CN105765645A - 柔性基底接合方法 - Google Patents

柔性基底接合方法 Download PDF

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CN105765645A
CN105765645A CN201480063024.XA CN201480063024A CN105765645A CN 105765645 A CN105765645 A CN 105765645A CN 201480063024 A CN201480063024 A CN 201480063024A CN 105765645 A CN105765645 A CN 105765645A
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姜炅秀
孔普敬
崔银姬
朴永善
李宇镇
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Corning Precision Materials Co Ltd
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Abstract

本发明涉及一种柔性基底的接合方法，更具体地，涉及一种将柔性基底接合到载体基底以有利于柔性基底的处理的接合方法。为此，本发明提供了一种柔性基底接合方法，所述柔性基底接合方法包括：基底准备步骤，用于准备载体基底和柔性基底；接合步骤，用于在利用传输单元移动载体基底的同时，将载体基底接合到通过卷绕在旋转辊周围而旋转的柔性基底，其中，接合步骤包括使柔性基底的一个边缘与载体基底接触然后沿从一侧至另一侧的方向将柔性基底逐渐地接合到载体基底。

Description

柔性基底接合方法
技术领域
本发明涉及一种用于柔性基底的接合方法，更具体地，涉及一种将柔性基底接合到载体基底以有利于柔性基底的处理的方法。
背景技术
响应于信息社会的到来，为了快速地传递各种类型的信息，对于用来显示诸如图像或图形字符的各种形式的信息的高性能显示器的需求与日俱增。根据这样的需求，近年来显示产业已呈现出快速的增长。
具体地说，由于诸如液晶显示器(LCD)、等离子体显示面板(PDP)和有机发光显示器(OLED)的平板显示器(FPD)具有大的尺寸和薄的外观且相对重量轻，所以对这样的显示器的兴趣在迅速增加。
由于对轻薄FPD的需求不断增加，所以最近已开发出具有2mm或更小的厚度的柔性基底且已将其应用在显示产业中。
然而，由于薄基底因其薄度而可能在其传输和加工期间受损或凹陷，所以单独传输和加工这样的薄基底有些困难。薄基底在被接合到支撑薄基底的载体基底之后被传输和沉积。在完成对薄基底的传输和沉积工艺之后使载体基底与薄基底分离。
图1是示出利用接合到载体基底的薄基底来制造LCD模块的工艺的概念图。如图1所示，通过在接合到载体基底的薄基底上形成滤色器(CF)和TFT阵列，随后将载体基底与薄基底分离，可以制造出LCD模块。
为了利用接合到载体基底的薄基底制造高质量显示模块，要求载体基底和薄基底之间的高接合质量。即，需要使载体基底或薄基底的接合表面内不存在捕获的空气或颗粒。
[相关技术文献]
专利文献1：第10-2007-0103162号韩国专利公布申请(2007年10月23日)
发明内容
技术问题
本发明的各个方面提供了一种能够减少被捕获在载体基底或柔性基底的接合表面中的空气的量的柔性基底的接合方法。
技术方案
在本发明的一方面，提供了一种柔性基底的接合方法，该接合方法包括：准备柔性基底和载体基底；在利用传输单元移动载体基底的同时，将卷绕在旋转的辊上的柔性基底接合到载体基底上。所述接合操作包括使柔性基底的一个边缘部分与载体基底接触并且沿从所述一个边缘部分朝着另一边缘部分的方向将柔性基底逐渐地接合到载体基底上。
在本发明的另一方面，提供了一种柔性基底的接合方法，该接合方法包括：准备柔性基底和载体基底；将柔性基底接合到载体基底上。所述接合操作包括使柔性基底的一个边缘部分与载体基底接触，并且从柔性基底上沿从所述一个边缘部分朝着另一边缘部分的方向将空气吹到柔性基底上的同时，沿所述一个边缘部分朝着另一边缘部分的方向将柔性基底逐渐地接合到载体基底上。
发明效果
根据如上所述的本发明，通过逐渐地将柔性基底接合到载体基底能够减少被捕获在柔性基底或载体基底的接合表面中的空气的量。
此外，由于接合操作在真空中执行，所以即使在接合到载体基底的柔性基底在真空气氛中经受后处理的情况下，也能够减少被捕获在柔性基底与载体基底之间的空气的膨胀。
附图说明
图1是示出利用接合到载体基底的薄基底来制造LCD模块的工艺的概念图。图2是示出根据本发明的第一示例性实施例的用于柔性基底的接合方法的示意性流程图。
图3示出柔性基底均接合到载体基底的对比示例和发明示例的照片。
图4和图5是示出根据本发明的第一示例性实施例的旋转辊的示意性透视图。
图6是示出根据本发明的第二示例性实施例的用于柔性基底的接合方法的示意性流程图。
图7示出在柔性基底均接合到载体基底的对比示例和发明示例的照片。
具体实施方式
现在将详细参照根据本发明的柔性基底的接合方法，在附图中示出并在下文描述了本发明的实施例。
在本发明的以下描述中，在使本发明的主题不清楚的情况下，将省略已知的功能和组件的详细描述。
图2是示出根据本发明的第一示例性实施例的用于柔性基底的接合方法的示意性流程图。
如图2所示，根据本发明的第一示例性实施例的柔性基底的接合方法包括基底准备操作S110和接合操作S120。
首先，在S110，接合准备柔性基底和载体基底以将柔性基底接合到载体基底。
载体基底是为了有利于处理柔性基底而将要接合到柔性基底的基体基底。载体基底可以由玻璃形成。为了有利于载体基体与接合载体基底接合到的柔性基底的未来的分离，可以对载体基底的将要接合到柔性基底的对应表面一个表面的外围进行斜切。具体地讲，接合以斜面切割载体基底的将要接合到柔性基底的对应表面的一个表面的外围，以便在载体基底和接合到载体基底的柔性基底之间形成凹槽。之后，可以利用凹槽使柔性基底更容易地从载体基底分离。
柔性基底指柔性的或可弯曲的或者可以卷绕在辊上的基底。柔性基底可以是具有0.2mm或更小厚度的薄玻璃基底。柔性基底可以用作在其上形成滤色器或薄膜晶体管(TFT)阵列的背衬。
