CN105739198A - 用于显示装置的阵列基板及显示装置 - Google Patents

用于显示装置的阵列基板及显示装置 Download PDF

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Publication number
CN105739198A
CN105739198A CN201510568464.7A CN201510568464A CN105739198A CN 105739198 A CN105739198 A CN 105739198A CN 201510568464 A CN201510568464 A CN 201510568464A CN 105739198 A CN105739198 A CN 105739198A
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China
Prior art keywords
pad
display device
insulating barrier
peristome
area
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CN201510568464.7A
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English (en)
Inventor
姜链旭
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LG Display Co Ltd
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LG Display Co Ltd
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Publication of CN105739198A publication Critical patent/CN105739198A/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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Abstract

本公开提供了一种用于显示装置的阵列基板及显示装置，该阵列基板包括：基板；位于基板上的焊盘；位于焊盘上并且包括露出焊盘的多个开口部的绝缘层；位于绝缘层上并且设置为接触焊盘的第一金属层；位于第一金属层上的第二金属层；以及位于第二金属层上并且包括多个凹坑的凸起电极。

Description

用于显示装置的阵列基板及显示装置
技术领域
本发明涉及用于显示装置的阵列基板以及显示装置，并且更具体地涉及防止凸起与驱动芯片之间的接触缺陷的用于显示装置的阵列基板以及显示装置。
背景技术
通常，液晶显示(LCD)装置使用液晶的光学各向异性和极化特性来驱动。液晶在结构上又细又长且具有沿分子排列的取向，并且液晶的分子排列的取向可以通过有意地将电场施加至液晶来控制。因此，当任意调整液晶的分子排列的取向时，可以改变液晶的分子排列并且由于光学各向异性而使光沿朝向液晶的分子排列的方向折射，从而呈现图像信息。
具有有源矩阵结构的LCD已经突显出来，在有源矩阵结构中薄膜晶体管(TFT)和连接至TFT的像素电极以矩阵形式布置以获得极好的分辨率和视频实现能力。该LCD包括：其上形成有公共电极的滤色镜基板；其上形成有像素电极的阵列基板；以及介于所述两个基板之间的液晶。在该LCD中，公共电极和像素电极通过上下施加的电场来驱动液晶，从而表现极好的特性(例如，透光率和长宽比)。
图1是示出相关技术的用于显示装置的阵列基板的平面图，图2是示出凸起的截面图，图3是示出凸起的平面图，图4是凸起的扫描电子显微镜(SEM)图像，图5是接合有驱动芯片的凸起的图像，图6是凸起与驱动芯片的压痕的图像，以及图7是示出有缺陷的显示装置的图像。
