (en) * | 2010-07-20 | 2011-03-16 | 中国科学院上海硅酸盐研究所 | Packaging structure of white-light LED |
| CN202049951U (en) * | 2010-12-14 | 2011-11-23 | 黄金鹿 | Transparent fluorescent ceramic integrated high-power LED light source |
| CN202797057U (en) * | 2012-03-22 | 2013-03-13 | 曹永革 | Double-transparent-face ceramic white-light LED packaging structure |
| CN202855796U (en) * | 2012-03-22 | 2013-04-03 | 曹永革 | Transparent ceramic white light LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105720166A (en) | White-light LED chip preparation method | |
| CN204026264U (en) | High thermally conductive LED 360 ° of light-emitting filament bulbs | |
| CN104078548A (en) | Full-angle light-emitting LED white light source and manufacturing method thereof | |
| CN103700651A (en) | High-color rendering LED lamp filament | |
| CN102102862A (en) | Method for packing micro-volume multi-LED (Light-Emitting Diode) integrated unit and method for packing electrodes thereof | |
| CN104347606A (en) | Light emitting diode packaging structure and light source module | |
| CN203205454U (en) | Package structure of LED light source | |
| CN105895777A (en) | LED integrated light source packaging method and LED integrated light source | |
| CN203406333U (en) | LED packaging structure | |
| CN202938048U (en) | White-light LED bulb lamp structure with transparent ceramic package | |
| CN201717286U (en) | Led light source module packaging structure | |
| CN204045589U (en) | A kind of LED-COB light source | |
| CN203477964U (en) | LED area light source lamp emitting light by 360 degrees | |
| CN105280627B (en) | Light source module group and its method for packing and the lighting device with the light source module group | |
| CN103075667A (en) | Full-angle light emitting diode (LED) light source body and production process for same | |
| CN204026266U (en) | Abnormity 360 ° of emitting bulbs | |
| CN203553164U (en) | High color rendering led filament | |
| CN202855796U (en) | Transparent ceramic white light LED packaging structure | |
| CN203733838U (en) | Full-angle light-emitting packaged LED (light-emitting diode) | |
| CN203850333U (en) | Full-angle luminous LED white light source | |
| CN201601149U (en) | LED packaging structure | |
| CN205050873U (en) | Exchange LED light source | |
| CN204391154U (en) | A kind of LED light source of high-luminous-efficiency | |
| CN103618039A (en) | Method for packaging LED light source with 360-degree light-emitting angle | |
| CN104241495A (en) | LED capable of emitting light from both faces and manufacturing process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |
|
| WD01 | Invention patent application deemed withdrawn after publication |