CN105895558B - 剥离开始部制作装置及其制作方法、电子器件的制造方法 - Google Patents

剥离开始部制作装置及其制作方法、电子器件的制造方法 Download PDF

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Publication number
CN105895558B
CN105895558B CN201610089793.8A CN201610089793A CN105895558B CN 105895558 B CN105895558 B CN 105895558B CN 201610089793 A CN201610089793 A CN 201610089793A CN 105895558 B CN105895558 B CN 105895558B
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China
Prior art keywords
blade
substrate
laminate
main surface
adsorption layer
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Chinese (zh)
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CN105895558A (zh
Inventor
伊藤泰则
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AGC Inc
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Asahi Glass Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Laminated Bodies (AREA)
CN201610089793.8A 2015-02-18 2016-02-17 剥离开始部制作装置及其制作方法、电子器件的制造方法 Active CN105895558B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-029377 2015-02-18
JP2015029377A JP6436389B2 (ja) 2015-02-18 2015-02-18 剥離開始部作成装置、及び剥離開始部作成方法並びに電子デバイスの製造方法

Publications (2)

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CN105895558A CN105895558A (zh) 2016-08-24
CN105895558B true CN105895558B (zh) 2020-09-01

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JP (1) JP6436389B2 (ja)
KR (1) KR20160101860A (ja)
CN (1) CN105895558B (ja)
TW (1) TWI669263B (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219263A (zh) * 2012-01-19 2013-07-24 旭硝子株式会社 剥离装置和电子设备的制造方法
CN103943457A (zh) * 2013-01-17 2014-07-23 株式会社迪思科 分离装置
TW201442061A (zh) * 2012-12-04 2014-11-01 Tokyo Electron Ltd 剝離裝置、剝離系統及剝離方法
WO2015002030A1 (ja) * 2013-07-01 2015-01-08 旭硝子株式会社 剥離起点作成装置及び方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006113124A (ja) * 2004-10-12 2006-04-27 Sharp Corp 偏光板剥離装置およびその管理方法
JP5360073B2 (ja) 2009-02-06 2013-12-04 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置
US8845859B2 (en) * 2011-03-15 2014-09-30 Sunedison Semiconductor Limited (Uen201334164H) Systems and methods for cleaving a bonded wafer pair
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法
CN105104803A (zh) * 2015-08-03 2015-12-02 广东海纳川生物科技股份有限公司 一种基于抗菌肽制备的水产饲料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219263A (zh) * 2012-01-19 2013-07-24 旭硝子株式会社 剥离装置和电子设备的制造方法
TW201442061A (zh) * 2012-12-04 2014-11-01 Tokyo Electron Ltd 剝離裝置、剝離系統及剝離方法
CN103943457A (zh) * 2013-01-17 2014-07-23 株式会社迪思科 分离装置
WO2015002030A1 (ja) * 2013-07-01 2015-01-08 旭硝子株式会社 剥離起点作成装置及び方法
TW201505952A (zh) * 2013-07-01 2015-02-16 Asahi Glass Co Ltd 剝離起點製作裝置及方法

Also Published As

Publication number Publication date
KR20160101860A (ko) 2016-08-26
TWI669263B (zh) 2019-08-21
TW201704134A (zh) 2017-02-01
JP6436389B2 (ja) 2018-12-12
JP2016150832A (ja) 2016-08-22
CN105895558A (zh) 2016-08-24

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Address after: Tokyo, Japan, Japan

Applicant after: AGC Corporation

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Applicant before: Asahi Glass Co., Ltd.

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