参照图1，相关技术的用于显示器的阵列基板10包括显示图像的显示区11(有源区A/A)、以及除了显示区11之外的非显示区12。在非显示区12中设置有玻璃上芯片(ChipOnGlass，COG)装置13，并且用于施加驱动信号的驱动芯片(D-IC)接合至COG装置13；以及在非显示区12中设置有柔性印刷电路(FPC)焊盘装置14，并且用于将外部驱动信号施加至驱动芯片的FPC附接至FPC焊盘装置14。在COG装置13中设置有连接至驱动芯片的多个凸起20。
参照图2，位于COG装置13中的凸起20包括位于基板21上的焊盘22和连接至焊盘22的凸起电极27。具体地，焊盘22位于基板21上，并且设置有包括露出焊盘22的开口部24的绝缘层23。在通过绝缘层23的开口部24露出的焊盘22上设置有第一金属层25和第二金属层26。第一金属层25包含钛合金，并且第二金属层26包含金(Au)，以增强对于焊盘22的粘合。凸起电极27位于第二金属层26上并且电连接至焊盘22。
一同参照图3和图4，如上所述配置的凸起20由于绝缘层23的厚度与开口部24的高度之间的差而在凸起电极27中具有凹坑28。凸起电极27的凹坑28形成为对应于绝缘层23的厚度与开口部24的高度之间的差，并且凹坑28的平面面积形成为对应于开口部24的面积。
参照图5和图6，当驱动芯片通过各向异性导电膜(ACF)接合至包括其上形成有凹坑的凸起的COG装置时，ACF的导电球不能被压至其上形成有凹坑的凸起。因此，如图6所示，在基板的背表面中观察到凸起的压痕缺陷，因而确定凸起与驱动芯片接触具有缺陷。在凸起与驱动芯片接触具有缺陷的情况下，出现了如图7所示的显示缺陷。显示装置的显示缺陷降低了生产率。
发明内容
本发明的一个目的是提供一种防止凸起与驱动芯片之间接触具有缺陷的用于显示装置的阵列基板以及显示装置。
为了获得根据本发明的目的的这些以及其他优点，实施并概括地描述了用于显示装置的阵列基板，该阵列基板包括：基板；位于基板上的焊盘；位于焊盘上并且包括露出焊盘的多个开口部的绝缘层；位于绝缘层上并且设置为接触焊盘的第一金属层；位于第一金属层上的第二金属层；以及位于第二金属层上并且包括多个凹坑的凸起电极。
所述多个开口部中的至少之一具有等于或大于5μm的宽度以及等于或大于10μm的长度。
所述多个开口部之间的间距等于或大于4μm。
绝缘层与凸起电极接触的接合面积等于或大于1500μm2，并且所述多个开口部的面积等于或大于接合面积的15％。
所述多个开口部形成为多条线或多个点。
在一个方面，显示装置包括：基板，该基板包括非显示区和显示图像的显示区；以及位于非显示区中并且包括多个凸起的玻璃上芯片(COG)装置，其中所述多个凸起各自包括：位于基板上的焊盘；位于焊盘上并且包括露出焊盘的多个开口部的绝缘层；位于绝缘层上并且设置为接触焊盘的第一金属层；位于第一金属层上的第二金属层；以及位于第二金属层上并且包括多个凹坑的凸起电极。
所述多个开口部中的至少之一具有等于或大于5μm的宽度以及等于或大于10μm的长度。
所述多个开口部之间的间距等于或大于4μm。
绝缘层与凸起电极接触的接合面积等于或大于1500μm2，并且所述多个开口部的面积等于或大于接合面积的15％。
所述多个开口部形成为多条线或多个点。
附图说明
本申请包括附图以提供对本发明的进一步理解并且附图被并入本说明书中并构成本说明书的一部分，附图示出本发明的实施方案，并且与描述一起用于说明本发明的原理。在附图中：
图1是示出相关技术的用于显示装置的阵列基板的平面图；
图2是示出凸起的截面图；
图3是示出凸起的平面图；
图4是凸起的扫描电子显微镜(SEM)图像；
图5是接合有驱动芯片的凸起的图像；
图6是凸起与驱动芯片的压痕的图像；
图7是示出有缺陷的显示装置的图像；
图8是示出根据本发明一个实施方案的用于显示装置的阵列基板的平面图；
图9是示出根据本发明一个实施方案的凸起的截面图；
图10是根据本发明一个实施方案的凸起的示意图；
图11是示出根据本发明一个实施方案的设置在凸起中的绝缘层的开口部的平面图；
图12A至图12H是示出用于制造根据本发明一个实施方案的凸起的方法的顺序过程的截面图；
图13和图14是根据本发明一个实施方案的根据用于显示装置的阵列基板的绝缘层和开口部的尺寸的凸起的图像；
图15是示出多个凸起的最低点与最高点的测量高度的图像。
