CN105835247B - 硅棒组合加工机 - Google Patents
硅棒组合加工机 Download PDFInfo
- Publication number
- CN105835247B CN105835247B CN201610345607.2A CN201610345607A CN105835247B CN 105835247 B CN105835247 B CN 105835247B CN 201610345607 A CN201610345607 A CN 201610345607A CN 105835247 B CN105835247 B CN 105835247B
- Authority
- CN
- China
- Prior art keywords
- silicon rod
- equipment
- silicon
- cutting
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 443
- 239000010703 silicon Substances 0.000 title claims abstract description 443
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 442
- 238000003754 machining Methods 0.000 title claims abstract description 33
- 235000013312 flour Nutrition 0.000 claims abstract description 50
- 238000003801 milling Methods 0.000 claims abstract description 50
- 238000005498 polishing Methods 0.000 claims abstract description 41
- 238000005520 cutting process Methods 0.000 claims description 164
- 238000000227 grinding Methods 0.000 claims description 106
- 238000012546 transfer Methods 0.000 claims description 34
- 238000004140 cleaning Methods 0.000 claims description 33
- 230000007246 mechanism Effects 0.000 claims description 29
- 238000005259 measurement Methods 0.000 claims description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 10
- 230000003028 elevating effect Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000007306 turnover Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 13
- 239000013078 crystal Substances 0.000 description 7
- 238000009412 basement excavation Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610345607.2A CN105835247B (zh) | 2016-05-23 | 2016-05-23 | 硅棒组合加工机 |
PCT/CN2017/085048 WO2017202245A1 (zh) | 2016-05-23 | 2017-05-19 | 硅棒多工位加工机及硅棒多工位加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610345607.2A CN105835247B (zh) | 2016-05-23 | 2016-05-23 | 硅棒组合加工机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105835247A CN105835247A (zh) | 2016-08-10 |
CN105835247B true CN105835247B (zh) | 2018-12-11 |
Family
ID=56594104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610345607.2A Active CN105835247B (zh) | 2016-05-23 | 2016-05-23 | 硅棒组合加工机 |
Country Status (1)
Country | Link |
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CN (1) | CN105835247B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017202245A1 (zh) * | 2016-05-23 | 2017-11-30 | 上海日进机床有限公司 | 硅棒多工位加工机及硅棒多工位加工方法 |
CN106181610B (zh) * | 2016-08-31 | 2019-01-29 | 天通日进精密技术有限公司 | 硅棒多工位组合加工机 |
CN106940178A (zh) * | 2017-03-22 | 2017-07-11 | 上海日进机床有限公司 | 硅晶体工件平整度检测装置和硅晶体工件平整度检测方法 |
CN108942643A (zh) * | 2017-05-19 | 2018-12-07 | 浙江集英精密机器有限公司 | 硅棒装卸装置及硅棒多工位加工机 |
CN108942572B (zh) * | 2017-05-19 | 2021-04-09 | 天通日进精密技术有限公司 | 单晶硅棒多工位加工方法及单晶硅棒多工位加工机 |
CN109605192A (zh) * | 2019-01-31 | 2019-04-12 | 青岛高测科技股份有限公司 | 一种半导体全自动滚圆机 |
CN109773641A (zh) * | 2019-03-22 | 2019-05-21 | 天通日进精密技术有限公司 | 半导体晶棒立式滚圆开槽机 |
CN110039672B (zh) * | 2019-04-25 | 2021-02-26 | 内蒙古中环协鑫光伏材料有限公司 | 一种六边形单晶硅棒的加工工艺 |
CN110153812A (zh) * | 2019-06-21 | 2019-08-23 | 青岛高测科技股份有限公司 | 一种半导体滚圆开槽磨锥一体机 |
CN212218917U (zh) * | 2019-08-02 | 2020-12-25 | 天通日进精密技术有限公司 | 硅棒切磨一体机 |
CN111015980A (zh) * | 2019-12-13 | 2020-04-17 | 广东富源科技股份有限公司 | 一种高效率的热交换法蓝宝石省胶粘锭方法及其装置 |
WO2022041863A1 (zh) * | 2020-08-28 | 2022-03-03 | 天通日进精密技术有限公司 | 硅棒研磨机及硅棒研磨方法 |
CN112705306B (zh) * | 2020-12-08 | 2023-02-28 | 亚洲硅业(青海)股份有限公司 | 高纯微硅粉的制备方法及系统 |
