CN105723815B - 至少设有一个嵌入式精密电阻器的印刷电路板 - Google Patents
至少设有一个嵌入式精密电阻器的印刷电路板 Download PDFInfo
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Abstract
本发明涉及一种印刷电路板(1),所述印刷电路板至少设有两个连接点(3)和至少一个用于测量连接点之间电流的精密电阻器(2)。本发明旨在以较少的花费生产说明书中提及的这种类型的印刷电路板,从而使得印刷电路板在减少安装空间的同时优选地具有较长的使用寿命。根据本发明,精密电阻器在印刷电路板(11)的连接点之间延伸,从而达到了这一目标。本发明还涉及生产所述印刷电路板的相应方法。
Description
本发明涉及一种印刷电路板,所述印刷电路板至少设有两个连接点和至少一个用于测量两连接点之间电流的精密电阻器。这种设置精密电阻器作为连接点之间电流测量装置一部分的印刷电路板,在现有技术中是众所周知的。例如,所述精密电阻器由电子束焊接的铜和电阻合金制复合材料组成,所述精密电阻器作为表面贴装器件(SMD)焊接在现有电路上或者通过焊线连接。通过测量连接点之间的电压及已知的电阻值,且在20至60℃的温度范围中精密电阻器使用的材料具有极低的温度系数,通常使电阻值仅发生很小的变化,因此在连接点之间确定的电流具有较高的准确度。
这些印刷电路板的制造相对复杂而且昂贵。精密电阻器在连接点处的连接容易受到振动的影响,从而可能会降低印刷电路板的使用寿命。此外,在很多技术应用中(例如汽车、智能手机等),当今的趋势是将尺寸减到最小(“精简”),这尤其限制了用于这一用途的电器组件如印刷电路板的安装空间。
因此,本发明旨在以较少的资金制作上述类型的电路板,这样,所制造的印刷电路板在减少安装空间的同时,优选地具有较长的使用寿命。通过符合权利要求1的印刷电路板,达到本发明的目标,所述印刷电路板至少含有两个连接点和至少一个用于测量两连接点之间电流的精密电阻器,其中所述精密电阻器在印刷电路板的连接点之间延伸。所述精密电阻器在印刷电路板中的布置首先减少了安装空间,第二,大幅降低了生产成本,并降低了印刷电路对外部影响,如振动的敏感性。这使得所述印刷电路板比传统产品以花费更少、更紧凑、更耐用的方式生产。
优选的,所述印刷电路板至少含有一层绝缘材料,其中所述至少一层绝缘材料的厚度优选地处于50至2000μm的范围之间,优选地处于100至1800μm的范围之间,更优选地处于800至1600μm的范围之间。
经过证明,在所述印刷电路板上配置电子电路和/或电力电子是非常有用的。根据本发明,用于印刷电路板的制造技术特别适用于电子电路和/或电力电子技术领域,因为例如高温和高功率等级可通过导线或者嵌入印刷电路板的导体模具进行管理。
依据本发明的一个有益实施例,所述精密电阻器至少满足下列其中一个要求:
-所述精密电阻器与连接点连接。
-所述精密电阻器与连接点焊接。
-所述精密电阻器具有0.1至300毫欧姆的电阻值,优选范围是1至100毫欧姆。
-所述精密电阻器含有小于±5%的偏差,特别是小于±2%的偏差,优选的,不超过±1%的偏差。
-在20至60℃的温度之间,所述精密电阻器的电阻温度系数范围为0.1ppm/K至200ppm/K,特别是0.5ppm/K至100ppm/K,优选地1ppm/K至50ppm/K。
-所述精密电阻器由金属制成,优选地由下列元素中的至少一种金属制成:铜(Cu)、锰(Mn)、镍(Ni)、铬(Cr)、铝(Al)、硅(Si)或锡(Sn),优选地由至少含有一种下列元素的合金制成:铜(Cu)、锰(Mn)、镍(Ni)、铬(Cr)、铝(Al)、硅(Si)或锡(Sn),如锰铜、Zeranin或Isaohm。
-所述精密电阻器至少主要部分,优选全部,嵌入印刷电路板中。
-所述精密电阻器的上侧和/或下侧和/或至少一个边缘侧,优选精密电阻器的全部边缘侧,应部分,优选全部覆盖有绝缘材料。
-所述精密电阻器的上侧和/或下侧和/或至少一个边缘侧应部分,优选全部延伸,并与邻层绝缘材料的上侧和/或下侧和/或至少一个边缘侧齐平。