具体实施方式
在下文中，将参照附图详细描述本发明的实施方案。
图8是示出根据本发明一个实施方案的用于显示装置的阵列基板的平面图，图9是示出根据本发明一个实施方案的凸起的截面图，图10是根据本发明一个实施方案的凸起的示意图，以及图11是示出根据本发明一个实施方案的设置在凸起中的绝缘层的开口部的平面图。在下文中，将作为显示装置的示例示出并描述液晶显示(LCD)装置，但是本发明不限于此并且本发明还可以应用于任何其他平板显示装置，例如有机发光显示装置或电泳显示装置。
参照图8，根据本发明一个实施方案的用于显示装置的阵列基板100包括显示区110和非显示区120。显示区110为其中液晶层形成在薄膜晶体管(TFT)阵列基板与滤色器基板之间以显示图像的有源区A/A。
在显示区110的滤色器基板上设置有黑矩阵和滤色器。在TFT阵列基板上形成有彼此交叉的数据线和栅极线(或扫描线)，并且在由数据线和栅极线限定的单元区中以矩阵形式设置有像素。显示区110的每个像素连接至TFT并且由像素电极和公共电极之间的电场驱动。在诸如扭曲向列(TN)模式和垂直对准(VA)模式的垂直场驱动模式中，公共电极形成在滤色器基板上，而在诸如面内切换(IPS)模式或边缘场切换(FFS)模式的面内场驱动模式中，公共电极与像素电极一起形成在TFT基板上。显示区110的液晶模式可以实现为任何其他模式以及实现为上述的TN模式、VA模式、IPS模式和FFS模式。
通常，可以将调制来自背光装置的光的透射式液晶显示面板选为显示区110。背光装置包括：根据由背光装置驱动装置提供的驱动电流来开启的光源；导光板(或扩散板)；以及多个光学片。背光装置可以分为直接型背光装置或边缘型背光装置。背光装置的光源可以包括热阴极荧光灯(HCFL)、冷阴极荧光灯(CCFL)、外部电极荧光灯(EEFL)和发光二极管(LED)中的任何一个或两个或更多个光源。
在非显示区120中，设置有玻璃上芯片(COG)装置130和柔性印刷电路(FPC)焊盘装置140，其中用于将驱动信号施加至显示区110的驱动芯片(D-IC)接合至COG装置130，并且用于将外部驱动信号施加至COG装置130的FPC附接至FPC焊盘装置140。COG装置130包括连接至从显示区110延伸出的数据信号线的凸起以及连接至从FPC焊盘装置140延伸出的外部信号线的凸起。这些凸起200接合至驱动芯片，并且通过驱动芯片来调整通过外部信号施加至数据信号线的数据信号。
在下文中，将描述前述凸起的结构。
参照图9，根据本发明一个实施方案的凸起200包括焊盘220和电连接至焊盘220的凸起电极270。具体地，焊盘220位于基板210上。连接至从显示区延伸出的数据信号线或连接至从FPC焊盘装置延伸出的外部信号线的焊盘220包含低电阻金属例如铝(Al)。在焊盘220上设置有具有露出焊盘220的一部分的开口部240的绝缘层230。绝缘层230使邻近的相邻焊盘220绝缘并且包括硅氧化物(SiOx)或硅氮化物(SiNx)、或其多层。此外，绝缘层230还可以包括有机物质如聚酰亚胺或丙烯酸树脂。
在通过绝缘层230的开口部240露出的焊盘220上设置有第一金属层250。第一金属层250接触焊盘220，第一金属层250穿过绝缘层230的表面形成并且用于增强对于第二金属层260的粘合。第一金属层250包含钛(Ti)、钨(W)、钯(Pd)或其合金，并且第一金属层250的厚度可以在1nm至1000nm的范围内。在第一金属层250上设置有第二金属层260。第二金属层260具有与第一金属层250的尺寸相同的尺寸，并且第二金属层260与第一金属层250重叠。第二金属层260用于增强对于随后将形成的凸起电极的粘合，并且第二金属层260由与凸起电极的金属相同的金属形成。例如，第二金属层260包含金(Au)。第二金属层260的厚度在1nm至1000nm的范围内，该厚度范围与第一金属层250的厚度范围相同。
在第二金属层260上设置有凸起电极270。凸起电极270通过第一金属层250和第二金属层260电连接至焊盘220，并且凸起电极270基本上接触驱动芯片。凸起电极270具有与第一金属层250和第二金属层260的尺寸相同的尺寸，并且凸起电极270包含低电阻金属例如金(Au)等。凸起电极270通过电镀形成并且其厚度在1nm至1000nm的范围内。
