CN105785160B - 用于半导体制造设备的测试方法 - Google Patents
用于半导体制造设备的测试方法 Download PDFInfo
- Publication number
- CN105785160B CN105785160B CN201510929289.XA CN201510929289A CN105785160B CN 105785160 B CN105785160 B CN 105785160B CN 201510929289 A CN201510929289 A CN 201510929289A CN 105785160 B CN105785160 B CN 105785160B
- Authority
- CN
- China
- Prior art keywords
- test
- connector
- probe
- test object
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015003527A JP6367124B2 (ja) | 2015-01-09 | 2015-01-09 | 半導体製造装置のテスト方法 |
JP2015-003527 | 2015-01-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105785160A CN105785160A (zh) | 2016-07-20 |
CN105785160B true CN105785160B (zh) | 2019-08-30 |
Family
ID=56367391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510929289.XA Active CN105785160B (zh) | 2015-01-09 | 2015-12-15 | 用于半导体制造设备的测试方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9733273B2 (zh) |
JP (1) | JP6367124B2 (zh) |
CN (1) | CN105785160B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11031713B2 (en) * | 2017-09-11 | 2021-06-08 | Smiths Interconnect Americas, Inc. | Spring probe connector for interfacing a printed circuit board with a backplane |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6194908B1 (en) * | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
CN102879618A (zh) * | 2012-09-29 | 2013-01-16 | 郑礼朋 | 测试机构及其制作方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1310693C (en) * | 1988-01-27 | 1992-11-24 | Manfred Prokopp | Electrical connecting apparatus for an electrical or electronic testing unit |
US5072185A (en) * | 1990-11-13 | 1991-12-10 | Cablescan, Inc. | Wire harness modular interface adapter system and testing apparatus |
JPH0675008A (ja) | 1992-08-28 | 1994-03-18 | Nec Corp | 集積回路試験用治具 |
JP2000167203A (ja) * | 1998-12-08 | 2000-06-20 | Fuji Shoji:Kk | 遊技機用プリント基板 |
US6763157B1 (en) * | 2000-05-09 | 2004-07-13 | Teraconnect, Inc. | Self aligning optical interconnect with multiple opto-electronic devices per fiber channel |
JP2003037379A (ja) | 2001-07-25 | 2003-02-07 | Toyo Commun Equip Co Ltd | プリント基板の接続構造 |
JP2003346963A (ja) | 2002-05-27 | 2003-12-05 | Citizen Electronics Co Ltd | 電気コネクタ |
US6843658B2 (en) | 2002-04-02 | 2005-01-18 | Citizen Electronics Co., Ltd. | Electric connector for connecting electronic instruments |
JP3942497B2 (ja) * | 2002-06-25 | 2007-07-11 | オリンパス株式会社 | 光スイッチ |
CN2697652Y (zh) * | 2004-03-23 | 2005-05-04 | 富士康(昆山)电脑接插件有限公司 | 同轴连接器 |
US20060079102A1 (en) * | 2004-10-13 | 2006-04-13 | The Ludlow Company Lp | Cable terminal with flexible contacts |
US20060152908A1 (en) * | 2005-01-13 | 2006-07-13 | Viktors Berstis | Mobile computer attachment apparatus |
US7790987B2 (en) * | 2005-04-27 | 2010-09-07 | Sony Computer Entertainment Inc. | Methods and apparatus for interconnecting a ball grid array to a printed circuit board |
TW200643704A (en) * | 2005-06-01 | 2006-12-16 | Benq Corp | Testing apparatus and method thereof |
JP4743708B2 (ja) * | 2006-04-27 | 2011-08-10 | 京セラ株式会社 | 接続装置、接続ユニット及び接続方法 |
JP2007315937A (ja) | 2006-05-26 | 2007-12-06 | Renesas Technology Corp | 半導体検査システム |
JP4845685B2 (ja) * | 2006-11-15 | 2011-12-28 | 日立オートモティブシステムズ株式会社 | 端子の接続構造及び端子の接続方法、並びに制御装置 |
US7379641B1 (en) * | 2007-05-01 | 2008-05-27 | Advanced Inquiry Systems, Inc. | Fiber-based optical alignment system |
US7733102B2 (en) * | 2007-07-10 | 2010-06-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ultra-fine area array pitch probe card |
JP2009052910A (ja) * | 2007-08-23 | 2009-03-12 | Elpida Memory Inc | 半導体検査治具、これを備えた半導体検査装置及び半導体検査方法 |
JP5203785B2 (ja) * | 2008-04-16 | 2013-06-05 | 大西電子株式会社 | 検査治具 |
JP2013540354A (ja) * | 2010-09-28 | 2013-10-31 | アドバンスド インクワイアリー システムズ インコーポレイテッド | ウエハテストシステムならびに関連する使用方法および製造方法 |
JP6266209B2 (ja) * | 2012-12-25 | 2018-01-24 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
EP3101739B1 (en) * | 2015-06-05 | 2022-05-11 | ODU GmbH & Co. KG | Electrical connector with plug and socket |
-
2015
- 2015-01-09 JP JP2015003527A patent/JP6367124B2/ja active Active
- 2015-12-15 CN CN201510929289.XA patent/CN105785160B/zh active Active
- 2015-12-22 US US14/979,366 patent/US9733273B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6194908B1 (en) * | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
CN102879618A (zh) * | 2012-09-29 | 2013-01-16 | 郑礼朋 | 测试机构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20160202293A1 (en) | 2016-07-14 |
JP2016128784A (ja) | 2016-07-14 |
CN105785160A (zh) | 2016-07-20 |
JP6367124B2 (ja) | 2018-08-01 |
US9733273B2 (en) | 2017-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170320 Address after: Gumma Applicant after: Renesas semiconductor packaging and testing solutions Limited by Share Ltd Address before: Tokyo, Japan Applicant before: Renesas Electronics Corporation |
|
TA01 | Transfer of patent application right | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171130 Address after: yamagata Applicant after: Mike SEER System Technology Co., Ltd. Address before: Gumma Applicant before: Renesas semiconductor packaging and testing solutions Limited by Share Ltd |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | "change of name, title or address" |
Address after: Kanagawa, Japan Patentee after: Maccel new field Co., Ltd Address before: yamagata Patentee before: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS Co.,Ltd. |
|
CP03 | "change of name, title or address" |