-所述印刷电路板和所述精密电阻器的上侧和/或下侧和/或至少一个边缘侧互相是对齐平行的。
-所述精密电阻器(可以)通过压铸工艺制造。
-所述精密电阻器被配置为扁平线的形式。
-所述精密电阻器大体上在一个平面中延伸。
-所述精密电阻器具有一个矩形横截面,其中,优选的横截面具有较大尺寸的侧面向印刷电路板的表面。
-所述精密电阻器像模具一样从板状工件中卸下来,优选地通过冲压、侵蚀或分离的方式卸下来,例如通过水射流切割的方式,其中所述模具优选地大体上形成L形、T形、H形、S形、O形、E形、F形、X形、Y形、Z形、C形、U形或Q形。
-所述精密电阻器的厚度范围是10至2000μm,特别是50至1000μm,优选地100至500μm。
本发明保护范围涵盖的精密电阻器具有各种不同的配置方案。所述精密电阻器在印刷电路板的连接点之间延伸是至关重要的,而将所述精密电阻器配置成导线、扁平线或模具形式似乎最有利于降低成本或满足制造要求。将所述精密电阻器配置成导线、扁平线或模具形式具有如下优点:在连接点上可实现较大接触表面,因此,通过所述连接,仅出现较低的功率损耗,而功率损耗可能会对电流测量造成不良影响。可以证明,所述印刷电路板含有符合以下至少一项要求的电压测量装置是有益的:
-所述电压测量装置适于测量连接点上的电压,优选地测量精密电阻器与连接点之间接触点上的电压。
-所述电压测量装置实现了HDI(高密度互连)电路,优选地具有下列至少一个特征:
o所述精密电阻器和/或连接点至少覆盖有一层绝缘材料。
o通过至少一层绝缘材料形成用于连接所述的精密电阻器的钻孔,优选的采用激光钻孔。
o所述精密电阻器通过至少一层绝缘材料,优选通过微孔连接。
o所述精密电阻器电连接。
将所述电压测量装置配置成HDI(高密度互连)电路证明,特别有利于连接至电阻特别低的精密电阻器,因为可以实现非常精密的连接。将至少一个用于测量连接点之间电流的精密电阻器在印刷电路板中延伸,通过这种制造印刷电路板的方法实现本发明的目的,该方法含有下列步骤:
-将所述精密电阻器连接至连接点。
-使用电气绝缘材料覆盖所述精密电阻器。
-采用电气绝缘的方式,实现连接点的互相隔离,从而使连接点之间的电流流经所述精密电阻器。
根据有益实施例,所述方法至少含有下列步骤中的一个:
-将所述精密电阻器焊接至连接点。
-将由绝缘材料制成的预浸材料按压至所述精密电阻器。
-通过在附在印刷电路板表面的铜箔上蚀刻的方式制定连接点和/或制作导电带,优选用于电压测量装置,其中铜箔蚀刻优选在将精密电阻器连接至连接点之后进行。
-优选通过在印刷电路板上实现HDI(高密度互连)电路制作电压测量装置,优选通过下列至少一个步骤:
o所述精密电阻器和/或连接点覆有至少一层绝缘材料。
o优选采用激光钻孔,通过至少一层绝缘材料形成一个用于连接所述精密电阻器的钻孔。
o所述精密电阻器通过至少一层绝缘材料,优选通过微孔连接。
o所述精密电阻器电连接。
本发明更多有利的发展源自公开于权利要求书、说明书、附图中的特征组合。
附图简要说明
图1根据本发明的第一个实施例,显示了印刷电路板的截面示意图,其中所述印刷电路板包括设有一层绝缘材料的基板,其中嵌入一个100毫欧姆范围内的精密电阻器,具有端部连接点的导电带在所述印刷电路板的上侧延伸,所述连接点与所述精密电阻器焊接。
图2根据本发明的第二个实施例,显示了印刷电路板的截面示意图,其中所述印刷电路板包括设有两层绝缘材料的基板,1毫欧姆范围内的精密电阻器嵌入至下层绝缘材料,具有端部连接点的导电带在绝缘材料的上层与下层之间延伸,连接点与所述精密电阻器焊接,其中所述精密电阻器通过导电带和微孔穿过上层绝缘材料实现电连接,从而以HDI电路的形式实现电压测量装置。
图中所述印刷电路板的插图是示意性的。因此,印刷电路板各组件之间的比例可能是不现实的。
优选实施例的详细描述
下文参考这些附图,对本发明的优选实施例进行了详细的说明。
第一个实施例(图1)
