CN105813765B - 涂布构件及涂布装置 - Google Patents
涂布构件及涂布装置 Download PDFInfo
- Publication number
- CN105813765B CN105813765B CN201480067690.0A CN201480067690A CN105813765B CN 105813765 B CN105813765 B CN 105813765B CN 201480067690 A CN201480067690 A CN 201480067690A CN 105813765 B CN105813765 B CN 105813765B
- Authority
- CN
- China
- Prior art keywords
- coating
- coating needle
- needle
- holder
- needle holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
- B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-258189 | 2013-12-13 | ||
| JP2013258189A JP6381902B2 (ja) | 2013-12-13 | 2013-12-13 | 塗布針ホルダ |
| PCT/JP2014/082637 WO2015087899A1 (ja) | 2013-12-13 | 2014-12-10 | 塗布部材および塗布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105813765A CN105813765A (zh) | 2016-07-27 |
| CN105813765B true CN105813765B (zh) | 2018-11-16 |
Family
ID=53371201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480067690.0A Active CN105813765B (zh) | 2013-12-13 | 2014-12-10 | 涂布构件及涂布装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6381902B2 (enExample) |
| CN (1) | CN105813765B (enExample) |
| WO (1) | WO2015087899A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6835506B2 (ja) * | 2016-09-01 | 2021-02-24 | Ntn株式会社 | 液体塗布ユニットおよび液体塗布装置 |
| JP2018140336A (ja) | 2017-02-27 | 2018-09-13 | Ntn株式会社 | 液体塗布ユニットおよび液体塗布装置 |
| JP6461260B1 (ja) * | 2017-08-02 | 2019-01-30 | Ntn株式会社 | 塗布機構及び塗布装置 |
| JP7164997B2 (ja) | 2018-08-31 | 2022-11-02 | Ntn株式会社 | 塗布針部材、塗布針部材アセンブリ、塗布部材および塗布装置 |
| JP7621134B2 (ja) | 2021-02-25 | 2025-01-24 | Ntn株式会社 | 塗布機構及び塗布装置 |
| JP7681421B2 (ja) * | 2021-04-08 | 2025-05-22 | サンスター技研株式会社 | 塗工装置 |
| DE102021128092A1 (de) * | 2021-10-28 | 2023-05-04 | Focke & Co. (Gmbh & Co. Kg) | Vorrichtung zum Auftragen von vorzugsweise erwärmtem Klebstoff bzw. (Heiß-) Leim |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1199354A (zh) * | 1995-09-07 | 1998-11-18 | 新日本制铁株式会社 | 预涂钢板断面的涂覆方法和涂覆装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0253162U (enExample) * | 1988-10-12 | 1990-04-17 | ||
| JP4125031B2 (ja) * | 2002-04-11 | 2008-07-23 | 株式会社リコー | 定着装置及びその定着装置を有する画像形成装置 |
| JP4767708B2 (ja) * | 2005-03-28 | 2011-09-07 | Ntn株式会社 | 塗布ユニットおよびパターン修正装置 |
| JP2008073637A (ja) * | 2006-09-22 | 2008-04-03 | Ntn Corp | 塗布針洗浄装置 |
| JP4928284B2 (ja) * | 2007-01-23 | 2012-05-09 | 芝浦メカトロニクス株式会社 | 流体塗布装置および塗布距離測定方法 |
| JP5986727B2 (ja) * | 2011-10-07 | 2016-09-06 | 武蔵エンジニアリング株式会社 | 液体材料の吐出装置および方法 |
-
2013
- 2013-12-13 JP JP2013258189A patent/JP6381902B2/ja active Active
-
2014
- 2014-12-10 WO PCT/JP2014/082637 patent/WO2015087899A1/ja not_active Ceased
- 2014-12-10 CN CN201480067690.0A patent/CN105813765B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1199354A (zh) * | 1995-09-07 | 1998-11-18 | 新日本制铁株式会社 | 预涂钢板断面的涂覆方法和涂覆装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105813765A (zh) | 2016-07-27 |
| WO2015087899A1 (ja) | 2015-06-18 |
| JP2015112577A (ja) | 2015-06-22 |
| JP6381902B2 (ja) | 2018-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |