CN105789219B - 一种用于制造显示面板的方法、显示面板以及显示装置 - Google Patents
一种用于制造显示面板的方法、显示面板以及显示装置 Download PDFInfo
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Abstract
本发明涉及一种用于制造显示面板的方法、显示面板以及显示装置。一种用于制造显示面板的方法包括:在基板上形成第一金属层;在所述第一金属层上形成第二金属层;氧化所述第二金属层的一部分以形成延伸到所述第一金属层的表面的氧化物;去除所述氧化物以暴露所述第一金属层的所述表面;以及在所述第一金属层的暴露的所述表面上形成导电层。
Description
技术领域
本发明涉及显示技术领域,特别地,涉及一种用于制造显示面板的方法、显示面板以及显示装置。
背景技术
TFT-LCD现有显示产品阵列设计中,尤其是嵌入式(full in Cell)触控产品,作为公共电极的诸如ITO的透明氧化物层经常需要与源极/漏极(S/D)电极层相连接以传递信号。在分时驱动时,该公共电极在显示阶段传递公共电压信号(Vcom)并在触控阶段传递触控信号。然而,低温多晶硅(LTPS)工艺中S/D材料所采用的导电材料与公共电极层之间的接触电阻过大,从而劣化显示面板的显示和触控性能。
发明内容
本发明的实施例提供了一种用于制造显示面板方法,能够有效解决导电布线之间由于界面氧化物的存在所导致的接触电阻增高的问题。
本发明的一个方面提供了一种用于制造显示面板的方法,包括:
在基板上形成第一金属层;
在所述第一金属层上形成第二金属层;
氧化所述第二金属层的一部分以形成延伸到所述第一金属层的表面的氧化物;
去除所述氧化物以暴露所述第一金属层的所述表面;以及
在所述第一金属层的暴露的所述表面上形成导电层。
进一步地,所述第二金属层具有500到1000埃的厚度。
进一步地,还包括构图所述第一金属层以形成源极/漏极电极层,以及所述导电层在显示阶段作为公共电极且在触控阶段作为触控电极。
进一步地,在所述氧化之前,在所述第二金属层上形成隔离层并构图所述隔离层以形成暴露所述第二金属的所述部分的开口。
进一步地,所述氧化包括在形成所述开口之后的所述第二金属层的氧暴露。
进一步地,所述氧暴露包括下列中的至少一种:
在工序间转移所述基板的步骤;
构图所述隔离层之后的退火步骤;以及
在形成所述导电层之前的所述隔离层的灰化步骤。
进一步地,去除所述氧化物包括去除位于所述开口的底部处的所述氧化物以暴露所述第一金属层的顶表面。
进一步地,使用所述隔离层作为保护层,通过湿法蚀刻来去除所述氧化物。
进一步地,所述导电层形成在所述隔离层的顶表面上、所述开口的所述侧壁上和所述第一金属层的暴露的所述顶表面上。
进一步地,所述第一金属层包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,所述第二金属层包括Al或Ag,以及所述导电层包括透明导电层。
进一步地,所述第一金属层包括Ti/Al/Ti叠层以及所述第二金属层包括Al,其中所述第一金属层和所述第二金属层通过依次连续沉积Ti、Al、Ti、Al层而形成。
进一步地,所述透明导电层包括ITO。
进一步地,所述隔离层包括树脂。
进一步地,通过稀硫酸溶液去除所述氧化物。
本发明的另一方面提供了一种显示面板,包括:
在基板上形成的第一金属层;
在所述第一金属层上形成的第二金属层,其中所述第二金属层具有暴露所述第一金属层的顶表面的开口;以及
位于所述开口中且在所述第一金属层的所述顶表面上的导电层。
进一步地,所述第二金属层具有500到1000埃的厚度。
进一步地,所述第一金属层包括源极/漏极电极层,以及所述导电层在显示阶段作为公共电极且在触控阶段作为触控电极。
进一步地,还包括在所述第二金属层上的隔离层,其中所述隔离层具有另一开口,所述另一开口与所述第二金属层的所述开口对准。
进一步地,所述导电层位于所述隔离层的顶表面上、所述隔离层的所述另一开口和所述第二金属层的所述开口的侧壁上以及所述第一金属层的暴露的所述顶表面上。
进一步地,所述第一金属层包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,所述第二金属层包括Al或Ag,以及所述导电层包括透明导电层。
进一步地,所述第一金属层包括Ti/Al/Ti叠层以及所述第二金属层包括Al。