之后，在S120，利用载体传输载体基底并将载体基底接合到卷绕在正旋转的辊上的柔性基底接合。这里，将载体基底接合到柔性基底的操作包括使柔性基底的一个边缘部分与载体基底接触并且沿从所述一个边缘部分朝着面对一个边缘部分的另一边缘部分的方向将柔性基底逐渐地接合到载体基底。
具体地讲，随着传输单元移动载体基底，载体基底在旋转辊下方的位置与卷绕在旋转辊上的柔性基底的一个边缘部分相接触。随着进一步移动载体基底和辊旋转，柔性基底沿从柔性基底的一个边缘部分至另一边缘部分的方向逐渐地接合到载体基底。随着载体基底和柔性基底彼此相接触，载体基底和柔性基底因在边界表面上出现的范德华力和/或毛细作用而接合到彼此。
传输单元用于将载体基底朝向卷绕在旋转的辊上的柔性基底移动并且可以实现为诸如传送带或传输辊等的各种装置。
辊设置在传输单元的上方，用于使卷绕在其上卷绕柔性基底旋转。
辊利用单独的旋转电机旋转(未示出)。辊的转速必须与由传输单元移动的载体基底的速度同步。此外，辊可以向上地或向下地运动。
如上所述，柔性基底沿从柔性基底的一个边缘部分朝向另一边缘部分的方向逐渐地接合到载体基底。因此，这能够防止空气被捕获在柔性基底或载体基底的接合表面中。
图3中的(a)示出通过相关技术的方法将柔性基底手动地接合到载体基底的对比示例的照片，图3中的(b)示出通过根据本发明的第一示例性实施例的方法将柔性基底接合到载体基底的发明示例的照片。将图3的(a)与(b)进行比较，将理解的是，当柔性基底和载体基底通过根据本发明的第一示例性实施例的方法而不是通过相关技术的方法接合到彼此时，捕获在柔性基底或载体基底的接合表面中的空气的量显著地减少。
如图4和图5所示，在本发明的第一示例性实施例中采用的辊在其主体的外圆周上可以具有凹部。
凹部可以形成在如图4所示的辊的中部上或者在如图5所示的辊的相对端部上。
由于使在其上卷绕的柔性基底旋转的辊的外圆周上形成了凹部，所以能够使柔性基底和辊彼此邻接的面积最小化，从而减少由辊引起的对柔性基底的诸如划痕的损伤。
考虑到柔性基底和辊彼此邻接的面积的最小化及辊对柔性基底的可靠支撑，优选的是，辊的邻接柔性基底的凸部的宽度在柔性基底的宽度的1/5至1/3的范围内。
此外，多个空气喷嘴10形成在辊的凹部中。
当柔性基底与载体基底接触时，多个空气喷嘴10将空气吹到柔性基底的未被辊支撑的部分上，使得柔性基底牢固地邻接载体基底。
此外，能够产生静电的多个静电放电(ESD)卡盘(未示出)可以设置在辊的外圆周上。
优选的是，按规则的距离设置多个ESD卡盘，以在辊的外圆周上以规则的距离产生静电卡盘。
多个ESD卡盘响应于施加到其上的功率而产生静电，从而使卷绕在辊上的柔性基底可以更稳固地固定到辊。
此外，接合操作S120可以包括：在将柔性基底接合到载体基底之前释放施加到将要接合到载体基底的柔性基底的静电，使得柔性基底和载体基底可以容易地接合到彼此。具体地讲，在将柔性基底接合到载体基底之前，按柔性基底的将要接合到载体基底的对应部分的次序顺序地停止多个ESD卡盘产生静电的操作和将静电施加到柔性基底的对应部分的操作，使得柔性基底可以容易地接合到载体基底。
图6是示出根据本发明的第二示例性实施例的用于柔性基底的接合方法的示意性流程图。
如图6所示，根据本发明的第二示例性实施例的柔性基底的接合方法包括基底准备操作S210和接合操作S220。
首先，在步骤S210，如上描述的，接合准备载体基底和柔性基底以将柔性基底接合到载体基底。
由于基底准备操作S210与上述第一示例性实施例的基底准备操作S110相同，所以将省略基底准备操作S210的描述。
之后，在S220，使柔性基底的一个边缘部分与载体基底接触，并且通过从柔性基底上方沿从一个边缘部分朝着另一边缘部分的方向将空气吹到柔性基底上来使柔性基底沿从一个边缘部分朝着另一边缘部分的方向逐渐地接合到载体基底。
具体地讲，在仅使柔性基底的一个边缘部分与载体基底接触之后，将空气从柔性基底的上方沿从一个边缘部分朝着另一边缘部分的方向吹到柔性基底上，使得柔性基底沿从一个边缘部分朝着另一边缘部分的方向逐渐地接合到载体基底。这里，利用气刀执行吹气操作。
因此，通过利用从柔性基底上方吹出的空气压力将柔性基底逐渐地接合到载体基底，能够防止空气被捕获在柔性基底或载体基底的接合表面中。
图7中的(a)示出通过相关技术的接合方法将柔性基底手动地接合到载体基底的对比示例的照片，图7中的(b)示出根据本发明的第二示例性实施例将柔性基底接合到载体基底的发明示例的照片。将图7的(a)与(b)进行比较，将理解的是，当柔性基底和载体基底通过根据发明的第二示例性实施例的方法而不是通过相关技术的手工工艺接合到彼此时，捕获在柔性基底或载体基底的接合表面中的空气的量显著地减少。
在根据发明的第一示例性实施例或第二示例性实施例的将柔性基底接合到载体基底的方法中，接合操作S120/S210可以在真空气氛中执行。
由于接合操作S120/S210在真空气氛中执行，所以即使在接合到载体基底的柔性基底经受真空气氛处理的情况下，也能够防止被捕获在载体基底和柔性基底之间的空气膨胀。
例如，在真空气氛中执行在柔性基底上形成滤色器或者薄膜晶体管(TFT)阵列的工艺。当在将柔性基底和载体基底彼此接合之后在真空气氛中执行这样的工艺时，被捕获在载体基底和柔性基底之间的空气的体积通过公式V2＝(P1/P2)(1/r)×V1膨胀约106倍，其中，V表示体积，P表示压力，r表示比热比。被捕获的空气的体积的膨胀破坏载体基底和柔性基底之间的接合，使得例如不能执行在柔性基底上形成滤色器或TFT阵列的工艺。相比之下，当在真空压力为10-2托的真空气氛中将载体基底和柔性基底彼此接合时，即使工艺在真空压力为10-6托的真空气氛中执行工艺的情况下，被捕获在载体基底和柔性基底之间的空气的体积也仅膨胀约103倍。
优选的是，在真空压力在从1×10-3托至1×10-2托的范围内的真空气氛中执行接合操作。
已经针对附图给出了本发明的具体示例性实施例的以上描述。这些示例性实施例不意图是穷举的或者使本发明局限于公开的精确形式，并且显而易见的是，本领域普通技术人员根据以上教导能够做出许多修改和变化。
因此，本发明的范围并不意图限于前述的实施例，而是由所附权利要求和它们的等同物所限定。