根据图1,本发明的第一个实施例涉及一种设有两个连接点3和一个用于测量两连接点3之间电流的精密电阻器2的印刷电路板1。根据本发明,精密电阻器2在印刷电路板1的连接点3之间延伸。印刷电路板1含有一层绝缘材料4,其厚度大约为1000μm,精密电阻器2嵌入其中。精密电阻器2的下侧、所有边缘侧和上侧的主要部分全部覆盖有绝缘材料4。精密电阻器2的上侧至少部分,特别是在与连接点3连接的端部,延伸至与绝缘材料4周围和邻近层的上侧齐平。印刷电路板1上配置有,例如,电子电路和/或电力电子(未显示)。焊接至两个连接点3的精密电阻器2被配置为锰铜扁平线,其电阻值约为100毫欧姆,且偏差不超过±5%。在20至60℃的温度范围内,精密电阻器2的电阻温度系数为5ppm/K左右。精密电阻器2形成扁平线的横截面为矩形,厚度大约为100μm,宽度为500μm左右,横截面较大尺寸一侧面向印刷电路板1的表面。这使得两个连接点3与精密电阻器2之间的接触面积变大。
电压测量装置(未显示)适于读取连接点3上的电压,并在精密电阻器2与连接点3之间的接触点上直接测量该电压。本发明精确限定了两个接触点之间的距离。由于精密电阻器2的电阻已知,且在相关的温度范围内非常恒定,因此可非常精确地测定连接点3之间的电流。根据本发明,用于制造设有在印刷电路板1中延伸且用于测量连接点3之间电流的精密电阻器2的印刷电路板1的方法包括下列步骤:
步骤a:在预定连接点3上利用厚度约为35μm的铜箔焊接厚度大约为100μm,宽度为500μm的精密电阻器2。
步骤b:在铜箔的侧面涂敷一层绝缘材料4,所述铜箔与精密电阻器2通过按压由绝缘材料制成的预浸材料的方式连接。
步骤c:通过在附在印刷电路板1表面或附在绝缘材料层4上的铜箔上蚀刻的方式,制定连接点3和/或制定导电带,例如用于电压测量装置,从而使连接点3互相之间电气绝缘,这样,连接点3之间的电流则流经精密电阻器2。
为了避免重复说明,对于相同的元件,下文使用相同的参考数字。
第二个实施例(图2)
根据图2,本发明的第二个实施例基本上以上文所述的第一个实施例(见图1)为基础。根据本发明第二个实施例的印刷电路板1,其目的特别在于低电阻范围的高精度电流测量,并含有主要由绝缘材料4构成的两层基板。在第二个实施例中,印刷电路板1的下层结构与第一个实施例中的印刷电路板1大致匹配。精密电阻器2的尺寸和电阻值与第一个实施例不同,分别为:厚度300μm左右,宽度1400μm左右以及1毫欧姆。为测量这一电压,采用了不同配置的电压测量装置5,如下文所述。
印刷电路板1的下层11涂有一层覆盖精密电阻器2和连接点3的绝缘材料4。在印刷电路板1上层12的上侧或由优选厚度为100μm的绝缘材料4制成的上层,根据上述方法从优选厚度为18μm的铜箔上蚀刻出含有微孔51相关接线的用于测量电压的导体电路图。电压测量装置5实现了HDI(高密度互连)电路,其中通过由绝缘材料制成的上层的用于接触精密电阻器2的激光钻孔被并入。精密电阻器2通过这些钻孔,利用微孔51实现电连接。微孔51的间距被精确限定,从而通过放在二者之间的精密电阻器2的长度精确地测定电阻值。连接点52与微孔51之间的电流可以通过电压测量的方式计算,其中电压测量值与精确测定的电阻值有关。
本发明不限于上述实施例。根据导线或嵌入印刷电路板的模具的其它用途,优选与经过蚀刻的导电带组合,可能会出现本发明进一步有益的发展。这实现了电子元件在印刷电路板上的互连。
Claims (7)
1.至少设有两个连接点(3)和至少一个用于测量所述连接点(3)之间电流的精密电阻器(2)的印刷电路板(1),所述精密电阻器(2)在所述印刷电路板(1)的所述连接点(3)之间延伸,所述精密电阻器(2)配置为导线,所述精密电阻器(2)的下侧覆盖有绝缘材料(4),和/或所述精密电阻器(2)的至少一个边缘至少部分覆盖有绝缘材料(4);其特征是:所述精密电阻器(2)的上侧至少部分延伸并与邻层绝缘材料(4)的上侧齐平;所述精密电阻器(2)与连接点(3)焊接;所述连接点(3)的下侧接触所述精密电阻器(2)的上侧和绝缘材料(4)层的上侧,而所述连接点(3)的上侧既不接触所述精密电阻器(2)也不接触绝缘材料(4)层。
2.如权利要求1所述的印刷电路板(1),特征是:所述印刷电路板(1)包括至少一层绝缘材料(4)。