进一步地,所述透明导电层包括ITO。
进一步地,所述隔离层包括树脂。
本发明的又一方面提供一种显示装置,其包括上述的显示面板。
附图说明
为了更清楚地说明本发明的实施例的技术方案,下面将对实施例的附图进行简要说明,应当知道,以下描述的附图仅仅涉及本发明的一些实施例,而非对本发明的限制,其中:
图1示出了一种嵌入式显示面板的结构图;以及
图2示出了根据本发明的实施例的显示面板的制造方法。
具体实施方式
为了使本发明的实施例的目的、技术方案和优点更加清楚,下面将接合附图,对本发明的实施例的技术方案进行清楚、完整的描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域技术人员在无需创造性劳动的前提下所获得的所有其他实施例,也都属于本发明保护的范围。
当介绍本发明的元素及其实施例时,用语“一”、“一个”、“该”和“所述”旨在表示存在一个或者多个要素。用语“包含”、“包括”、“含有”和“具有”旨在包括性的并且表示可以存在除所列要素之外的另外的要素。出于下文表面描述的目的,如其在附图中被标定方向那样,术语“上”、“下”、“左”、“右”“垂直”、“水平”、“顶”、“底”及其派生词应涉及发明。术语“上覆”、“在……顶上”、“定位在……上”或者“定位在……顶上”意味着诸如第一结构的第一要素存在于诸如第二结构的第二要素上,其中,在第一要素和第二要素之间可存在诸如界面结构的中间要素。
图1示出了一种嵌入式显示面板的结构图,在其中公共电极层通过形成在隔离材料中的过孔与S/D电极层电连接。该公共电极层可以包括任何的透明导电材料,优选地包括ITO。S/D电极层包括任何导电金属,优选地包括Ti/Al/Ti叠层或Mo/Al/Mo叠层。发明人经测试发现该公共电极层与S/D电极层之间存在接触电阻,该接触电阻可能使S/D电极层不能够作为触控金属线所连接的透明导电层的发送电极使用,因此对显示面板具有潜在的不利影响。为此,发明人进行大量研究,研究表明发该接触电阻与S/D电极层与公共电极层之间存在的氧化物有关,并且进一步发现该氧化物是由形成S/D电极层之后的后续处理导致的,并且难以去除。例如,在使用Ti/Al/Ti金属叠层制造S/D电极层时,位于最上层的Ti金属在等离子体环境或高温切换到低温等的氧暴露情况下具有氧化风险,形成氧化钛。该氧化钛附着在Ti/Al/Ti叠层的表面且是非水溶性的,只有通过热浓硫酸才能够去除,而该处理会严重损坏周边结构,甚至使得整个产品报废。
针对上述问题,本发明的实施例提供了一种用于制造显示面板的方法,包括:在基板上形成第一金属层;在第一金属层上形成第二金属层;氧化第二金属层的一部分以形成延伸到第一金属层的表面的氧化物;去除该氧化物以暴露第一金属层的表面;以及在第一金属层的暴露的表面上形成导电层。通过该方法,采用第一金属作为用于潜在氧化的牺牲层材料,能够有效防止在第一金属层的表面上形成氧化物,进而减少第一金属层与随后形成的导电层之间的接触电阻。根据本发明的实施例,上述氧化可包括形成第二金属层之后的任何氧暴露过程。可以理解,本发明对于作为牺牲层的第二金属层的材料没有任何限制,包括任何金属或合金,只要第二金属层的氧化物能够容易地被去除并该去除不会对显示面板的性能造成不良影响,或仅具有较小的影响。
下面将参考附图描述本发明的显示面板制造方法的一个实施例。
图2示出了根据本发明的实施例的一种显示面板的制造方法。在该方法中,第一金属层作为显示面板的源极/漏极电极层,并且导电层为形成在源极/漏极电极层上的诸如ITO的透明导电层。根据本发明的实施例,优选地,在分时驱动显示面板时,该透明导电在显示阶段作为公共电极以提供公共电压(Vcom),并且在触控阶段作为触控电极。
如图2所示,在步骤S1期间,在包括形成源极/漏极电极层之前的前工序层2的基板1上形成源极/漏极电极层3,该源极/漏极电极层3包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,优选为Ti/Al/Ti叠层。基本1为可以任何透明基板,包括但不限于,玻璃、PMMA、PET和PC。可以采用本领域公知的膜形成工艺来形成源极/漏极电极层,包括但不限于,蒸发和溅射。在图2中,源极/漏极电极层3被示出采用Ti/Al/Ti叠层,其中层3a为Ti层且层3b为Al层。相应地,在采用Mo/Al/Mo叠层的情况下,层3a为Mo层。
