CN105612619B - 成像器件、制造装置、制造方法以及电子装置 - Google Patents

成像器件、制造装置、制造方法以及电子装置 Download PDF

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Publication number
CN105612619B
CN105612619B CN201480050326.3A CN201480050326A CN105612619B CN 105612619 B CN105612619 B CN 105612619B CN 201480050326 A CN201480050326 A CN 201480050326A CN 105612619 B CN105612619 B CN 105612619B
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Expired - Fee Related
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CN201480050326.3A
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English (en)
Chinese (zh)
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CN105612619A (zh
Inventor
户田淳
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Sony Semiconductor Solutions Corp
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Sony Corp
Sony Semiconductor Solutions Corp
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G02B3/14—Fluid-filled or evacuated lenses of variable focal length
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B2003/0093—Simple or compound lenses characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00—Details of colour television systems
    • H04N2209/04—Picture signal generators
    • H04N2209/041—Picture signal generators using solid-state devices
    • H04N2209/042—Picture signal generators using solid-state devices having a single pick-up sensor
    • H04N2209/047—Picture signal generators using solid-state devices having a single pick-up sensor using multispectral pick-up elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
CN201480050326.3A 2013-09-18 2014-09-10 成像器件、制造装置、制造方法以及电子装置 Expired - Fee Related CN105612619B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-193376 2013-09-18
JP2013193376A JP6163398B2 (ja) 2013-09-18 2013-09-18 撮像素子、製造装置、製造方法
PCT/JP2014/004647 WO2015040825A2 (en) 2013-09-18 2014-09-10 Imaging device, manufacturing apparatus, manufacturing method, and electronic apparatus

Publications (2)

Publication Number Publication Date
CN105612619A CN105612619A (zh) 2016-05-25
CN105612619B true CN105612619B (zh) 2019-09-13

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CN201480050326.3A Expired - Fee Related CN105612619B (zh) 2013-09-18 2014-09-10 成像器件、制造装置、制造方法以及电子装置

Country Status (5)

Country Link
US (1) US10401619B2 (enExample)
JP (1) JP6163398B2 (enExample)
KR (1) KR102310376B1 (enExample)
CN (1) CN105612619B (enExample)
WO (1) WO2015040825A2 (enExample)

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JP6918409B2 (ja) * 2017-01-26 2021-08-11 ソニーセミコンダクタソリューションズ株式会社 カメラモジュールおよびその製造方法、並びに電子機器
JP2018200980A (ja) 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置および固体撮像素子、並びに電子機器
JP2018200423A (ja) 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
JP7146376B2 (ja) 2017-08-31 2022-10-04 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
JP2019213151A (ja) 2018-06-08 2019-12-12 ソニーセミコンダクタソリューションズ株式会社 撮像装置
CN112236703B (zh) 2018-06-08 2024-01-16 索尼半导体解决方案公司 摄像装置
CN112204446A (zh) 2018-06-08 2021-01-08 索尼半导体解决方案公司 成像装置
DE112019002889B4 (de) 2018-06-08 2024-05-23 Sony Semiconductor Solutions Corporation Bildgebungsvorrichtung
DE112019002902T5 (de) 2018-06-08 2021-04-08 Sony Semiconductor Solutions Corporation Bildgebungsvorrichtung
JP2020068302A (ja) 2018-10-24 2020-04-30 ソニーセミコンダクタソリューションズ株式会社 撮像装置
US12189085B2 (en) 2019-06-06 2025-01-07 Sony Semiconductor Solutions Corporation Imaging device
CN110365886A (zh) * 2019-08-01 2019-10-22 珠海格力电器股份有限公司 一种光学防抖摄像头模组
US12107103B2 (en) 2019-11-13 2024-10-01 Sony Semiconductor Solutions Corporation Imaging apparatus and electronic equipment for peeling off prevention in lens
KR102813299B1 (ko) * 2019-12-24 2025-05-28 삼성전자주식회사 이미지 장치 및 이미지 센싱 방법
JP7781739B2 (ja) * 2020-02-20 2025-12-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置、電子機器

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JP2007184322A (ja) * 2006-01-04 2007-07-19 Sony Corp 固体撮像装置およびその製造方法、並びにカメラ
CN101997014A (zh) * 2009-08-10 2011-03-30 索尼公司 固体摄像器件及其制造方法和摄像装置
US20120228481A1 (en) * 2011-03-11 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Lens sheet and photoelectric conversion module

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KR100477784B1 (ko) * 2000-08-31 2005-03-22 매그나칩 반도체 유한회사 트렌치 내부의 공기로 이루어지는 집광층을 구비하는이미지 센서 및 그 제조 방법
JP4776181B2 (ja) 2004-06-02 2011-09-21 三菱電機株式会社 照明制御装置、照明装置、照明制御システム及び照明システム
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US20120228481A1 (en) * 2011-03-11 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Lens sheet and photoelectric conversion module

Also Published As

Publication number Publication date
CN105612619A (zh) 2016-05-25
KR102310376B1 (ko) 2021-10-08
JP6163398B2 (ja) 2017-07-12
US10401619B2 (en) 2019-09-03
WO2015040825A2 (en) 2015-03-26
US20160202475A1 (en) 2016-07-14
KR20160058779A (ko) 2016-05-25
WO2015040825A3 (en) 2015-05-21
JP2015061193A (ja) 2015-03-30

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Address after: Japan's Asahi Atsugi city Kanagawa County town of 4-14-1

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