3.如权利要求1或2所述的印刷电路板(1),特征是:所述印刷电路板(1)上配置有电子电路和/或电力电子器件。
4.如权利要求1或2所述的印刷电路板(1),特征是:所述精密电阻器(2)符合以下至少一项要求:
a.所述精密电阻器(2)含有0.1至300毫欧姆的电阻值;
b.所述精密电阻器(2)含有小于±5%的偏差;
c.在20至60°C的温度之间,所述精密电阻器(2)的电阻温度系数范围为0.1ppm/K至200ppm/K;
d.所述精密电阻器(2)由金属制成;
e.所述精密电阻器(2)至少主要部分嵌入印刷电路板(1)中;
f.所述精密电阻器(2)的上侧应部分覆盖有绝缘材料(4);
g.所述印刷电路板(1)和所述精密电阻器(2)的上侧互相是对齐平行的;
h.所述精密电阻器(2)通过压铸工艺制造;
i.所述精密电阻器(2)被配置为扁平线的形式;
j.所述精密电阻器(2)大体上在一个平面中延伸;
k.所述精密电阻器(2)含有矩形横截面;
l.所述精密电阻器(2)的厚度范围是10至2000µm。
5.如权利要求1或2所述的印刷电路板(1),特征是:所述印刷电路板(1)包括符合以下至少一项要求的电压测量装置(5):
a.所述电压测量装置(5)适于测量所述连接点(3)之间的电压;
b.所述电压测量装置(5)实现了HDI(高密度互连)电路。
6.一种用于制造至少设有一个精密电阻器(2)的印刷电路板(1)的方法,所述精密电阻器(2)配置为导线,在印刷电路板(1)中延伸用于测量连接点(3)之间的电流,所述方法包括下列步骤:
a.将所述精密电阻器(2)焊接至所述连接点(3);
b.使用电气绝缘材料(4)覆盖所述精密电阻器(2)使所述精密电阻器(2)的下侧覆盖有绝缘材料(4),和/或所述精密电阻器(2)的至少一个边缘至少部分覆盖有绝缘材料(4),且所述精密电阻器(2)的上侧至少部分延伸并与邻层绝缘材料(4)的上侧齐平;
c.采用电气绝缘的方式,实现所述连接点(3)的互相隔离,从而使所述连接点(3)之间的电流流经所述精密电阻器(2),所述连接点(3)的下侧接触所述精密电阻器(2)的上侧和绝缘材料(4)层的上侧,而所述连接点(3)的上侧既不接触所述精密电阻器(2)也不接触绝缘材料(4)层。
7.如权利要求6所述的方法,特征是:至少包括下列一个步骤:
a.将由绝缘材料制成的预浸材料按压至所述精密电阻器(2);
b.通过在附在所述印刷电路板(1)表面的铜箔上蚀刻的方式制定所述连接点(3),其中铜箔蚀刻在将精密电阻器(2)连接至连接点(3)之后进行;
c.通过下列至少一个步骤制作电压测量装置(5):
i.所述精密电阻器(2)覆有至少一层绝缘材料(4);
ii.通过至少一层绝缘材料(4)形成一个用于连接所述精密电阻器(2)的钻孔;
iii.所述精密电阻器(2)通过至少一层绝缘材料(4)连接;
iv.电连接所述精密电阻器(2)。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004077904A1 (ja) * | 2003-01-17 | 2004-09-10 | Jsr Corporation | 回路基板の検査装置および回路基板の検査方法 |
CN102461359A (zh) * | 2009-06-03 | 2012-05-16 | 株式会社日立制作所 | 电子设备及噪声电流测量方法 |
EP2843405A3 (en) * | 2010-02-08 | 2015-04-29 | Genia Technologies Inc. | Systems and methods for manipulating a molecule in a nanopore |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2421688A (en) * | 1945-01-16 | 1947-06-03 | Sprague Electric Co | Noninductive resistance element |