此外,在步骤S1期间,进一步在源极/漏极电极层3上形成牺牲性保护金属层作为第二金属层4,该第二金属层4可以为Al或Ag。在采用Ti/Al/Ti叠层作为源极/漏极电极层的情况下,优选采用Al作为第二金属层4。根据本发明的实施例,源极/漏极电极层3和第二金属层4可以通过不同的膜形成步骤形成,或者在同一膜形成步骤中连续形成。优选地,可同时构图第一和第二金属层的组合以形成源极/漏极电极层。优选地,根据本发明的实施例,在采用Ti/Al/Ti叠层作为源极/漏极电极层3并采用Al作为第二金属层4的情况下,可以通过依次连续Ti、Al、Ti和Al层以同步形成源极/漏极电极层3和第二金属4。此外,本发明对第二金属层4的厚度没有特别的限制,只要第二金属层能够保护下伏金属层不被氧化。优选地,第二金属层具有500到1000埃的厚度。
接下来,在步骤S2期间,通过本领域公知的工艺在第二金属层4上形成隔离层5,隔离层5包括任何的绝缘材料,优选为树脂。之后,通过曝光和显影对隔离层进行构图,以形成暴露第二金属层4的一部分的开口。根据本发明的实施例,在第二金属层4的一部分被暴露之后,该部分由于会暴露到含有氧的环境(即,氧暴露)而被氧化。也就是,根据本发明的方案,不需要特意地将第二金属层4的暴露部分氧化,该氧化过程例如可以在LTPS工艺中自发完成。根据本发明的实施例,氧暴露包括但不限于下列中的至少一种:在工序间转移基板的步骤、构图隔离层之后进行的用于固化隔离层的退火步骤以及在形成导电层之前的对隔离层进行的灰化步骤。其中该灰化步骤能够粗糙化隔离层的表面,以增加将形成的导电层的粘附强度,防止剥脱。经过氧化,第二金属层4的整个暴露部分被转化为氧化物,在第二金属层为Al情况下,该氧化物为Al2O3。
注意,虽然图2并未示出,但本领域的技术人员可以理解,在形成隔离层5之前,可以通过本领域的公知的构图工艺对源极/漏极电极层3和第二金属4进行构图以获得希望的电极形状,例如首先形成掩模,之后采用诸如干法或湿法蚀刻的蚀刻工艺去除源极/漏极电极层3和第二金属4的需要去除的部分。
接下来,在步骤S3期间,去除位于开口底部的第二金属层4的氧化物以暴露第二金属4侧壁和源极/漏极层3的顶表面。根据本发明的实施例,优选地,使用隔离层5作为保护层,通过湿法蚀刻来去除氧化物。优选地,在蚀刻之前,对隔离层5进行退火处理以固化或坚膜隔离层,以更好地耐受蚀刻剂的腐蚀。根据本发明的实施例,可以采用用于ITO的蚀刻剂,优选采用稀硫酸溶剂作为湿法蚀刻的蚀刻剂。特别地,在第二金属层4为Al时,使用稀硫酸溶液去除Al2O3是优选的。
接下来,在步骤S4期间,在隔离层5的顶表面上以及开口的侧壁和底表面上形成导电层6。根据本发明的实施例,导电层6可通过诸如磁控溅射的溅射方法形成。由此,导电层6与源极/漏极电极层3之间形成良好的电接触,从而改善显示面板的性能。
总之,本发明的显示面板制造方法能够有效消除金属布线之间的界面氧化物,减小接触电阻。
本发明的还提供了一种显示面板,包括:在基板1上形成的第一金属层3;在第一金属层3上形成的第二金属层4,其中第二金属层具有暴露第一金属层的顶表面的开口;以及位于该开口中且在第一金属层3的顶表面上的导电层6。
根据本发明的实施例,该第二金属层4优选具有500到1000埃的厚度。
根据本发明的实施例,该第一金属层3包括源极/漏极电极层,以及导电层6在显示阶段作为公共电极且在触控阶段作为触控电极。
根据本发明的实施例,该显示面板还包括在第二金属层4上的隔离层5,其中,隔离层优选包括树脂材料。进一步地,该隔离层5具有另一开口,该另一开口与第二金属层4的开口对准。导电层6位于隔离层5的顶表面上、隔离层5的另一开口和第二金属层4的开口的侧壁上以及第一金属层3的暴露的顶表面上。
根据本发明的实施例,第一金属层3包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,第二金属4层包括Al或Ag,以及导电层6包括透明导电层,例如,ITO。优选地,第一金属层3包括Ti/Al/Ti叠层且第二金属4层包括Al。
相应地,本发明的实施例还提供一种显示装置,其包括上述的显示面板。该显示装置包括但不限于:手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
