CN201766096U - Packaging structure of white-light LED - Google Patents
Packaging structure of white-light LED Download PDFInfo
- Publication number
- CN201766096U CN201766096U CN2010202642096U CN201020264209U CN201766096U CN 201766096 U CN201766096 U CN 201766096U CN 2010202642096 U CN2010202642096 U CN 2010202642096U CN 201020264209 U CN201020264209 U CN 201020264209U CN 201766096 U CN201766096 U CN 201766096U
- Authority
- CN
- China
- Prior art keywords
- pedestal
- transparent ceramic
- light led
- blue
- white light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model relates to a packaging structure of a white-light LED, which is characterized in that the packaging structure comprises a pedestal with two electrode sheets, a blue-light LED chip and a transparent ceramic cover, wherein the blue-light LED chip is fixed inside the pedestal; the anode and the cathode of the blue-light LED chip are electrically connected with the two electrode sheets respectively; and the transparent ceramic cover encloses the pedestal and adheres to the pedestal. Compared with the prior art, the packaging structure doesn't contain the fluorescent powder layer or the fluorescent glue layer, and the packaging process is simple. Besides, the transparent cover serving as a housing is made of transparent ceramic fluorescent material, so as to greatly improve the light transmittance and temperature resistance. Therefore, with the packaging structure, the high-power white-light LED has the advantages of less light attenuation, uniform illumination, high light efficiency, long service life, high reliability and the like.
Description
Technical field
The utility model relates to a kind of encapsulating structure of white light LEDs, and the white light LEDs that contains this encapsulating structure, belongs to LED encapsulation technology field.
Background technology
As the 4th generation lighting source, white light LEDs is the emerging product of LED that is expected most, has huge development potentiality in illumination market.The white light LEDs solid state light emitter has advantages such as volume is little, caloric value is low, power consumption is little, the life-span is long, reaction speed is fast, environmental protection, is regarded as the rising star of " green illumination light source ".
Influencing one of key reason that white light LEDs enters illumination market comprehensively is that LED packaging technology and technology are still immature.High-power LED encapsulation is because structure and complex process, and directly has influence on serviceability and the life-span of LED, is hot research in recent years always, and particularly the focus in the focus is studied in the large power white light LED encapsulation especially.
At present, the large power white light LED structure of stapleization comprises pedestal, InGaN chip, electrode, nontransparent fluorescent material and optical lens.Used fluorescent material adopts fluorescent glue encapsulation, fixing in the encapsulating structure.The part blue light that the InGaN chip sends excites the yellow fluorescence bisque, makes it send sodium yellow (peak value is 555nm); Part blue light directly or after the reflection outwards sends, and mixes the formation white light with the sodium yellow that fluorescent material sends.Because the refractive index of large power white light LED chip is far above the refractive index of encapsulating material, the light that sends when chip is during through encapsulating material, total reflection effect takes place at the interface at the two, cause about 50% light reflected back chip internal effectively to derive, adopt optical lens package, can reduce light swashing the loss of penetrating in the process, improve light extraction efficiency.But the shortcoming that above-mentioned encapsulating structure exists is that temperature is very big to the performance impact of fluorescent material.Along with temperature rises, the fluorescent material quantum efficiency reduces, and bright dipping reduces, thereby radiation wavelength also can change and causes the variation of white light LEDs colour temperature, colourity.In addition, the fluorescent glue heat dispersion is relatively poor, easily take place to wear out, and the thermal stability of fluorescent glue also has problems under the high temperature.
For common white light LEDs, high-power (w level power) white light LEDs has higher power and bigger caloric value, in encapsulation process, need take all factors into consideration many-sided factors such as light, electricity, heat.In order to reduce packaging thermal resistance effectively, improve light extraction efficiency, must adopt the brand-new technology thinking to carry out package design.
The utility model content
The purpose of this utility model is to provide a kind of White-light LED package structure with transparent ceramic cover body at large power white light LED encapsulation light decay height in the prior art, shortcoming that luminous efficiency is low.
Another purpose of the present utility model also is to provide a kind of white light LEDs that adopts White-light LED package structure.
The technical solution adopted in the utility model is: a kind of encapsulating structure of white light LEDs is characterized in that: comprise pedestal, blue-light LED chip and transparent ceramic cover body that two plate electrodes are installed; Described blue-light LED chip is fixed in the pedestal, and the positive and negative polarities of blue-light LED chip are electrically connected with described two plate electrode sheets respectively, and described transparent ceramic cover body covers described pedestal and bonding with pedestal.
Preferable, described transparent ceramic cover body is solid sphere lens-type.
Preferable, described transparent ceramic cover body is hollow sphere lens-type.
In the above-mentioned encapsulating structure, do not contain phosphor powder layer and fluorescence glue-line between described blue-light LED chip and the transparent ceramic cover body.
The invention also discloses a kind of white light LEDs, the encapsulating structure of described white light LEDs is the encapsulating structure of above-mentioned white light LEDs.