CN113878448B (zh) * | 2021-10-14 | 2023-03-31 | 福州天瑞线锯科技有限公司 | 一种多工位立式磨削机 |
CN113858001A (zh) * | 2021-10-14 | 2021-12-31 | 福州天瑞线锯科技有限公司 | 一种磨削方法 |
CN113894642A (zh) * | 2021-10-14 | 2022-01-07 | 福州天瑞线锯科技有限公司 | 一种立式送料磨削机 |
CN113927383B (zh) * | 2021-10-14 | 2023-03-07 | 福州天瑞线锯科技有限公司 | 一种双磨头磨削加工方法 |
CN113878442A (zh) * | 2021-10-14 | 2022-01-04 | 福州天瑞线锯科技有限公司 | 一种接送料机构以及磨削设备 |
CN117584301A (zh) * | 2021-11-01 | 2024-02-23 | 青岛高测科技股份有限公司 | 硅棒切割系统 |
Citations (6)
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JP2009252822A (ja) * | 2008-04-02 | 2009-10-29 | Sumco Corp | シリコンウェーハ及びその製造方法 |
CN202480265U (zh) * | 2012-03-27 | 2012-10-10 | 周文敏 | 微机控制四工位多线晶片切割机 |
EP2189245B1 (en) * | 2008-11-05 | 2014-07-23 | Shin-Etsu Chemical Co., Ltd. | Methods and apparatus for multiple cutoff machining of rare earth magnet blocks |
CN205021839U (zh) * | 2015-08-13 | 2016-02-10 | 浙江昀丰新能源科技有限公司 | 一种多工位线切方机 |
CN105538112A (zh) * | 2016-02-02 | 2016-05-04 | 上海日进机床有限公司 | 多工位组合式晶棒加工设备 |
CN205631053U (zh) * | 2016-05-23 | 2016-10-12 | 上海日进机床有限公司 | 硅棒组合加工机 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2137192Y (zh) * | 1992-09-30 | 1993-06-30 | 谭子胜 | 轻便式砂磨抛光电钻多用机 |
CN204772079U (zh) * | 2015-07-15 | 2015-11-18 | 江西冠亿砂轮有限公司 | 一种陶瓷砂轮的双头工装结构 |
-
2016
- 2016-05-23 CN CN201610345607.2A patent/CN105835247B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009252822A (ja) * | 2008-04-02 | 2009-10-29 | Sumco Corp | シリコンウェーハ及びその製造方法 |
EP2189245B1 (en) * | 2008-11-05 | 2014-07-23 | Shin-Etsu Chemical Co., Ltd. | Methods and apparatus for multiple cutoff machining of rare earth magnet blocks |
CN202480265U (zh) * | 2012-03-27 | 2012-10-10 | 周文敏 | 微机控制四工位多线晶片切割机 |
CN205021839U (zh) * | 2015-08-13 | 2016-02-10 | 浙江昀丰新能源科技有限公司 | 一种多工位线切方机 |
CN105538112A (zh) * | 2016-02-02 | 2016-05-04 | 上海日进机床有限公司 | 多工位组合式晶棒加工设备 |
CN205631053U (zh) * | 2016-05-23 | 2016-10-12 | 上海日进机床有限公司 | 硅棒组合加工机 |
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Publication number | Publication date |
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CN105835247A (zh) | 2016-08-10 |
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Effective date of registration: 20180522 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Applicant after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Applicant before: Shanghai Nissin Machine Tool Co., Ltd. |
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Effective date of registration: 20180806 Address after: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Applicant after: Zhejiang Ji Ying Precision Machinery Co., Ltd. Address before: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Applicant before: Haining Dijin science and Technology Co., Ltd. |
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Address after: 314400 6 Building 129, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Applicant after: Tiantong Tijin Precision Technology Co., Ltd. Address before: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Applicant before: Zhejiang Ji Ying Precision Machinery Co., Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silicon rod combined processing machine Effective date of registration: 20211126 Granted publication date: 20181211 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: TIANTONG RIJIN PRECISION TECHNOLOGY Co.,Ltd. Registration number: Y2021330002258 |
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