已经描述了某特定实施例,这些实施例仅通过举例的方式展现,而且不旨在限制本发明的范围。事实上,本文所描述的新颖实施例可以以各种其它形式来实施;此外,可在不脱离本发明的精神下,做出以本文所描述的实施例的形式的各种省略、替代和改变。所附权利要求以及它们的等价物旨在覆盖落在本发明范围和精神内的此类形式或者修改。
Claims (24)
1.一种用于制造显示面板的方法,包括:
在基板上形成第一金属层;
在所述第一金属层上形成第二金属层;
氧化所述第二金属层的一部分以形成延伸到所述第一金属层的表面的氧化物;
去除所述氧化物以暴露所述第一金属层的所述表面;以及
在所述第一金属层的暴露的所述表面上形成导电层。
2.根据权利要求1所述的方法,其特征在于,所述第二金属层具有500到1000埃的厚度。
3.根据权利要求1所述的方法,其特征在于,还包括构图所述第一金属层以形成源极/漏极电极层,以及所述导电层在显示阶段作为公共电极且在触控阶段作为触控电极。
4.根据权利要求3所述的方法,其特征在于,在所述氧化之前,在所述第二金属层上形成隔离层并构图所述隔离层以形成暴露所述第二金属的所述部分的开口。
5.根据权利要求4所述的方法,其特征在于,所述氧化包括在形成所述开口之后的所述第二金属层的氧暴露。
6.根据权利要求5所述的方法,其特征在于,所述氧暴露包括下列中的至少一种:
在工序间转移所述基板的步骤;
构图所述隔离层之后的退火步骤;以及
在形成所述导电层之前的所述隔离层的灰化步骤。
7.根据权利要求4所述的方法,其特征在于,去除所述氧化物包括去除位于所述开口的底部处的所述氧化物以暴露所述第一金属层的顶表面。
8.根据权利要求7所述的方法,其特征在于,使用所述隔离层作为保护层,通过湿法蚀刻来去除所述氧化物。
9.根据权利要求7所述的方法,其特征在于,所述导电层被形成在所述隔离层的顶表面上、所述开口的侧壁上和所述第一金属层的暴露的所述顶表面上。
10.根据权利要求1或9所述的方法,其特征在于,所述第一金属层包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,所述第二金属层包括Al或Ag,以及所述导电层包括透明导电层。
11.根据权利要求10所述的方法,其特征在于,所述第一金属层包括Ti/Al/Ti叠层以及所述第二金属层包括Al,其中所述第一金属层和所述第二金属层通过依次连续沉积Ti、Al、Ti、Al层而形成。
12.根据权利要求10所述的方法,其特征在于,所述透明导电层包括ITO。
13.根据权利要求4所述的方法,其特征在于,所述隔离层包括树脂。
14.根据权利要求1或11所述的方法,其特征在于,通过稀硫酸溶液去除所述氧化物。
15.一种显示面板,包括:
在基板上形成的第一金属层;
在所述第一金属层上形成的第二金属层,其中所述第二金属层具有暴露所述第一金属层的顶表面的开口;以及
位于所述开口中且在所述第一金属层的所述顶表面上的导电层。
16.根据权利要求15所述的显示面板,其特征在于,所述第二金属层具有500到1000埃的厚度。
17.根据权利要求15所述的显示面板,其特征在于,所述第一金属层包括源极/漏极电极层,以及所述导电层在显示阶段作为公共电极且在触控阶段作为触控电极。
18.根据权利要求15所述的显示面板,其特征在于,还包括在所述第二金属层上的隔离层,其中所述隔离层具有另一开口,所述另一开口与所述第二金属层的所述开口对准。
19.根据权利要求18所述的显示面板,其特征在于,所述导电层位于所述隔离层的顶表面上、所述隔离层的所述另一开口和所述第二金属层的所述开口的侧壁上以及所述第一金属层的暴露的所述顶表面上。
20.根据权利要求15或18所述的显示面板,其特征在于,所述第一金属层包括Ti/Al/Ti叠层或Mo/Al/Mo叠层,所述第二金属层包括Al或Ag,以及所述导电层包括透明导电层。
21.根据权利要求20所述的显示面板,其特征在于,所述第一金属层包括Ti/Al/Ti叠层以及所述第二金属层包括Al。
22.根据权利要求21所述的显示面板,其特征在于,所述透明导电层包括ITO。
23.根据权利要求18所述的显示面板,其特征在于,所述隔离层包括树脂。
24.一种显示装置,其特征在于,包括权利要求15-23中任一项所述的显示面板。
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US10290659B2 (en) | 2019-05-14 |
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