CN105789100B - 用于半导体封装系统的引线框架夹取系统 - Google Patents
用于半导体封装系统的引线框架夹取系统 Download PDFInfo
- Publication number
- CN105789100B CN105789100B CN201610330825.9A CN201610330825A CN105789100B CN 105789100 B CN105789100 B CN 105789100B CN 201610330825 A CN201610330825 A CN 201610330825A CN 105789100 B CN105789100 B CN 105789100B
- Authority
- CN
- China
- Prior art keywords
- cylinder
- clamping jaw
- lead frame
- clamp device
- feeding clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 210000000078 claw Anatomy 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610330825.9A CN105789100B (zh) | 2016-05-17 | 2016-05-17 | 用于半导体封装系统的引线框架夹取系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610330825.9A CN105789100B (zh) | 2016-05-17 | 2016-05-17 | 用于半导体封装系统的引线框架夹取系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105789100A CN105789100A (zh) | 2016-07-20 |
CN105789100B true CN105789100B (zh) | 2018-11-13 |
Family
ID=56379147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610330825.9A Active CN105789100B (zh) | 2016-05-17 | 2016-05-17 | 用于半导体封装系统的引线框架夹取系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105789100B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108313722A (zh) * | 2017-01-18 | 2018-07-24 | 罗伊力尔(苏州)智能科技有限公司 | 料盘输送抓手 |
CN108323149A (zh) * | 2017-01-18 | 2018-07-24 | 罗伊力尔(苏州)智能科技有限公司 | 贴片机送料装置 |
CN111244002B (zh) * | 2020-03-25 | 2022-07-29 | 铜陵富仕三佳机器有限公司 | 一种用于ic芯片封装的抓取机械手 |
CN112509957B (zh) * | 2020-12-09 | 2024-09-24 | 上海技垚科技有限公司 | 一种引线框架自动在料盒与托盘间搬运设备 |
CN115020294A (zh) * | 2022-06-10 | 2022-09-06 | 华羿微电子股份有限公司 | 多排引线框架上料装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1361055A (zh) * | 2000-12-28 | 2002-07-31 | 喷气技术株式会社 | 输送半导体引线板条的传送带 |
CN101386170A (zh) * | 2007-09-13 | 2009-03-18 | 铜陵三佳科技股份有限公司 | 一种引线框架抓取机械手 |
CN201573205U (zh) * | 2010-01-12 | 2010-09-08 | 铜陵三佳科技股份有限公司 | 气爪机械手 |
CN103295942A (zh) * | 2012-02-28 | 2013-09-11 | 无锡华润安盛科技有限公司 | 引线框阵列的上料系统 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710211A (ja) * | 1993-06-30 | 1995-01-13 | Hitachi Ltd | 移換装置 |
KR20030008618A (ko) * | 2001-07-19 | 2003-01-29 | 삼성전자 주식회사 | 성형 장치용 리드 프레임 이송 장치 |
-
2016
- 2016-05-17 CN CN201610330825.9A patent/CN105789100B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1361055A (zh) * | 2000-12-28 | 2002-07-31 | 喷气技术株式会社 | 输送半导体引线板条的传送带 |
CN101386170A (zh) * | 2007-09-13 | 2009-03-18 | 铜陵三佳科技股份有限公司 | 一种引线框架抓取机械手 |
CN201573205U (zh) * | 2010-01-12 | 2010-09-08 | 铜陵三佳科技股份有限公司 | 气爪机械手 |
CN103295942A (zh) * | 2012-02-28 | 2013-09-11 | 无锡华润安盛科技有限公司 | 引线框阵列的上料系统 |
Also Published As
Publication number | Publication date |
---|---|
CN105789100A (zh) | 2016-07-20 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Lead frame clamping system used in semiconductor packaging system Effective date of registration: 20190618 Granted publication date: 20181113 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2019340000311 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210705 Granted publication date: 20181113 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2019340000311 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Lead frame clamping system for semiconductor packaging systems Effective date of registration: 20230710 Granted publication date: 20181113 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2023980047837 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20181113 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2023980047837 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |