CN105813765B - 涂布构件及涂布装置 - Google Patents

涂布构件及涂布装置 Download PDF

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Publication number
CN105813765B
CN105813765B CN201480067690.0A CN201480067690A CN105813765B CN 105813765 B CN105813765 B CN 105813765B CN 201480067690 A CN201480067690 A CN 201480067690A CN 105813765 B CN105813765 B CN 105813765B
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CN
China
Prior art keywords
coating
coating needle
needle
holder
needle holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480067690.0A
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English (en)
Chinese (zh)
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CN105813765A (zh
Inventor
山中昭浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTN Corp
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NTN Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NTN Corp filed Critical NTN Corp
Publication of CN105813765A publication Critical patent/CN105813765A/zh
Application granted granted Critical
Publication of CN105813765B publication Critical patent/CN105813765B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/027Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/06Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
CN201480067690.0A 2013-12-13 2014-12-10 涂布构件及涂布装置 Active CN105813765B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-258189 2013-12-13
JP2013258189A JP6381902B2 (ja) 2013-12-13 2013-12-13 塗布針ホルダ
PCT/JP2014/082637 WO2015087899A1 (ja) 2013-12-13 2014-12-10 塗布部材および塗布装置

Publications (2)

Publication Number Publication Date
CN105813765A CN105813765A (zh) 2016-07-27
CN105813765B true CN105813765B (zh) 2018-11-16

Family

ID=53371201

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480067690.0A Active CN105813765B (zh) 2013-12-13 2014-12-10 涂布构件及涂布装置

Country Status (3)

Country Link
JP (1) JP6381902B2 (enExample)
CN (1) CN105813765B (enExample)
WO (1) WO2015087899A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6835506B2 (ja) * 2016-09-01 2021-02-24 Ntn株式会社 液体塗布ユニットおよび液体塗布装置
JP2018140336A (ja) 2017-02-27 2018-09-13 Ntn株式会社 液体塗布ユニットおよび液体塗布装置
JP6461260B1 (ja) * 2017-08-02 2019-01-30 Ntn株式会社 塗布機構及び塗布装置
JP7164997B2 (ja) 2018-08-31 2022-11-02 Ntn株式会社 塗布針部材、塗布針部材アセンブリ、塗布部材および塗布装置
JP7621134B2 (ja) 2021-02-25 2025-01-24 Ntn株式会社 塗布機構及び塗布装置
JP7681421B2 (ja) * 2021-04-08 2025-05-22 サンスター技研株式会社 塗工装置
DE102021128092A1 (de) * 2021-10-28 2023-05-04 Focke & Co. (Gmbh & Co. Kg) Vorrichtung zum Auftragen von vorzugsweise erwärmtem Klebstoff bzw. (Heiß-) Leim

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199354A (zh) * 1995-09-07 1998-11-18 新日本制铁株式会社 预涂钢板断面的涂覆方法和涂覆装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0253162U (enExample) * 1988-10-12 1990-04-17
JP4125031B2 (ja) * 2002-04-11 2008-07-23 株式会社リコー 定着装置及びその定着装置を有する画像形成装置
JP4767708B2 (ja) * 2005-03-28 2011-09-07 Ntn株式会社 塗布ユニットおよびパターン修正装置
JP2008073637A (ja) * 2006-09-22 2008-04-03 Ntn Corp 塗布針洗浄装置
JP4928284B2 (ja) * 2007-01-23 2012-05-09 芝浦メカトロニクス株式会社 流体塗布装置および塗布距離測定方法
JP5986727B2 (ja) * 2011-10-07 2016-09-06 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199354A (zh) * 1995-09-07 1998-11-18 新日本制铁株式会社 预涂钢板断面的涂覆方法和涂覆装置

Also Published As

Publication number Publication date
CN105813765A (zh) 2016-07-27
WO2015087899A1 (ja) 2015-06-18
JP2015112577A (ja) 2015-06-22
JP6381902B2 (ja) 2018-08-29

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