CN105704914A - 一种不同类型线路板的厚铜板及线路板的制作方法 - Google Patents
一种不同类型线路板的厚铜板及线路板的制作方法 Download PDFInfo
- Publication number
- CN105704914A CN105704914A CN201610258817.8A CN201610258817A CN105704914A CN 105704914 A CN105704914 A CN 105704914A CN 201610258817 A CN201610258817 A CN 201610258817A CN 105704914 A CN105704914 A CN 105704914A
- Authority
- CN
- China
- Prior art keywords
- thick copper
- wiring board
- copper coin
- gong
- copper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 109
- 239000010949 copper Substances 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 claims description 22
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 238000010923 batch production Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610258817.8A CN105704914B (zh) | 2016-04-25 | 2016-04-25 | 一种不同类型线路板的厚铜板及线路板的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610258817.8A CN105704914B (zh) | 2016-04-25 | 2016-04-25 | 一种不同类型线路板的厚铜板及线路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105704914A true CN105704914A (zh) | 2016-06-22 |
CN105704914B CN105704914B (zh) | 2019-02-22 |
Family
ID=56216521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610258817.8A Active CN105704914B (zh) | 2016-04-25 | 2016-04-25 | 一种不同类型线路板的厚铜板及线路板的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105704914B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106413265A (zh) * | 2016-11-23 | 2017-02-15 | 胜宏科技(惠州)股份有限公司 | 一种新能源汽车电池专用线路板生产工艺 |
CN108990262A (zh) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | 双面厚铜线路板的制作工艺 |
CN109803496A (zh) * | 2018-12-17 | 2019-05-24 | 智恩电子(大亚湾)有限公司 | 一种高密度多层线路板成型加工方法 |
CN110896592A (zh) * | 2018-09-12 | 2020-03-20 | 胜宏科技(惠州)股份有限公司 | 一种3d转接式pcb板及其制作方法 |
CN111465198A (zh) * | 2020-05-26 | 2020-07-28 | 胜宏科技(惠州)股份有限公司 | 一种改善线路板翘板的制作方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020106577A1 (en) * | 2000-11-30 | 2002-08-08 | Murata Manufacturing Co., Ltd. | Photosensitive copper paste and method of forming copper pattern using the same |
CN201608973U (zh) * | 2010-01-22 | 2010-10-13 | 深圳市牧泰莱电路技术有限公司 | 一种厚铜pcb板件 |
CN103068165A (zh) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Pcb板外形边镀层制作工艺 |
CN104168713A (zh) * | 2013-05-20 | 2014-11-26 | 北大方正集团有限公司 | 印制线路板的锣板方法 |
CN205142653U (zh) * | 2015-10-29 | 2016-04-06 | 景旺电子科技(龙川)有限公司 | 一种便于锣板的pcb板 |
CN205566798U (zh) * | 2016-04-25 | 2016-09-07 | 胜宏科技(惠州)股份有限公司 | 一种不同类型线路板的厚铜板 |
-
2016
- 2016-04-25 CN CN201610258817.8A patent/CN105704914B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020106577A1 (en) * | 2000-11-30 | 2002-08-08 | Murata Manufacturing Co., Ltd. | Photosensitive copper paste and method of forming copper pattern using the same |
CN201608973U (zh) * | 2010-01-22 | 2010-10-13 | 深圳市牧泰莱电路技术有限公司 | 一种厚铜pcb板件 |
CN103068165A (zh) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Pcb板外形边镀层制作工艺 |
CN104168713A (zh) * | 2013-05-20 | 2014-11-26 | 北大方正集团有限公司 | 印制线路板的锣板方法 |
CN205142653U (zh) * | 2015-10-29 | 2016-04-06 | 景旺电子科技(龙川)有限公司 | 一种便于锣板的pcb板 |
CN205566798U (zh) * | 2016-04-25 | 2016-09-07 | 胜宏科技(惠州)股份有限公司 | 一种不同类型线路板的厚铜板 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106413265A (zh) * | 2016-11-23 | 2017-02-15 | 胜宏科技(惠州)股份有限公司 | 一种新能源汽车电池专用线路板生产工艺 |
CN108990262A (zh) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | 双面厚铜线路板的制作工艺 |
CN108990262B (zh) * | 2018-03-20 | 2021-07-09 | 东莞市若美电子科技有限公司 | 双面厚铜线路板的制作工艺 |
CN110896592A (zh) * | 2018-09-12 | 2020-03-20 | 胜宏科技(惠州)股份有限公司 | 一种3d转接式pcb板及其制作方法 |
CN109803496A (zh) * | 2018-12-17 | 2019-05-24 | 智恩电子(大亚湾)有限公司 | 一种高密度多层线路板成型加工方法 |
CN111465198A (zh) * | 2020-05-26 | 2020-07-28 | 胜宏科技(惠州)股份有限公司 | 一种改善线路板翘板的制作方法 |
CN111465198B (zh) * | 2020-05-26 | 2021-07-02 | 胜宏科技(惠州)股份有限公司 | 一种改善线路板翘板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105704914B (zh) | 2019-02-22 |
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TR01 | Transfer of patent right |
Effective date of registration: 20210223 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20231121 Address after: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee after: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee before: Nantong Shenghong Technology Co.,Ltd. |
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TR01 | Transfer of patent right |