Compare with the conventional package structure, do not contain phosphor powder layer and fluorescence glue-line in the encapsulating structure provided by the utility model, packaging technology is simple; In addition, the transparent ceramic fluorescent material is made lens case, improved light transmission rate and resisting temperature performance greatly.Therefore, the large power white light LED that adopts this encapsulating structure to obtain has that light decay is low, luminous evenly, light efficiency is high, the life-span is long, the reliability advantages of higher.
Description of drawings
Fig. 1 is a White-light LED package structure schematic cross-section of the present utility model.
Fig. 2 is solid sphere lens-type transparent ceramic cover body schematic cross-section.
Fig. 3 is hollow sphere lens-type transparent ceramic cover body schematic cross-section.
Embodiment
Further set forth the utility model below in conjunction with specific embodiment, should be understood that these embodiment only be used to the utility model is described and be not used in the restriction protection range of the present utility model.
Fig. 1 is a White-light LED package structure schematic cross-section of the present utility model, and the encapsulating structure of a kind of white light LEDs of the present utility model comprises pedestal 1, blue-light LED chip 2 and transparent ceramic cover body 5 that two plate electrodes 4 are installed as shown in the figure; Blue-light LED chip 2 is fixed in the pedestal 1, and the positive and negative polarities of blue-light LED chip 2 are electrically connected with two plate electrode sheets 4 respectively, and transparent ceramic cover body 5 covers pedestal 1 and bonding with pedestal 1.
Shown in Figure 2, transparent ceramic cover body 5 is solid sphere lens-type.
Shown in Figure 3, transparent ceramic cover body 5 is hollow sphere lens-type.
In above-mentioned encapsulating structure, do not contain phosphor powder layer and fluorescence glue-line in the space between blue-light LED chip 2 and the transparent ceramic cover body 5.
The encapsulating structure of above-mentioned white light LEDs of the present utility model can adopt following integrated method for packing:
1) exposed blue-light LED chip is fixed in the pedestal that two plate electrode sheets are housed;
2) bonding wire is electrically connected the both positive and negative polarity of led chip respectively with two plate electrode sheets;
3) make lens-type transparent ceramic cover body cover described pedestal and bonding with pedestal;
4) baking makes above-mentioned parts fixed-type.
The material of transparent ceramic cover body 5 is the transparent ceramic fluorescent material that is subjected to can launch after blue-light excited sodium yellow, as can being that general formula is M
3-xCe
xAl
5O
12Ceramic material, wherein M is selected from a kind of among Y, Lu or the Tb, 0＜x≤0.15.This transparent ceramic material sends sodium yellow after absorbing the part blue light that led chip sends, and can obtain the high-purity white light after the blue light.
M
3-xCe
xAl
5O
12Transparent ceramic can prepare by pressureless sintering or hot pressed sintering down in vacuum or hydrogen atmosphere, and sintering temperature is 1700～1900 ℃.The forming method of transparent ceramic cover body 5 can be with M
3-xCe
xAl
5O
12After transparent ceramic powder is compression molded into lens case, reburns and form transparent ceramic; Also can be to sinter M earlier into
3-xCe
xAl
5O
12Behind the transparent ceramic, be reprocessed into lens-type.
Claims (5)
1. the encapsulating structure of a white light LEDs is characterized in that: comprise pedestal, blue-light LED chip and transparent ceramic cover body that two plate electrodes are installed; Described blue-light LED chip is fixed in the pedestal, and the positive and negative polarities of blue-light LED chip are electrically connected with described two plate electrode sheets respectively, and described transparent ceramic cover body covers described pedestal and bonding with pedestal.
2. the encapsulating structure of white light LEDs as claimed in claim 1, it is characterized in that: described transparent ceramic cover body is solid sphere lens-type.
3. the encapsulating structure of white light LEDs as claimed in claim 1, it is characterized in that: described transparent ceramic cover body is hollow sphere lens-type.
4. as the encapsulating structure of the described white light LEDs of arbitrary claim among the claim 1-3, it is characterized in that: do not contain phosphor powder layer and fluorescence glue-line between described blue-light LED chip and the transparent ceramic cover body.
5. a white light LEDs is characterized in that, the encapsulating structure of described white light LEDs is the encapsulating structure as the described white light LEDs of arbitrary claim among the claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202642096U CN201766096U (en) | 2010-07-20 | 2010-07-20 | Packaging structure of white-light LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202642096U CN201766096U (en) | 2010-07-20 | 2010-07-20 | Packaging structure of white-light LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201766096U true CN201766096U (en) | 2011-03-16 |
Family
ID=43718706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202642096U Expired - Lifetime CN201766096U (en) | 2010-07-20 | 2010-07-20 | Packaging structure of white-light LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201766096U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569597A (en) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
| CN105895777A (en) * | 2014-11-21 | 2016-08-24 | 黄波 | LED integrated light source packaging method and LED integrated light source |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
-
2010
- 2010-07-20 CN CN2010202642096U patent/CN201766096U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569597A (en) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
| CN105895777A (en) * | 2014-11-21 | 2016-08-24 | 黄波 | LED integrated light source packaging method and LED integrated light source |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110316 |