CN105870308A - 一种无机封装直插式紫光led及其制造方法 - Google Patents
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Abstract
本发明公开了一种无机封装直插式紫光LED及其制造方法,包括一金属陶瓷底座,所述金属陶瓷底座的上部部件为金属部件,下部部件为陶瓷部件,所述金属部件的上表面中心设置有一向内凹陷的凹槽,所述凹槽的内底部上设置有一层固晶胶,所述固晶胶上固定有一紫光芯片,所述金属陶瓷底座上扣合有一玻璃金属帽,所述玻璃金属帽进一步包括一两端通口的金属管以及嵌设于所述金属管上端口中的玻璃盖。本发明通过玻璃、金属、陶瓷等无机材料替换环氧树脂、硅胶等有机材料作为紫光LED封装材料,其大大提升了对紫光LED芯片的密封保护,并有效扩大紫光LED在特殊环境下的应用范围,还提高了紫光LED散热性能,提升了紫光LED的抗老化能力。
Description
技术领域
本发明涉及LED生产技术领域,更具体地说是一种无机封装直插式紫光LED及其制造方法。
背景技术
现有技术中,直插式紫光LED的封装多采用环氧树脂、硅胶等有机材料对芯片进行密封保护,这些无机材料透明性极好,封装便利,能提高出光效率,并在多领域中广泛应用。
然遇上使用环境恶劣,如高温、化学品挥发腐蚀、光通信及需要尘埃防护、易磨损等应用领域,有机材料封装的紫光LED则无法满足要求,且容易失效,甚至死灯。
发明内容
本发明的目的在于克服现有技术以上缺陷,提供一种密封保护好,有效扩大紫光LED在特殊环境下的应用范围,提高紫光LED散热性能,抗老化能力强的无机封装直插式紫光LED及其制造方法。
为了达到以上目的,本发明是通过以下技术方案实现的:一种无机封装直插式紫光LED,其特征在于,包括一金属陶瓷底座,所述金属陶瓷底座的上部部件为金属部件,下部部件为陶瓷部件,所述金属部件的上表面中心设置有一向内凹陷的凹槽,所述凹槽的内底部上设置有一层固晶胶,所述固晶胶上固定有一紫光芯片,所述固晶胶的高度为所述紫光芯片高度的1/3~1/2,所述金属陶瓷底座中贯穿有一对供电极,这对所述供电极各通过一根键合金丝与所述紫光芯片相连接,所述金属陶瓷底座上扣合有一玻璃金属帽,所述玻璃金属帽进一步包括一两端通口的金属管以及嵌设于所述金属管上端口中的玻璃盖,所述玻璃盖即为一圆台形的凸透镜片。
作为优选,所述金属陶瓷底座的金属部件下端沿以及所述玻璃金属帽的金属管下端沿均设置有向水平方向伸出的翻边,所述金属部件下端沿的翻边与所述金属管下端沿的翻边上下相叠置,所述金属陶瓷底座的陶瓷部件上端面中设置有收纳所述金属部件下端沿的翻边以及所述金属管下端沿的翻边的嵌槽。
作为优选,所述金属陶瓷底座中金属部件以及所述玻璃金属帽中金属管的金属材质均为铜,所述金属陶瓷底座中陶瓷部件为纳米陶瓷,所述玻璃金属帽中玻璃盖为高硼硅石英玻璃。
一种无机封装直插式紫光LED的制造方法,其特征在于,步骤如下:
(1)将固晶胶置于固晶机上进行固晶作业,固定住紫光芯片,固晶胶的高度为紫光芯片高度的1/3~1/2;
(2)将固定好紫光芯片的金属陶瓷底座放入烤箱中进行烘烤,烘烤分为两个阶段,第一阶段烘烤温度为100℃,时间为60分钟,使固晶胶中的反应抑制剂挥发,第二阶段烘烤温度为150℃,时间为120分钟,使固晶胶固化;
(3)将固晶胶固化后的金属陶瓷底座置于LED焊线机上进行焊线作业,一对供电极贯穿金属陶瓷底座后,各通过一根键合金丝与紫光芯片相连接形成回路;
(4)将玻璃金属帽盖在金属陶瓷底座上,并利用储能封焊工艺中的压力电阻焊原理,实现玻璃金属帽的翻边与金属陶瓷底座的翻边构成无缝焊接,从而实现LED器件非直接性高温加热快速无机材料气密封装。
有益效果:本发明通过玻璃、金属、陶瓷等无机材料替换环氧树脂、硅胶等有机材料作为紫光LED封装材料,其大大提升了对紫光LED芯片的密封保护,并有效扩大紫光LED在特殊环境下的应用范围,还提高了紫光LED散热性能,提升了紫光LED的抗老化能力。
附图说明
图1为本发明的结构示意图;
图2为图1中A部分的结构放大图。
图中:1-陶瓷部件,2-金属部件,3-凹槽,4-固晶胶,5-紫光芯片,6-键合金丝,7-供电极,8-金属管,9-玻璃盖,10-翻边,11-嵌槽。
具体实施方式
为了使本发明的技术手段、创作特征与达成目的易于明白理解,以下结合具体实施例进一步阐述本发明。