凸起200包括在绝缘层230中的多个开口部240以及在凸起电极270中的多个凹坑280。相关技术的凸起具有在绝缘层中的单个开口部，因此由于绝缘层的厚度与开口部的深度之间的差形成了具有大面积的凹坑。因此，在压制过程期间，ACF的导电球由于凸起电极的凹坑而未接触凸起电极，因此出现接触缺陷。因此，本申请的发明人在绝缘层230中形成了多个开口部240以减小凸起电极的凹坑的程度(即凹坑的尺寸)。
将参照图10描述减小凸起电极的凹坑的原理。具有开口部240的绝缘层230位于焊盘220上，并且在绝缘层230周围设置有光致抗蚀剂图案PR。当在绝缘层230上形成多个第一、第二和第三层时，首先形成的第一层A的凹坑AD由于绝缘层230的厚度与开口部240的高度之间的差而形成为是深的，但是凹坑的尺寸在一定程度上减小。形成在第一层A上的第二层B具有比第一层A的凹坑AD薄且小的凹坑BD。形成在第二层B上的第三层C具有比第二层B的凹坑BD薄且小的凹坑CD。随着开口部240的宽度变小，凹坑的深度和尺寸减小。即，当绝缘层230的开口部240的宽度和尺寸减小时，凸起电极270的凹坑280的尺寸和深度也减小。
因此，在本实施方案中，在绝缘层230中设置有多个开口部240。在下文中，将参照图11描述在绝缘层230中形成的开口部240的形状。
参照图11(a)，在绝缘层230中设置有多个开口部240。由绝缘层230的宽度X和长度Y限定的面积对应于在绝缘层230上的凸起电极与绝缘层230接触的接合面积。绝缘层230与凸起电极接合的接合面积即由宽度X和长度Y限定的接合面积等于或大于1500μm2，以确保绝缘层230与凸起电极的最小接合可靠性。设置有至少两个开口部240，并且这些开口部240的宽度W、长度L和间距P满足预定条件。具体地，开口部240的宽度W等于或大于5μm，长度L等于或大于10μm，并且间距P等于或大于4μm。此外，面积((W×L)×3)可以等于或大于接合面积(X×Y)的15％。在开口部240的这样的宽度W、长度L、间距P和面积的条件下凸起电极与焊盘之间的焊盘电阻被保持而未增加。此外，在开口部240的宽度W、长度L、间距P和所述面积的条件下，保持剪切强度等于或大于7.8mgf/μm2使得当接合驱动芯片时绝缘层230可以不受损。
参照图11(b)，可以设置点形状的开口部240，以及参照图11(c)，点形状的开口部240可以线性地设置在线性接合区中。在本实施方案中，描述了在图11(a)至图11(c)中示出的开口部的形状，但是本发明不限于此，并且开口部可以具有任意形状，只要开口部满足前述条件即可。
如上所述，在用于显示装置的阵列基板中设置的凸起中，由于在绝缘层中设置有多个开口部，因此凸起电极的凹坑减小并且凸起电极对于驱动芯片的接合可靠性增强，从而改善了显示缺陷。
在下文中，将描述用于制造根据本发明一个实施方案的凸起的方法。图12A至图12H是示出用于制造根据本发明一个实施方案的凸起的方法的顺序过程的截面图。在下面的描述中，相同的附图标记将用于与图9中的凸起的部件相同的部件以便于理解。
参照图12A，通过溅射在基板210上沉积低电阻金属例如铝(A1)，并且图案化以形成焊盘220。通过化学气相沉积(CVD)或等离子体增强化学气相沉积(PECVD)在其上形成有焊盘220的基板210上沉积硅氧化物(SiOx)或硅氮化物(SiNx)。使用光刻法形成露出焊盘220的部分的多个开口部240。由于已经描述了开口部240的尺寸和面积的细节，因此将省略其描述。
接下来，参照图12B，通过溅射在其上形成有多个开口部240的基板210上沉积钛(Ti)、钨(W)、钯(Pd)或其合金以形成第一金属层250。第一金属层250形成在绝缘层230、焊盘220和开口部240的表面上。形成的第一金属层250的厚度在1nm至1000nm的范围内。
其后，参照图12C，通过溅射在其上形成有第一金属层250的基板210上沉积低电阻金属例如金(Au)以形成第二金属层260。第二金属层260形成在第一金属层上并且其厚度在1nm至1000nm的范围内。