US4771233A (en) * | 1987-01-29 | 1988-09-13 | Wayne Martin J | Printed curcuit board lead ammeter |
JPH03245486A (ja) | 1990-02-22 | 1991-11-01 | Matsushita Electric Ind Co Ltd | セラミックヒータ |
JP2989936B2 (ja) * | 1991-05-30 | 1999-12-13 | ティーディーケイ株式会社 | ガラスフリット、抵抗体ペーストおよび配線基板 |
JPH0992983A (ja) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
JP3443493B2 (ja) | 1995-11-22 | 2003-09-02 | 京セラ株式会社 | 液体加熱用セラミックヒータ |
JP2006140513A (ja) * | 1998-10-13 | 2006-06-01 | Murata Mfg Co Ltd | セラミック多層基板の製造方法 |
US7391620B2 (en) * | 2003-04-18 | 2008-06-24 | International Business Machines Corporation | System for improving power distribution current measurement on printed circuit boards |
US7319304B2 (en) | 2003-07-25 | 2008-01-15 | Midtronics, Inc. | Shunt connection to a PCB of an energy management system employed in an automotive vehicle |
US7663376B2 (en) * | 2007-08-06 | 2010-02-16 | Lear Corporation | Printed circuit board for sensing voltage drop |
DE102008059694A1 (de) | 2008-11-29 | 2010-06-02 | Daimler Ag | Anordnung aus Stromschieneneinrichtung und Leiterplatine |
DE202010005756U1 (de) * | 2010-03-02 | 2010-07-29 | Isabellenhütte Heusler Gmbh & Co. Kg | Elektronisches Bauelement, insbesondere Stromsensor |
JP5644945B2 (ja) | 2011-06-29 | 2014-12-24 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
-
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004077904A1 (ja) * | 2003-01-17 | 2004-09-10 | Jsr Corporation | 回路基板の検査装置および回路基板の検査方法 |
CN102461359A (zh) * | 2009-06-03 | 2012-05-16 | 株式会社日立制作所 | 电子设备及噪声电流测量方法 |
EP2843405A3 (en) * | 2010-02-08 | 2015-04-29 | Genia Technologies Inc. | Systems and methods for manipulating a molecule in a nanopore |
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