实施例:如图1和图2所示,一种无机封装直插式紫光LED,包括一金属陶瓷底座,金属陶瓷底座的上部部件为金属部件2,下部部件为陶瓷部件1,金属部件2的上表面中心设置有一向内凹陷的凹槽3,凹槽3的内底部上设置有一层固晶胶4,固晶胶4上固定有一紫光芯片5,固晶胶4的高度为紫光芯片5高度的1/3~1/2,金属陶瓷底座中贯穿有一对供电极7,这对供电极7各通过一根键合金丝6与紫光芯片5相连接,金属陶瓷底座上扣合有一玻璃金属帽,玻璃金属帽进一步包括一两端通口的金属管8以及嵌设于金属管8上端口中的玻璃盖9,玻璃盖9即为一圆台形的凸透镜片。
金属陶瓷底座的金属部件2下端沿以及玻璃金属帽的金属管8下端沿均设置有向水平方向伸出的翻边10,金属部件2下端沿的翻边与金属管8下端沿的翻边上下相叠置,金属陶瓷底座的陶瓷部件1上端面中设置有收纳金属部件2下端沿的翻边以及金属管8下端沿的翻边10的嵌槽11。
金属陶瓷底座中金属部件2以及玻璃金属帽中金属管8的金属材质均为铜,金属陶瓷底座中陶瓷部件1为纳米陶瓷,玻璃金属帽中玻璃盖9为高硼硅石英玻璃。
一种无机封装直插式紫光LED的制造方法,其特征在于,步骤如下:
(1)将固晶胶置于固晶机上进行固晶作业,固定住紫光芯片,固晶胶的高度为紫光芯片高度的1/3~1/2;
(2)将固定好紫光芯片的金属陶瓷底座放入烤箱中进行烘烤,烘烤分为两个阶段,第一阶段烘烤温度为100℃,时间为60分钟,使固晶胶中的反应抑制剂挥发,第二阶段烘烤温度为150℃,时间为120分钟,使固晶胶固化;
(3)将固晶胶固化后的金属陶瓷底座置于LED焊线机上进行焊线作业,一对供电极贯穿金属陶瓷底座后,各通过一根键合金丝与紫光芯片相连接形成回路;
(4)将玻璃金属帽盖在金属陶瓷底座上,并利用储能封焊工艺中的压力电阻焊原理,实现玻璃金属帽的翻边与金属陶瓷底座的翻边构成无缝焊接,从而实现LED器件非直接性高温加热快速无机材料气密封装。
使用:本发明通过玻璃、金属、陶瓷等无机材料替换环氧树脂、硅胶等有机材料作为紫光LED封装材料,其大大提升了对紫光LED芯片的密封保护,并有效扩大紫光LED在特殊环境下的应用范围,还提高了紫光LED散热性能,提升了紫光LED的抗老化能力。
Claims (4)
1.一种无机封装直插式紫光LED,其特征在于,包括一金属陶瓷底座,所述金属陶瓷底座的上部部件为金属部件,下部部件为陶瓷部件,所述金属部件的上表面中心设置有一向内凹陷的凹槽,所述凹槽的内底部上设置有一层固晶胶,所述固晶胶上固定有一紫光芯片,所述固晶胶的高度为所述紫光芯片高度的1/3~1/2,所述金属陶瓷底座中贯穿有一对供电极,这对所述供电极各通过一根键合金丝与所述紫光芯片相连接,所述金属陶瓷底座上扣合有一玻璃金属帽,所述玻璃金属帽进一步包括一两端通口的金属管以及嵌设于所述金属管上端口中的玻璃盖,所述玻璃盖即为一圆台形的凸透镜片。
2.根据权利要求1所述的无机封装直插式紫光LED,其特征在于,所述金属陶瓷底座的金属部件下端沿以及所述玻璃金属帽的金属管下端沿均设置有向水平方向伸出的翻边,所述金属部件下端沿的翻边与所述金属管下端沿的翻边上下相叠置,所述金属陶瓷底座的陶瓷部件上端面中设置有收纳所述金属部件下端沿的翻边以及所述金属管下端沿的翻边的嵌槽。
3.根据权利要求1或2所述的无机封装直插式紫光LED,其特征在于,所述金属陶瓷底座中金属部件以及所述玻璃金属帽中金属管的金属材质均为铜,所述金属陶瓷底座中陶瓷部件为纳米陶瓷,所述玻璃金属帽中玻璃盖为高硼硅石英玻璃。
4.一种根据权利要求1-3任意一项所述无机封装直插式紫光LED的制造方法,其特征在于,步骤如下:
(1)将固晶胶置于固晶机上进行固晶作业,固定住紫光芯片,固晶胶的高度为紫光芯片高度的1/3~1/2;
(2)将固定好紫光芯片的金属陶瓷底座放入烤箱中进行烘烤,烘烤分为两个阶段,第一阶段烘烤温度为100℃,时间为60分钟,使固晶胶中的反应抑制剂挥发,第二阶段烘烤温度为150℃,时间为120分钟,使固晶胶固化;
(3)将固晶胶固化后的金属陶瓷底座置于LED焊线机上进行焊线作业,一对供电极贯穿金属陶瓷底座后,各通过一根键合金丝与紫光芯片相连接形成回路;
(4)将玻璃金属帽盖在金属陶瓷底座上,并利用储能封焊工艺中的压力电阻焊原理,实现玻璃金属帽的翻边与金属陶瓷底座的翻边构成无缝焊接,从而实现LED器件非直接性高温加热快速无机材料气密封装。
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