其后，参照图12D和图12E，在其上形成有第二金属层260的基板210上涂覆光致抗蚀剂。将包含有开口OP的掩模M在基板210上对准并且将紫外线UV辐照至掩模M上以曝光并显影光致抗蚀剂PR。因此，光致抗蚀剂PR被图案化使得露出绝缘层230的开口部240，如图12F所示。
其后，参照图12G，使用电镀在其上形成有光致抗蚀剂PR的基板210上在第二金属层260上形成凸起电极270。随后，如图12H所示，光致抗蚀剂PR被剥离去除，并且使用凸起电极270作为掩模图案化第一金属层250和第二金属层260，从而制得根据本发明一个实施方案的用于显示装置的阵列基板的凸起。
图13和图14是根据本发明一个实施方案的根据用于显示装置的阵列基板的绝缘层和开口部的尺寸的凸起的图像，以及图15是示出多个凸起的最低点与最高点的测量高度的图像。
参照图13，形成的绝缘层的接合区的宽度为50μm并且长度为80μm，以及形成的三个开口部的宽度为7μm并且长度为50μm，并且所述三个开口部之间的间距为10μm。其后，在绝缘层上形成凸起电极并且结果示出凸起电极的表面是平的(平坦的)。此外，参照图14，形成的绝缘层的接合区的宽度为50μm并且长度为80μm，以及形成的三个开口部的宽度为5μm并且长度为50μm，并且所述三个开口部之间的间距为11μm。其后，在绝缘层上形成凸起电极并且结果示出凸起电极的表面是平的(平坦的)。
参照图15，在用于显示装置的阵列基板上形成了设计为具有图15中示出的规格的多个凸起。检查出凸起的最低点与最高点之间的高度差为0.68μm、0.59μm和0.28μm，上述所有高度差都包括在1.0μm以下的凹坑规格内。
通过前述试验的结果，在根据本发明一个实施方案的凸起中，由于在绝缘层中设置有多个开口部，因此凸起电极的凹坑减小并且对于驱动芯片的接合可靠性增强，从而改善了显示缺陷。
虽然已经参照许多说明性实施方案对本发明实施方案进行了描述，但是应当理解的是，本领域技术人员可以设想出许多将落入本公开内容的原理的范围内的其他修改和实施方案。更具体地，可以在本公开内容、附图和所附权利要求书的范围内对主题组合布置的组成部件和/或布置进行各种变型和修改。除了在组成部件和/或布置方面的变型和修改之外，替代性用途对于本领域技术人员来说也将是明显的。

Claims (10)

1.一种用于显示装置的阵列基板，所述阵列基板包括：
基板；
位于所述基板上的焊盘；
位于所述焊盘上并且包括露出所述焊盘的多个开口部的绝缘层；
位于所述绝缘层上并且设置为接触所述焊盘的第一金属层；
位于所述第一金属层上的第二金属层；以及
位于所述第二金属层上并且包括多个凹坑的凸起电极。
2.根据权利要求1所述的阵列基板，其中所述多个开口部中的至少之一具有等于或大于5μm的宽度以及等于或大于10μm的长度。
3.根据权利要求2所述的阵列基板，其中所述多个开口部之间的间距等于或大于4μm。
4.根据权利要求1所述的阵列基板，其中所述绝缘层与所述凸起电极接触的接合面积等于或大于1500μm2，以及所述多个开口部的面积等于或大于所述接合面积的15％。
5.根据权利要求1所述的阵列基板，其中所述多个开口部形成为多条线或多个点。
6.一种显示装置，包括：
基板，所述基板包括非显示区和显示图像的显示区；以及
位于所述非显示区中并且包括多个凸起的玻璃上芯片(COG)装置，
其中所述多个凸起各自包括：
位于所述基板上的焊盘；
位于所述焊盘上并且包括露出所述焊盘的多个开口部的绝缘层；
位于所述绝缘层上并且设置为接触所述焊盘的第一金属层；
位于所述第一金属层上的第二金属层；以及
位于所述第二金属层上并且包括多个凹坑的凸起电极。
7.根据权利要求6所述的显示装置，其中所述多个开口部中的至少之一具有等于或大于5μm的宽度以及等于或大于10μm的长度。
8.根据权利要求7所述的显示装置，其中所述多个开口部之间的间距等于或大于4μm。
9.根据权利要求7所述的显示装置，其中所述绝缘层与所述凸起电极接触的接合面积等于或大于1500μm2，以及所述多个开口部的面积等于或大于所述接合面积的15％。
10.根据权利要求6所述的显示装置，其中所述多个开口部形成为多条线或多个点。
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