Claims (9)

1.一种柔性基底的接合方法，包括：
准备载体基底和柔性基底；以及
在利用传输单元移动载体基底的同时，将卷绕在旋转的辊上的柔性基底接合到载体基底上，
其中，将柔性基底接合到载体基底上包括使柔性基底的一个边缘部分与载体基底接触，并且沿从所述一个边缘部分朝着另一边缘部分的方向将柔性基底逐渐地接合到载体基底上。
2.一种柔性基底的接合方法，包括：
准备载体基底和柔性基底；以及
将柔性基底接合到载体基底上，
其中，将柔性基底接合到载体基底上包括使柔性基底的一个边缘部分与载体基底接触，并且从柔性基底上方沿从所述一个边缘部分朝着另一边缘部分的方向将空气吹到柔性基底上的同时，沿所述一个边缘部分朝着所述另一边缘部分的方向将柔性基底逐渐地接合到载体基底上。
3.如权利要求1或2所述的接合方法，其中，将柔性基底接合到载体基底上是在真空气氛中执行的。
4.如权利要求3所述的接合方法，其中，真空气氛的真空压力在从1×10-3托至1×10-2托的范围内。
5.如权利要求1所述的接合方法，其中，辊包括位于所述辊的外表面上的凹部。
6.如权利要求5所述的接合方法，其中，多个空气喷嘴设置在辊的凹部中。
7.如权利要求6所述的接合方法，其中，凹部形成在辊的中部处或辊的两端处。
8.如权利要求6所述的接合方法，其中，辊的凸部的宽度在柔性基底的宽度的1/5至1/3的范围内。
9.如权利要求1所述的接合方法，其中，用于产生静电的多个静电放电卡盘设置在辊的外圆周上。
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